Page 1 Notice: For RO to input specific “Legal Requirement” in specific NS regarding to responsibility and liability statements. Please check BenQ’s eSupport web site, http://esupport.benq.com, to ensure that you have the most recent version of this manual. First Edition (August, 2006)
Page 2: Table Of Contents
Content Index ABBREVIATIONS & ACRONYMS ............................3 ABOUT THIS MANUAL................................4 INTRODUCTION..................................5 RELATED SERVICE INFORMATION ............................7 PRODUCT OVERVIEW ................................8 ..................................8 PECIFICATIONS ....................................43 ACKING ..............................45 USTOMER CCEPTANCE DISASSEMBLY/ASSEMBLY..............................61 .................................. 61 XPLODED ..............................64 ISASSEMBLY SSEMBLY LEVEL 1 COSMETIC / APPEARANCE / ALIGNMENT SERVICE..................64 ..................................
Page 3: Abbreviations & Acronyms
Abbreviations & Acronyms Analog to Digital BenQ BenQ Corporation Digital Light Processing Digital Micromirror Device Digital Video Interface DVI-I Digital Video Interface-Integrated Pond of Mirrors RS232 Interface Between Data Terminal Equipment and Data Communications Equipment Employing Serial Binary Data Interchange SVGA Super Video Graphics Array.
Page 4: About This Manual
About This Manual This manual contains information about maintenance and service of BenQ products. Use this manual to perform diagnostics tests, troubleshoot problems, and align the BenQ product. Important Only trained service personnel who are familiar with this BenQ Product shall perform service or maintenance to it.
Page 5: Introduction
Introduction This section contains general service information, please read through carefully. It should be stored for easy access place. Important Service Information RoHS (2002/95/EC) Requirements – Applied to all countries require RoHS. The RoHS (Restriction of Hazardous Substance in Electrical and Electronic Equipment Directive) is a legal requirement by EU (European Union) for the global electronics industry which sold in EU and some counties also require this requirement.
Page 6 Compliance Statement Caution: This Optical Storage Product contains a Laser device. Refer to the product specifications and your local Laser Safety Compliance Requirements.
Page 7: Related Service Information
This Service Manual contains general information. There are 3 levels of service: Level 1: Cosmetic / Appearance / Alignment Service Level 2: Circuit Board or Standard Parts Replacement Level 3: Component Repair to Circuit Boards Related Service Information BenQ Global Service Website:http://support.benq.com/front/benqmain.asp eSupport Website:http://bqpgsr.benq.corp.com/customize/asplogin.asp...
Page 8: Product Overview
Specifications Tested under 60” (diagonal) image size with Wide projection lens position unless other specified. Measurement Details refer to 1.0 Optical Performance Appendix A. Reference meter : BENQ Factory T10 meter (SN:M040000850) 1.1 ANSI Brightness Minimum 1920 Lumens 1.2 Brightness Uniformity 1.2.1 ANSI Uniformity...
Page 9 2.1 Throw Ratio 54”±5% Diagonal at 2m, Wide 2.2 Zoom Ratio (tolerance > 1.10 : 1 applied) 2.3 Distortion 2.3.1 Keystone Distortion <1.0% 2.3.2 Vertical TV Distortion <1.0% 2.3.3 Screen distorsion l W2-W1 l <6mm , l H2 –H1 l <6 mm 2.4 Projection Offset 120% ±5% 2.5 Focus Range...
Page 10 3.0 Mechanical Specification 3.1 Dimensions 278 x 219.5 x 94 mm (L x W x H) 3.2 Weight 2500g ± 100g 3.3 Security Slot Kensington compatible slot 150N break away force 3.5 Lens Cover Detached Lens Cover Fast adjustable foot in front, Adjustable foot and Fixed foot in 3.6 Feet rear.
Page 11 FCC Class B requirements, C-Tick, VCCI, MIC 7.0 Regulatory Directive 73/23/EEC; Marks Directive 89/336/EEC BENQ ESD Specification 8.0 Reliability 8.1 MTBF 20000 hours except DMD chip, Color wheel, Lamp and Fan Normal : 1500 hours (50% brightness maintenance) 8.2 Lamp Lifetime Eco: 2500 hours 9.0 Power Requirements...
Page 12 9.3 Power Connector IEC-06 10.0 Panel Specification 10.1 Type Single Chip 0.55” SVGA 12° tilt DDR DMD 10.2 Pixels H: 800 X V: 600 10.3 Color Depth 24 Bits (16770000 colors) 11.0 Compatibility Appendix E3 PC Compatible 640X480 1024X768, compressed 1280X1024; 11.1 PC Composite-Sync;...
Page 13 3 LEDs: 14.2 Indicators Power On/Off Status; Lamp Status; Temperature Status vertical keystone and adjustable range ±7° 14.3 Electric Keystone 15.0 Audio Φ3.5mm stereo mini jack 15.1 Audio Input 350mVrms 10 KΩ or more 15.2 Speaker 8Ω 2W X 1 Appendix A Optical Measurement 1.
Page 14 W: width of projected image (m) H: height of projected image (m) Note: L10, L11, L12, L13 are located at 10% of the distance from corner itself to L5 A2. ANSI UNIFORMITY ANSI +Uniformity= [Maximum (L1~13)-Average (L1~9)]/ Average (L1~9)% ANSI -Uniformity= [Minimum (L1~13)-Average (L1~9)]/ Average (L1~9)% A3.
Page 15 A6. JBMA CONTRAST JBMA Contrast = Average (L1,L2,L3,L4,L5,L6,L7,L8,L9) under solid white / Average (L1,L2,L3,L4,L5,L6,L7,L8,L9) under solid black A7. LIGHT LEAKAGE Leakage = The maximum light leakage under a solid black pattern in or outside of the projected image A8. IMAGE DISTORTION Keystone = (W2-W1)/ (W1+W2) x 100% Vertical TV dist = (H1+H2-2xH3)/2H2 x100% Horizontal TV dist = (W1+W2-2xW3)/2W1 x100%...
Page 16 A11. FOCUS RANGE The minimum/maximum focus distance is the minimum/maximum projection distance (The distance between the outermost element of projection lens and screen), expressed in meter, at which the image is still at its acceptable focus level.(acceptable focus level is specified by FOCUS LIMIT SAMPLE approved by customer) A12.
Page 17 Grid of 1.5 1 Pixel pixels Flare Defocus 1.5 pixels A18. Lateral Color Test Procedure Procedure: Step 1: Get best focus at Screen Center with Pattern 1 Step 2: Check specified screen sizes and zoom positions Step 3: Use Chart1 to measure Lateral Color for whole screen with Pattern 5 and record the maximum number Example if 0.6 pixel lateral color: Center of G...
Page 18 Pattern 1 (Please contact BenQ RD for file with correct resolution) Pattern 2 (Please contact BenQ RD for file with correct resolution)
Page 19 Pattern 3 (Please contact BenQ RD for file with correct resolution) Pattern 4 (Please contact BenQ RD for file with correct resolution) Pattern 5 (Please contact BenQ RD for file with correct resolution)
Page 20 Chart 1 Example of Pixel Testing Pattern (60” screen size) (Please contact BenQ RD for file with correct size)
Page 21 A20. Definition of “Slight flare” Slight flare is observed with following steps: 1. Slight flare is measured with the “Line” in pattern “Cross hatch with dots” A slight flare is defined as flare with very faint brightness compares to “Normal Flare” in “Line”. Please refer to the drawing below: Pixel “Normal”...
Page 22 Appendix B Design Verification Test Procedure B1. Purpose This standard establishes the environmental specification for projector related products, which defines the level of product performance and reliability in the field. It is not necessary the intent of these specification to simulate a typical user environment, but rather to provide for a level of product robustness that when applied over a wide range of manufacturing variability and environmental usage conditions, which is recommended for product assurance testing reference.
Page 23 vibration should be done first. Un-package Vibration Sine-wave, 5~200Hz, 1.5G, all primary axis, one sweep (5 minutes) (Non-operating) per orientation, total of 15 min. Un-package Shock Waveform: Half sine (Non-operating) Faces: 6 sides/per orientation, 3 shocks Duration: < 20 ms Velocity accelerate: 50 G Bench Drop 1.
Page 24 30 @0~12,200m above sea level ℃ Start Turn On @ 0 and 40 , AC90~264V, 47~63Hz ℃ ℃ B2.3 Regulatory Test condition: FCC part 15J class B, EN55022 class B, under 3 dBuv 1. Air discharge to set surface: 15KV 2.
Page 25 B4. Test Sequence Atmospherics, Dynamic, and Regulatory test sets require separate units and can be processed in parallel. EUT testing shall be performed serially within each set. Set 1 (2 units) Set 2 (2 units) Set 3 Dynamics: Atmospherics: Safety/EMC: Temperature / Humidity, Package Vibration Operating...
Page 26 Appendix C Thermal and Noise Test Procedure Ⅰ、Noise Testing Standard Based on *B Shown as follows, (1) Desk high: 75 cm (2) Projector Position: On the edge of desk (3) Microphone Position: Distance from projector 100cm; Height 150 cm; Title 30 degree (4) Measured four surfaces and calculated the noise value by log average.
Page 27 We defined maximum temperature and measurement position as following： Spec. Maximum Area Define metal℃ plastic℃ Maybe touch All surface Touch for short Key pad, Adjustment foot/lens, side surface period only Bottom Lamp cover Outlet Mesh surface...
Page 28 Appendix D DMD Image Quality SCOPE This document specifies the image quality requirements applicable to the DLP .7XGA Value Component Set. The Component Set provides the DLP .7XGA Value Projector with digital imaging functionality based on Digital Micromirror Device (DMD) technology. Definitions Blemish A blemish is an obstruction, reflection, or refraction of light that is visible, but out of...
Page 29 Pond of mirrors (POM) POM is a rectangular array of off-state mirrors surrounding the active area. Eyecatcher Eyecatcher's are blemishes appearing in the area outside of the Active Area. These are due to particles and various DMD window or window aperture “defects” including: digs, voids, and scratches.
Page 30 level on the test screen image. 2.11 Gray 10 Screen The Gray 10 screen is used to test for major light blemishes. All areas of the screen are colored a Microsoft Paintbrush gray 10 (green, red, and blue set at 10). NOTE: If linear degamma is not used then the Microsoft Paintbrush values must be adjusted to match the degamma table being used in order to generate an equivalent gray level on the test screen image.
Page 31 2. No blemish will be > 1” long/diameter Major Light Blemish Gray 10 1. ≦　4 visible light blemishes are allowed in the active area 2. No blemish will be > 1” long/diameter Reset Boundary Gray 30 1. No reset boundary artifacts allowed Artifact Eyecatchers Border Any screen...
Page 32 Figure 1. Major Blemish Two Zone Screen Non Critical Zone Critical Zone center 25%...
Page 33 Appendix E Electrical Specification 1. Timing Table The Default timing is as following: Refresh rate H-frequency Clock Resolution Mode (Hz) (kHz) (MHz) 720 x 400 720x400_70 70.087 31.469 28.3221 VGA_60 59.940 31.469 25.175 VGA_72 72.809 37.861 31.500 640 x 480 VGA_75 75.000 37.500...
Page 34 Signal format fh(kHz) fv(Hz) 480i(525i)@60Hz 15.73 59.94 480p(525p)@60Hz 31.47 59.94 576i(625i)@50Hz 15.63 50.00 576p(625p)@50Hz 31.25 50.00 720p(750p)@60Hz 45.00 60.00 720p(750p)@50Hz 37.50 50.00 1080i(1125i)@60Hz 33.75 60.00 1080i(1125i)@50Hz 28.13 50.00 Video, S-Video support timing is as following: Video mode fh(kHz) fv(Hz) fsc(MHz) NTSC 15.73 3.58...
Page 35 2. Characteristics of inputs/outputs Signal Parameter Type RDATA Impedance GDATA Amplitude Volts peak-to-peak BDATA Black pedestal Volts Pixel Clock M Hz GDATA_SOG Impedance Amplitude Volts peak-to-peak Video amplitude Volts peak-to-peak Sync amplitude Volts peak-to-peak Black pedestal Volts Pixel Clock M Hz HDATA Impedance K ohm...
Page 36 S/N Ratio Total Harmonic Distortion 3. Electrical Interface Character Interface Definition 15 pin definition of the mini D-sub male for DDC2B protocol Definition Definitio Definiti Definition Red video Green Blue Video Video Red Video Green Blue Video Return Video Return Return Monitor Bi-direction...
Page 37 Definition Composite video input • S-Video input Description Luminance Chroma • Control Port Description Description...
Page 38 Local Keyboard Description (Detailed description refer to SW Specification) Key Name Detailed Description Power Use this button to turn your Data Projector on and off (standby mode). Source To select input sources as Computer, Video, S-Video, YpbPr Auto Toggle auto-tracking image function Blank/Q? Press “Blank”...
Page 39 External Status indicator LED Name Detailed Description Power LED Display the power on/off sequence status Lamp Status LED Display the Lamp status (Lamp fail, Lamp spoil etc.) Temperature Status LED Display the Thermal status (Fan Fail, Over Temperature, etc.) 4. Functionality The Following functionality will be supported: (Detailed description refer to SW Specification) Functionality Data (Computer)
Page 40 Freeze Blank Lamp Reset OSD Timer Source Scan Keystone Hold Mirror Hold Blank Time Information Reset External Message indicator (Detailed description refer to SW Specification) Message Occasion PC/Composite Video /S-Video /Analog YPbPr The system does not detect the signal Searching Out of range The signal is over the specification Lamp Warning! The Power Will Turn Off After 4000...
Page 41 Appendix F Power Supply Specification 1. Input Power Specification Specification Description Input Voltage Range The unit shall meet all the operating requirements with the range 100 ~ 240 VAC Frequency Range The unit shall meet all the operating requirements with an input frequency range 50 Hz ~ 60 Hz Power Consumption Normal operation: 285 W (Max)
Page 42 4. Others Item Description Active high after 5 Volt reach 95% of its rating and goes to logic low at Power least 0.5ms before power falls to 90% of its rating good signal High voltage and high To avoid user from the dangerous of HV and high temperature, when temperature protection front door of lamp case is opened whether intentionally or accidentally, the power should be disconnected immediately.
Page 43: P Acking
Packing...
Page 45: C Ustomer A Cceptance
Customer Acceptance 5.3.1. SCOPE This document establishes the general workmanship standards and functional acceptance criteria for PROJECTOR produced by BENQ. 5.3.2. PURPOSE The purpose of this publication is to define a procedure for inspection of the PROJECTOR by means of a customer acceptance test, the method of evaluation of defects and rules for specifying acceptance levels.
Page 46 Note: If BenQ defect undefined failure, and it judged that is reduce the merchandisebility, BenQ CM Inform this defect. After that parties make communication and decide how to solve. 5.3.6. EXPRESSION OF DEFECTIVES Number of defects Percent of defects = ------------------------------------------ X 100% Number of products inspected 5.3.7.
Page 47 5) The evaluation must be within the limits of the product specification and, for not specified characteristics, refer to the sample machine or the judgment of BENQ QA Engineer. But any kind of proposals or judgments must be reasonable and acceptable by both sides.
Page 48 B-side: Side - right/left sides surfaces Back cover - Back cover surfaces C-side: Low cause - bottom surfaces ~For spot inspection distance is 45 cm on A/B/C-side. And inspection time is 10~15 sec. ~For scratch inspection distance is 45 cm on A/B/C-side. And inspection time is 10~15 sec.
Page 49 Chart 1 5.3.11.1.1.1.3. Inspection interval (time) Inspection interval is a function of surface area. Time for visual inspection: 10sec. Parts Size “A” surface “B” surface “C” surface Time 10 sec 10 sec 10 sec Chart 2 TABLE 1. (General Product of plastic outlook of dot, blemish, and others spec inspection standard) A surface B surface...
Page 50 1. Use the 20*20 criteria to the area less than 20*20; 50*50 inspection criteria to the area 20*20≦A<50*50; etc. (Particle/Blemish/Color Spot) 1.1 Definition of surface A, B, C refer to 6.2 1.2 Blemish around the logo must be equal or smaller than 0.05 mm 1.3 Bubble on the surface is to be reject.
Page 51 W < 0.2mm , L < 3mm Only 3 this kind of scratch is accepted W < 0.2mm , L < 3-5mm Only 2 this kind of scratch is accepted Note: Severe scratch which disclose the Natural Each scratch should be 5cm more far away from each other...
Page 52 1.1 Gap (refer to C321 document) ITEMS Specification Cap between UC and LC； Gap ≦ 0.5mm，step 0.3mm ≦ step between UC and LC Cap between Autio and RC Gap ≦ 0.5mm Cap between UC and upper side of RC 0.2(+0.3/-0.2)mm Cap between UC and both sides of RC 0.1(+0.3/-0.1)mm Cap between Video and RC...
Page 53 Strange objects in the box. Major 1.3 Accessories Item Description Class Missing accessory parts Major Wrong Accessory parts Major 1.4 Appearance on visible parts Item Description Class Damage or deviation when viewed at a distance of 50 cm. Minor Cover/case is dirty. (Removable). Minor Cover/case exists black spot.
Page 54 Use Non-QVL ( Qualify vendor list )component Major Wrong parts, broken component, but safe Major Foreign material Conductive (Has potential to short circuit) Critical Non-conductive (Moveable) Major Missing hardware, component or screw, stripped screw Major Loose hardware/screw or insufficient torque Major Poor wire routing, which is no concerned on EMI Minor...
Page 55 Full Blue Impurity、CIE coordinate Chromo Focus Range 800x600 Color and Gray Check COLORS General-1 Performance/ Timing check/ function check pattern 256/32/16 Gray Check Gray Check the DDC information, DDC check Including S/N, model, manufacturer name, product code. 5.3.12.2. TEST CONTENT: Test Condition TEST ITEM Input...
Page 56 At random PC sound check Audio CD-ROM Test Condition TEST ITEM Input Equipment HDTV NTSC (480i)/ 480p/ PAL (625i)/ Picture performance YPbPr Chroma / BS 720p, HDTV (1080i) Tuner Picture quality Video NTSC disk Output = NTSC 3.58MHz/ 60Hz S-video DVD player picture Picture quality...
Page 57 54”±5% Diagonal @ 2M Contrast: Preset Throw Ratio Full white (Wide) Brightness: Preset Contrast: Preset Zoom Ratio >1.10:1 Full white Brightness: Preset (W2-W1) / (W1+W2) Contrast: Preset Keystone Distortion Full white <1.0% Brightness: Preset (H1+H2-2×H3)/2H2 Contrast: Preset Vertical TV Distortion Full white <1.0% Brightness: Preset...
Page 58 Description Class Noise When power on or power off, fan or color wheel get abnormal noise. Major When normal operation, noise exceed noise level (refer to C201 document) Major Display Quality (include input: Video, S-video, YPbPr, and D-sub or RGB) Focus range out of specification Major Focus fail (focus not clear or flare/ defocus/ lateral color out of specification)
Page 59 5.3.13. PART III INSPECTION CRITERIA 5.3.13.1. IMAGE QUALITY SPECIFICATION: SEQ # TEST SCREEN ACCEPTANCE CRITERIA Major Dark Two Zone Blue 1. No blemish will be darker than Microsoft Blue 60 in the critical Blemish zone ≦2 blemish in the Non-critical zone No blemish will be ＞...
Page 60 5.3.13.2. APPEARANCE INSPECTION SPECIFICATION: Judge area Judge item Inspection specification Judge criterion Major Minor A/B/C side Spot, Scratch, Refer to Part I 1.Appearance Inspection Criteria ○ Gap, Color variance ○ Carton Broken No allow ○ Deformed ○ Print mistake ○ Cushion ○...
Page 61: Disassembly/Assembly
Disassembly/Assembly Exploded View...
Page 64: D Isassembly / A Ssembly
Disassembly / Assembly...
Page 68: Level 1 Cosmetic / Appearance / Alignment Service
Level 1 Cosmetic / Appearance / Alignment Service Appearance...
Page 72: S Oftware /F Irmware U Pgrade P Rocess
Software/Firmware Upgrade Process How to Download and How to enter Factory mode How to download Hardware required Standard USB Download cable (P/N 50.73213.501) Personal computer or laptop computer Software required DDP2000 Composer lite New version FW DDP2000 Composer lite install procedure Installation Location The default installation directory is: C:\Program Files\DLP Composer Lite...
Page 73 USB Support - Win98/WinMe Only Installation on Windows 98 or Windows Me may prompt "Please insert the disk labeled 'DLP Composer Installation Directory', and then click OK". This message may be safely ignored by clicking the OK button. Another prompt will then appear: "The file 'windrvr6.sys' on DLP Composer Installation Directory cannot be found".
Page 74 Download procedure Click on Flash Loader and browse the image file (new version firmware) Make sure to check “Skip Boot loader area (load all but the first 16KB)” Plug power cord into projector Press “UP+SOURCE+AUTO” simultaneously on keypad, the projector LAMP LED would lite Plug in USB cable between computer and projector side Press start download to begin update new firmware...
Page 75 Wait till composer lit notice upgrade completed Download is completed. The factory settings should be restored. How to enter Factory mode Press “up key” until lamp information appear. Press “Source key” and “Blank key”simultaneously , then enter the Factory area.
Page 76: A Djustment / A Lignment P Rocedure
Adjustment / Alignment Procedure 1. DMD Bias Voltage Alignment Equipment: -None Procedure: Watch DMD chip Label (Example: 9477000 0234B) Switch the DIP switch on DMD board according to the red character on the DMD chip 2. Color Wheel Delay Alignment Equipment: -Battery Biased Silicon PIN Detector -Oscilloscope (Vertical scale set to 10mV) -Probe Procedure: Probe impedance matches 50 ohm...
Page 77 Open Factory OSD, and select color wheel delay item Leave the image pure blue (DMD blue curtain) Put the detector on the screen that blue image was projected. Watch the oscilloscope and notice the square waveform Use the “　” and “　” key to increment or decrement the color wheel delay value No matter the waveform is square or not, let the waveform was lagged first.(see picture 1) Then increment or decrement the value to let the waveform just to be square.(see picture 2) 3.sRGB Mode alignment procedure,Overfill adjustment And Burn-In setting...
Page 78 Overfill adjustment As the picture below, adjust light pipe to keep overfill image center.
Page 79 Burn-In setting Burn-In On Minute Burn-In Off Minute 4. Formatter board check procedure Equipment: -Pattern...
Page 80 generator Procedure: Connect power, D-sub, into projector. Light on projector. 3. Testing below patterns and resolution is 1024*768@60Hz (XGA); 800*600@60Hz (SVGA) (1) General-1 pattern. (Pattern 1) (2) 32 grays pattern. (Pattern 48) (3) White pattern. (Pattern 41) (4) SMPTE pattern. (Pattern 5) The formatter board would be note fail if above three image-quality is not good.
Page 81 6. Optical Engine Assembly Procedure 1. Assembly Lamp module: 1.1 Baffle Lamp , Fin and Mesh Assembly I. Assemble “Baffle lamp” with Lamp holder and alight screw holes with holder first. (Figure 1-1)。 II. Assemble “assembly of Fin_Mesh” on Baffle first and fasten the screw (Figure 1-2) 。 III.
Page 82 Figure 1-3 Figure 1-4 1.2 Front Glass Assembly. i. Front Glass UV coated surface (marked) must face to Lamp. (Figure 1-5) ii. F/G must be placed on datum surfaces well. (Figure 1-6) iii. To make sure F/G Clip hooked well with Lamp Sleeve. (Figure 1-7)
Page 83 1.3 Lamp Assembly. i. Insert Lamp into Lamp Holder and make three datum contact with the lamp (Figure1-8) ii. Hook “Clip_UP” on the Lamp Holder first. (Figure 1-9) iii.Hook “Clip_DOWN” on the Lamp Holder second. (Figure 1-10) iv. Check assembly again and make sure the three datum contact with the lamp. v.
Page 85 1.4 Lamp Wire Arrangement The Lamp Wire arrangement have to look like the picture as blow (Figure 1-12&13 )。 I. The under wire go through the wire saddle directly II. The upper Wire have to detour the wall of Lamp_Plate first then go through wire saddle Figure1-13...
Page 86 2. BKT LINK Lamp and CW Shield Assembly Insert CW Shield to BKT LINK Lamp and fasten screw (Figure 2-1,2-2) Figure 2-1 Figure 2-2 3.Assembly CW Module 2.1 CW Module Assembly Sequence as blow (Fig3-1): (1) BKT CW (2) Damper CW (3)CW (4) Fixed screw (5) CVR CW (6) M2 Screw (7)Sensor Board (8)M2 Screw...
Page 87 Fig3-1 Fig3-2 4. Assembly LP Module 4.1 LP must datum well with “BKT_LP” show as Figure 4-1 4.2 Referring to Figure 4-2,there must be visible clearance between “BKT_LP” and ”LP opening” after assembly。...
Page 88 4.3 Glue “LP” and “BKT_LP” with “”UV5503 Glue” at two opening of “BKT_LP” show in Figure 4-3。 4.4 UV-5503 Glue curing process and concerns: vii. The UV-glue must fill up the whole opening area (shown in Figure 4-3) to contact well with LP surfaces and BKT_LP.
Page 89 ( Figure 4-9)。 v. Assembly “Baffle_LP” second ( Figure 4-8)and make sure it hooks HSG DMD well。 ~ Assembly Criteria was shown in Figure 4-8-2. vi. Push two hook places to make sure that Baffle_LP touches “BKT_LP “well, don’t push the middle place of “Baffle_LP”。...
Page 90 Figure 4-6 Figure 4-9...
Page 93 5. Assembly HSG ILL Module 5.1 FM1 Assembly I. FM1 must be placed on datum surfaces well and breach of FM1 must be face to inside( Fig 5-1)。 II. Insert the” CLIP of FM1” into the hole on the HSG ILL and make sure ” CLIP of FM1” hook on the HSG ILL well ( Fig 5-2)。...
Page 94 V. To check and make sure “ CLIP of CM” hook the HSG ILL very Well ( Fig 5-5)。 Fig 5-1 Fig 5-2 Fig 5-3 Fig 5-4...
Page 95 Fig 5-5 6. AL , HSG ILL and HSG DMD Assembly: 6.1 Placed “AL” on the HSG DMD .The “raised surface” of “AL” shall toward “DMD direction” (Fig 6-1) 6.2 Assemble ” HSG ILL Module” to HSG DMD and cover over on “AL”(Fig 6-2) Figure 6-1 Figure 6-2 7.
Page 96 7.1.Assemly Baffle_DMD: I. There are two breach on the Baffle_DMD. One is “circle” and the other is “Long hole” (Fig 7-1) II. The circle of Baffle_DMD have to match with the circle on HSG DMD and the Long hole is the same(Fig 7-2) 7.2 As shown in Figure 6-3: i.
Page 97 Figure 7-3 8. PL Module Assembly Assemble PL to HSG DMD and fasten screw to fix PL first (Fig 8-1) 。 Assemble “Ring Zoom” second and fasten screw (Fig 8-2) 。 Insert “Ring Focus” third(Fig 8-3) 。 Figure 8-1...
Page 98 Figure8-3 9. OPTICAL ENGINE Assembly I. Assemble CW Module to HSG DMD (Figure9-1 ,9-2) II. Assemble BKT Link Lamp, Shield CW to HSG DMD and fasten the screw (Figure9-3 ,9-4) III. Assemble Lamp Module to HSG DMD (Figure9-5 ,9-6) Figure9-1 , Figure 9-2...
Page 99 BKT Link Lamp Shield CW Figure9-3 , Figure9-4 ,...
Page 100 Figure9-6 7. PC Alignment Procedure Equipment: -Pattern generator (Chroma-2250) OSD Default value: Item Value Cal R Offset Cal G Offset Cal B Offset Cal R Gain Cal G Gain Cal B Gain YPbPr R Offset YPbPr B Offset AutoKeystone Cal TiltRatio Flat TiltRatio Flat...
Page 101 Procedure: Gray Level: Connect power, D-sub, into projector. Change Timing and pattern of pattern generator: Timing: 1024*768 @60Hz (XGA) Pattern: As Figure1 {A near white color (240,240,240) and a near black color(16,16,16)} Light on projector Set user OSD values to default. Enter factory mode.
Page 102 Figure1 8. YUV Alignment Procedure Equipment: -Pattern generator (VG-828) OSD Default value: Item Value Cal R Offset Cal G Offset Cal B Offset Cal R Gain Cal G Gain Cal B Gain YPbPr R Offset YPbPr B Offset AutoKeystone Cal TiltRatio Flat TiltRatio Flat Procedure:...
Page 103 Light on projector Adjust user OSD values to default. Enter factory mode. Adjust Factory values to default. Press “Calibration YpbPr” to calibrate the mid level offset. 9. How to change Model name Equipment: -PC and RS232 cable Procedure: Plug in power core and RS232 cable use RS232 command to set model name, command format please refer below...
Page 104 Example:...
Page 105 10.Mechanical Assembly Concerns...
Page 106 1. Grounding wire alignment The grounding wire is come out from the middle-opening area of the BKT L-frame, see figure 1-1. Figure 1-2 is the final assembly of this wire. 3D.J2C13.001 BKT L-frame Grounding wire with EMI cord Figure 1-2. Grounding wire alignment –II. 2.
Page 107 Speaker wire is aligned between Lower case rib and Lower case boss before assembling Main board, see figure 2-1. After assembling main board, put speaker wire between Lower case rib and BKT L-frame, see figure 2-2. Figure 2-1. Speaker wire alignment –I. 3D.J2C13.001 BKT L-frame...
Page 108 3. CW FPC, CW sensor wire and blower wire alignment CW FPC wire is constrained by two Wire-saddle clips, see figure 3-1. CW FPC wire has to be crossed above Thermal breaker wire and keep the redundant wire above lamp box. Blower wire and CW sensor wire are constrained by the Wire-saddle clips too.
Page 109 the second clip finally, see figure 4-1. Figure 4-1. Thermal breaker wire alignment. Blower wire alignment Old Blower part number, 2C.J10102.031, the wire goes through the gap between lens and blower and be constrained by clip no. 2 only, see figure 4-2. The wire has to keep straight between blower and clip 2 and leave redundant wire between clip 2 and connector.
Page 110 Figure 4-3. New blower, 2C.J10102.051 (wire length 200mm) wire alignment. NOTE: Please check thermal breaker wire is connected to power board indeed before assembling BKT L-frame. 5. Fan 8025 wire assembly concern After assembling BKT U-frame, connect fan connector to Main board before put Fan body in Lower case.
Page 111 Figure 5-1. Fan 8025 assembly concern--before. Figure 5-2. Fan 8025 assembly concern--after. 6. Front IR wire assembly concern Make sure IR wire is aligned between Optical engine housing and Lower case, see figure 6-1. IR wire...
Page 113 11.Power Assembly Concerns 1. Power board component add GP glue 1.1 CY604 CY605 add glue.
Page 114 1.2 CY625 CY612 add glue.
Page 116 1.3 C651 R651 add glue 2. SW2 solder by operator.
Page 117 3. Power board top side check list. 3.1 C601 and HS1 can’t be touched each other. 3.2 TR601 and HS1 can’t be touched each other.
Page 118 4. Process Q602 12.EMI Parts Assembly Concerns All contact fact with conduct fabric isn’t any paint or non-conduct article Item Frequenc Solution...
Page 119 180MHz 1-1. Add three springs on the plate 300MHz 1-2. 1-2.Add one spring on the plate 300MHZ 2.Add two springs on the plate 420MHZ...
Page 120 640MHZ 3. Add a Gasket on the lamp box 720MHZ 4. Add a Gasket on the DMD Board to Engine...
Page 123 180MHz 9.add gasket( between iron plate and DMD Board 4G..J0C38.001) 180MHz 10. add grounding wire of IR wire(5K.J2J01.001) on the optical engine...
Page 125: Level 2 Circuit Board And Standard Parts Replacement
Level 2 Circuit Board and Standard Parts Replacement Troubleshooting Chapter 1 System Analysis Step: 1. Check Lamp Door 2. Check Power Board and Interlock 3. Check Connection between PWR BD and Main BD Keypad LED OK Check Main Board 1. Check Lampen wire , Lamp wire and Ballast wire 2.
Page 126 Chapter 2 Optical & Optical Engine Trouble Shooting Guide Item Trouble Shooting Guide Brightness 1. Change lamp Uniformity 1. Change lamp 1. Check ADC calibration 2. Check user’s menu brightness & contrast are default FOFO Contrast 3. Clean DMD 4. Clean PL 5.
Page 127 To adjust “Horizontal Adjustment Screw” firstly, then “Vertical Adjustment Screw”. Refer to Figure 2-1.. (2) Overfill Vertical Adjustment Screw (1) Overfill Horizontal Adjustment Screw Fig. 2-1 II. Re-assemble LP module—include LP, LP Baffle, LP clip.
Page 128 Chapter 3 Power Supply Trouble Shooting Guide...
Page 129 Chapter 4 LED Messages Definition Status Note Power Temp Lamp Stand-by Powering up Normal operation Normal power-down cooling First Lamp-Lit error cooling Lamp Error Messages Second Lamp-Lit error Lamp error in normal operation Thermal Error Messages Fan 1 error ( Lamp Fan the actual fan speed is ±20% outside the desired speed.) Fan 2 error (...
Page 130: Level 3 - Component Repair To Curcuit Boards
Chapter 5 Error Count Messages Definition Error Count Definition Specification LAMP OFF DETECT LAMPLIT LAMP FAIL COUNT LAMP FAN SPEED ERROR SPEED OVER ± 20% LAMP FAN ERROR COUNT BALLAST FAN SPEED ERROR SPEED OVER ± 20% BALLAST FAN ERROR COUNT BLOWER FAN SPEED ERROR SPEED OVER ±...
Page 131: Main Board
processor by system firmware so that commands can be issued to configure the DDP ASIC, the analog interface device, the video decoder, the cooling device, and other system peripheral devices. Please see figure 2. Main Board Volume、Mute DDP ASIC Audio DLP Image Processor 32 M Flash...
Page 132 (5) OSD function: DDP ASIC generates the On-Screen Display. Please refer to C212 Software Specification. Keypad Board KEY[8:0] KEYPADS To main LED[6:0] CONNECTO Twice-color board VDD, GND Backlight LED Figure 3 Keypad board BLOCK DIAGRAM 1.3 Turn On/ Turn Off Function (1) Turn On function: User can touch “Power”...
Page 133 1.4 System Protection Function (1) Lamp Door Open Protection: There is a Door interlock switch built at bottom case. When lamp door is opened, the switch will turn off the AC line power. Then the whole system will be shutdown immediately. (2) Lamp Box Thermal Break Protection: There is a thermal break built around the lamp box.
Page 134 DMD data DMD chip Image Display formatting output circuit Color Light Image Color Phase sequence Synchronization module Feedback Figure 4 DMD image display concept Color Sequence Light Source for DMD Figure 5 Color modulation concept...
Page 135 2.2 DMD Data Formatting DMD data formatting circuit consists of DDP ASIC, DAD1000, RAM and FLASH. Please see figure 6. (1) The DDP ASIC combines the DLP data processing functions and high performance DLP front-end image processing in the same device. The ASIC includes the front-end functions of Auto Lock, Motion-Adaptive De-Interlacing, Spatial-Temporal Noise Reduction Filters, Edge-Preserving Scaling, Keystone Adjustment and On-Screen Display.
Page 136 2.3 Color Light Sequencing Processing Color light sequencing processing circuit consists of Motor driver, Motor phase synchronization, Light source control and synchronization. (1) Motor driver drives the color wheel motor. The motor is three phase, 8, 12 or 16 pole, Y configuration, brushless DC motor.
Page 137 The Projector signal input terminals consist of PC VGA (Component) input, PC VGA output, S-Video input, Video input, and PC Audio input. 3.2 Graphics Signal Processing PC VGA (Component) Input: The PC VGA (Component) Inputs consist of PC analog RGB signal, PC HSYNC signal, PC VSYNC signal, PC EDID/DDC signal, and Component YPBPR signal.
Page 138 3.3 Videos Signal Processing Video and S-Video input: The Video and S-video signal will be fed to a Video Decoder (VDC) device built on main board. The video decoder accepts NTSC/PAL/SECAM composite and s-video inputs. The output is formatted as YCrCb and routed to the DDP2000.
Page 139 Chapter 4 Cooling Circuit Operation Theory 4.1 Overview The Projector cooling circuits consist of Fan driver devices, Fans, and Thermal sensors. The cooling purpose is for protecting System Elements from over heat damage. Please see figure 8. The particular hot spot points are Lamp Tip, Lamp Burner, DMD Heat-sink, and Lamp Box.
Page 140: Block Diagram
4.2 Blower Fan Blower fan is designed for cooling the lamp tip and lamp burner. The speed of blower fan is controlled and monitoring by MCU. 4.3 Rear Fan Rear fan is designed for cooling the whole system except tip and burner of lamp. The speed of rear fan is controlled and monitoring by MCU.
Page 141 Input power: 300W max The power circuit shall supply DC power outputs as followings: Output Voltage Typical load current 380V 0.58A 2.5V 1.4A 1.4A 0.5A 5.3 EMI filter EMI components include common choke L606.L603, X Capacitor C602.C603, Y Capacitor C604.C605. and differential choke L604.and discharge resistor R651A, R651B, This circuit designed to inhibit electric and magnetic interference for meet FCC class B and CISPR class B standard requirements.
Page 142 Bridge converts the AC input into DC output, and the CAP is AC filter.
Page 143 5.5 Power Factor Correction The Power Factor Correction (PFC) like a Boost converter . The AC mains voltage is rectified by a bridge and the rectified voltage delivered the the boost converter . This using a switching technique ,boost the recdtified input voltage to a regulated DC output voltage Vo .
Page 144 PFC schematic: D601 TR601 L605 BD601 GSIB1560 NTC 5OHM 800U SF10L60U Q601 C608 SPW20N60C3 C601 R622 C606 220P C625 220U 169K F 1U K 4700P M R630 R631 D611 450V R615 169K F R604 C626 R616 R623 4700P M 169K F 169K F R618 169K F...
Page 145 FA5502 Block Diagram: Description: The FA5502 is a control IC for a power factor correction system. This IC use the average current control system to en sure stable operation. With this system , a power factor of 99％ or better can be achieved. Pin assignment: IFB: current error amplifier output （...
Page 146 SYNC: oscillator synchronization input(input of synchronization signal) CT: oscillator timing capacitor and resistor(to set oscillation frequency ) IDET: Non-inverting input to current error amplifier( input of inductor current signal) 5.6 Transformer and snubber circuit of Sub Power Board T651 380V TO D703 C651 R651...
Page 147 5.7 Power module IC From T651 IC651 TOP247Y R653 1206J C653 0.1U C654 0805 R652 0805J (EL) From IC652 The Power module IC is TOP247Y , The function of each pins described as follow. pin 1 : Control pin pin 5 : Frequency pin pin 2 : Line-sense pin pin 6 : NA pin 3 : External current limit pin...
Page 148 5.8 Feedback circuit and photo coupler R750 1206J 2.5V IC652 PC123 R706 0805J R753 1.2K 1206F R751 2.87K C751 0805F 0.1U C750 0805 IC750 R754 (EL) TL431 105C 0805F The power supply adapt a single feedback circuit of 12V. It used IC750 for voltage regulation and IC652 for primary-secondary isolation.
Page 149: C Ircuit S Chematics
Circuit Schematics...
Page 152: Pcb A Rtwork
PCB Artwork...
Page 161: Appendix 1 – Screw List /Torque
Appendix 1 – Screw List /Torque Model name :MP611 (MD) Description Torque Q'ty Screw P/N Where use Type Head Length Surface (kgf-cm) 8F.1A522.6R0 MACH FIXBLOCK==HOLDER GEAR ==FIXBLOCK 2 8F.HA722.5R0 TAP(DELTA BKT MB==LC POWER==LC 3 8F.VA564.8R0 TAP(DELTA) PH LAMP BOX==LC BALLAST==LC...
Page 162: Appendix 2 – Code List: Ir/Rs232
Appendix 2 – Code List: IR/RS232 1. IR Code CUSTOMER CODE DATA CODE FUNCTION 2. RS232 command format 1...
Page 163 Read Mirror status 0x07 0x14 0x00 0x05 0x00 0x34 0x00 0x00 0x12 0x00 0x5F Contrast decrease 0x06 0x14 0x00 0x04 0x00 0x34 0x12 0x02 0x00 0x60 Write Contrast Contrast increase 0x06 0x14 0x00 0x04 0x00 0x34 0x12 0x02 0x01 0x61 Read Contrast ratio 0x07 0x14 0x00 0x05 0x00 0x34 0x00 0x00 0x12 0x02 0x61...
Page 164 mode 0 0x06 0x14 0x00 0x04 0x00 0x34 0x12 0x0B 0x00 0x69 mode 1 0x06 0x14 0x00 0x04 0x00 0x34 0x12 0x0B 0x01 0x6A Application Write mode 2 0x06 0x14 0x00 0x04 0x00 0x34 0x12 0x0B 0x02 0x6B Mode mode 3 0x06 0x14 0x00 0x04 0x00 0x34 0x12 0x0B 0x03 0x6C mode 4 (only VGA) 0x06 0x14 0x00 0x04 0x00 0x34 0x12 0x0B 0x04 0x6D...
Page 165 简体中文 0x06 0x14 0x00 0x04 0x00 0x34 0x15 0x00 0x07 0x68 0x06 0x14 0x00 0x04 0x00 0x34 0x15 0x00 0x08 0x69 日本語 0x06 0x14 0x00 0x04 0x00 0x34 0x15 0x00 0x09 0x6A 한국어 Swidish 0x06 0x14 0x00 0x04 0x00 0x34 0x15 0x00 0x0A 0x6B Dutch 0x06 0x14 0x00 0x04 0x00 0x34 0x15 0x00 0x0B 0x6C Turkish...
Page 166 Auto Adjust Auto Adjust *auto# Horizontal Horizontal position shift right *hpos=left# position Horizontal position shift left *hpos=right# Horizontal position *hpos=?# Vertical position Vertical position shift up *vpos=up# Vertical position shift down *vpos=down# read Vertical position *vpos=?# Color color temperature low *ctmp=T3# temperature color temperature standard...
Page 167 Input source YCbCr *sour=YCbr# Status *sour=?# Source scan Source scan on *scan=on# Source scan off *scan=off# Source scan status *scan=?# Mute Mute on *mute=on# Mute off *mute=off# Mute status *mute=?# Volume Increse Volume *vol=-# Decrese Volume *vol=+# Volume *vol=?# Language English *lang=eng# FRE(Français)

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