Sony mdr-nc50 Service Manual
Sony mdr-nc50 Service Manual

Sony mdr-nc50 Service Manual

Noise canceling headphones
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SERVICE MANUAL
Ver. 1.3 2006.08
SPECIFICATIONS
General
Type
Dynamic, closed
Driver units
40 mm, dome type
Power handling capacity
100 mW
40 Ω at 1 kHz (when the power is on)
Impedance
100 Ω at 1 kHz (when the power is off)
Sensitivity
102 dB/mW (when the power is on)
100 dB/mW (when the power is off)
14 − 22,000 Hz
Frequency response
Frequency range of active noise attenuation
40 − 1,500 Hz, more than 14 dB at 300 Hz
DC 1.5 V, 1 × R03 (size AAA) battery
Power source
Mass
Approx. 290 g (11 oz) including battery
Battery life
Battery
Approx. hours*
Sony alkaline LR03/AM-4 (N)
30 hours*
(size AAA) battery
Sony manganese R03/ UM-4
15 hours*
(NU) (size AAA) battery
1
*
1 kHz, 1 mW + 1 mW input
*
2
Time stated above may vary, depending on the temperature or conditions of use.
When to replace the battery
Replace the battery with a new one when the POWER indicator dims.
The noise canceling feature may not work correctly if battery power is low.
Supplied accessories
Connecting cord (0.5 m, gold-plated stereo mini plug (1) (Tourist only),
1.5 m, gold plated L type stereo mini plug (1)), R03 (size AAA) dry
battery (1) (Tourist only), Carrying case (1), Plug adaptor for in-flight
use* (single/dual) (1), Gold-plated unimatch plug adaptor (stereo phone
plug y stereo mini jack) (1), Operating Instructions (1)
* May not be compatible with some in-flight music services.
Design and specifications are subject to change without notice.
Sony Corporation
9-879-314-04
Personal Audio Division
2006H05-1
Published by Sony Techno Create Corporation
© 2006.08
1
2
2
MDR-NC50
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Note on chip component replacement
• Never reuse a disconnected chip componet
• Notice that the minus side of a teamtalum capacitor may be damaged by
heat
US Model
Canadian Model
AEP Model
UK Model
E Model
Tourist Model
NOISE CANCELING
HEADPHONES

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Summary of Contents for Sony mdr-nc50

  • Page 1 (1), Operating Instructions (1) * May not be compatible with some in-flight music services. NOISE CANCELING Design and specifications are subject to change without notice. HEADPHONES Sony Corporation 9-879-314-04 Personal Audio Division 2006H05-1 Published by Sony Techno Create Corporation © 2006.08...
  • Page 2: Table Of Contents

    MDR-NC50 TABLE OF CONTENTS GENERAL ..............3 DISASSEMBLY 2-1. Disassembly Flow ............4 2-2. ML Board ................ 4 2-3. MR Board ................ 5 2-4. Ornamental Cap (L)/(R) ..........5 2-5. Position of lead Wires ............6 2-6. L/R Transition Cord Location ......... 6 2-7.
  • Page 3: General

    When connecting to the stereo mini jack of the remote control’s jack supplied with a WALKMAN*, etc MONITOR switch * “WALKMAN” is a registered trademark of Sony Corporation to represent Headphone Stereo products. Match the e on monitor microphone the battery to the...
  • Page 4: Disassembly

    MDR-NC50 SECTION 2 DISASSEMBLY Note: Follow the disassembly procedure in the numerical order given. 2-1. DISASSEMBLY FLOW 2-2. ML BOARD 2-3. MR BOARD (Page 4) (Page 5) 2-4. ORNAMENTAL CAP (L)/(R) 2-4. ORNAMENTAL CAP (L)/(R) (Page 5) (Page 5) Note: Follow the disassembly procedure in the numerical order given.
  • Page 5: Mr Board

    MDR-NC50 2-3. MR BOARD 8 ring (R) block qa MR board 6 two screws (B2.6) 5 packing housing 3 two screws q; two claws (B2.6) 9 Remove thirteen solders. 7 screw (B2.6) 4 front plate (R) assy 1 screen 2 two screws (B2.6)
  • Page 6: Position Of Lead Wires

    MDR-NC50 2-5. POSITION OF LEAD WIRES – ML board – – MR board – MIC102 BATT MIC2 NATURAL SP101 L/R transition jack NATURAL cord (small type) MIC1 RV101 sheet GREEN NATURAL (housing) BLACK NATURAL NATURAL NATURAL L/R transition RV102 cord...
  • Page 7: Position Of Lead Wires At Front Plate (L)/(R) Sub Assy

    MDR-NC50 2-7. POSITION OF LEAD WIRES AT FRONT PLATE (L)/(R) SUB ASSY front plate sub assy (L) MIC2 ML board MIC2 front panel sub assy (R) MIC102 SP101 MR board...
  • Page 8: Electrical Adjustment

    MDR-NC50 SECTION 3 ELECTRICAL ADJUSTMENT NOISE CANCELING VOLUME ADJUSTMENT Preparation: AF oscillator speaker amplifier – sine wave 250 Hz Procedure: 1. Generate a sine wave of specific frequency (250 Hz) from a AF oscillator, and output it from a speaker placed at the forward position.
  • Page 9: Diagrams

    MDR-NC50 SECTION 4 DIAGRAMS • Note for Printed Wiring Boards and Schematic Diagrams • IC Block Diagrams Note on Schematic Diagram: ML Board IC1 • All capacitors are in µF unless otherwise noted. (p: pF) 50 WV or MR Board IC101 less are not indicated except for electrolytics and tantalums.
  • Page 10 MDR-NC50 MEMO...
  • Page 11: Block Diagram

    MDR-NC50 4-1. BLOCK DIAGRAM (INPUT) (L-CH) SWITCH B+1V (L) Q1, 2 MIC AMP BUFFER BUFFER MONITOR SWITCH POWER AMP MIC2 MIC1 (VOLUME) (NOISE DETECT) (MONITOR) NOISE CANCEL VOLUME (L) MONITOR B+2V (L) SP101 (R-CH) SWITCH B+1V (R) Q101, 102 MIC AMP...
  • Page 12: Printed Wiring Board - L-Ch Board

    MDR-NC50 4-2. PRINTED WIRING BOARD – L-CH Section – : Uses unleaded solder. ML BOARD ML BOARD (SIDE A) (SIDE B) (L-CH) MIC1 (MONITOR) NATURAL MONITOR (12) MR BOARD 1-864-609- • Semiconductor (12) Location Ref. No. Location MIC2 (INPUT) (NOISE DETECT)
  • Page 13: Printed Wiring Boards - R-Ch Board

    MDR-NC50 4-3. PRINTED WIRING BOARDS – R-CH Section – : Uses unleaded solder. SW BOARD ML BOARD MR BOARD MR BOARD (SIDE A) (SIDE B) MIC102 C111 POWER (NOISE DETECT) NATURAL 1-864-611- (12) C106 C112 C114 C152 C131 D201 POWER...
  • Page 14: Schematic Diagram

    MDR-NC50 • See page 10 for Waveforms. • See page 10 for IC Block Diagrams. 4-4. SCHEMATIC DIAGRAM 0.033 (L-CH) MONITOR Q54,55 10k 0.0022 470k (INPUT) 6.3V B+ SWITCH 4.7k 4.7k 0.01 3.3k 0.0015 2SB1690K 0.022 MONITOR POWER AMP SWITCH 100 µH...
  • Page 15: Exploded Views

    MDR-NC50 Ver. 1.3 SECTION 5 EXPLODED VIEWS NOTE: • -XX and -X mean standardized parts, so they • Items marked “*” are not stocked since they may have some difference from the original are seldom required for routine service. Some one.
  • Page 16: Housing (L) Section

    MDR-NC50 5-2. HOUSING (L) SECTION supplied MIC2 MIC1 not supplied Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 2-348-232-01 SCREEN 2-547-578-01 SHEET (HOUSING) 3-253-143-01 SCREW (B2.6), (+) P TAPPING 1-162-964-11 CERAMIC CHIP 0.001uF X-2024-714-1 PLATE (L) SUB ASSY, FRONT 1-162-964-11 CERAMIC CHIP 0.001uF...
  • Page 17: Housing (R) Section

    MDR-NC50 5-3. HOUSING (R) SECTION not supplied C101 MIC101 SP101 not supplied MIC102 C104 not supplied Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 2-318-938-01 RING (R) X-2024-715-1 PLATE (R) SUB ASSY, FRONT A-1080-484-A MR BOARD, COMPLETE...
  • Page 18: Electrical Parts List

    MDR-NC50 SECTION 6 ELECTRICAL PARTS LIST NOTE: When indicating parts by reference • Due to standardization, replacements in the • Items marked “*” are not stocked since they number, please include the board. parts list may be different from the parts are seldom required for routine service.
  • Page 19 MDR-NC50 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark A-1080-484-A MR BOARD, COMPLETE 1-216-841-11 METAL CHIP 1/10W ******************** 1-216-804-11 METAL CHIP 1/10W 1-216-797-11 METAL CHIP 1/10W < CAPACITOR > 1-216-821-11 METAL CHIP 1/10W 1-216-821-11 METAL CHIP...
  • Page 20 MDR-NC50 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark < DIODE > R129 1-216-841-11 METAL CHIP 1/10W D151 6-500-220-01 DIODE RB161M-20TR R130 1-216-826-11 METAL CHIP 2.7K 1/10W D201 8-719-077-09 LED CL-196HR-CD-T (POWER) R131 1-216-845-11 METAL CHIP...
  • Page 21 MDR-NC50 Ver. 1.2 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark MISCELLANEOUS ************** 1-162-964-11 CERAMIC CHIP 0.001uF 1-162-964-11 CERAMIC CHIP 0.001uF C101 1-162-964-11 CERAMIC CHIP 0.001uF C104 1-162-964-11 CERAMIC CHIP 0.001uF 1-794-152-11 JACK (SMALL TYPE) (INPUT)
  • Page 22: Revision History

    MDR-NC50 REVISION HISTORY Clicking the version allows you to jump to the revised page. Also, clicking the version at the upper right on the revised page allows you to jump to the next revised page. Ver. Date Description of Revision 2004.11...

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