HP LP2475w Disassembly Instructions Manual page 2

Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. External electric cables disconnecting process
2. Take off the stand ass'y and remove quick release
3. Remove rear cover
4. Remove shield and USB board
5. Remove front bezel and remove keyboard
6. Take 4 pcs screws off ,disconnect 2 pcs cables and remove main frame ass'y
7. Take screws off main board ,power board, remove main frame cover.
8. Take screws off and disassemble the stand ass'y
9. Take screws off and disassemble the stand ass'y
10. .Disassemble the hinge ass'y
11. Disassemble the base ass'y
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at EL-MF877-01
0
0
Tool Size (if
applicable)
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