C112,C113
C109,C119,C410,C71
5
C102,C103,C105,C10
7,C108,C111
C101,C106,C110
C412,C413
C406
C401,C404,C409
U402
FB401,FB402,FB406
FB101,FB102,FB190
065G040210412K---M
065G040210412K---A
065G040222031J---A
065G040222031J---3
065G040222031J---F
065G040222415K---F
065G040222415K---3
065G040222415K---A
065G040247312K---F
065G040247312K---3
065G040247312K---A
065G040250931C---A
065G040250931C---3
065G040256031J---Y
065G040256031J---3
065G0603475A5K---3
065G0603475A5K---T
065G0805106A5K---A
065G0805106A5K---3
070GHDCP500HDC
071G-56K121--M
071G-56K121
071G-56K121-TA
071G-59G301--M
MLCC 0402 0.1uF -10% 16V X7R MURATA
MLCC 0402 0.1uF -10% 16V X7R SAMSUNG
MLCC 0402 22pF +-5% 50V NPO SAMSUNG
NO-SUGGEST MLCC 0402 22pF -5% 50V NPO
TDK
MLCC 0402 22pF -5% 50V NPO FENGHUA
MLCC 0402 0.22uF +-10% 16V X5R FENGHUA
NO-SUGGEST MLCC 0402 0.22uF -10% 16V
X5R TDK
MLCC 0402 0.22uF -10% 16V X5R SAMSUNG
MLCC 0402 47nF +-10% 16V X7R FENGHUA
NO-SUGGEST 0402 47nF -10% 16V X7R
TDK
MLCC 0402 47nF -10% 16V X7R SAMSUNG
MLCC 0402 5pF +-0.25pF 50V NPO SAMSUNG
NO-SUGGEST MLCC 0402 5pF -0.25pF 50V
NPO TDK
MLCC 0402 56pF +-5% 50V NPO YAGEO
MLCC 0402 56pF -5% 50V NPO TDK
NO-SUGGEST MLCC 0603 4.7uF +-10% 10V
X5R TDK
MLCC 0603 4.7uF -10% 10V X5R TAIYO
YUDEN
MLCC 0805 10uF +-10% 10V X5R SAMSUNG
NO-SUGGEST MLCC 0805 10uF -10% 10V
X5R TDK
HDCP CODE
CHIP BEAD
CHIP BEAD
CHIP BEAD 120R/6000mA HCB2012KF-121T60
CHIP BEAD 0603 300R 25% 200mA
62
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