Printed Wiring Board -Main Board - Sony NW-MS7 Service Manual

NW-MS7
4-5. PRINTED WIRING BOARD — MAIN BOARD —
1 2
A
MAIN BOARD (COMPONENT SIDE)
B
CN706
24 23
C
20 19
CN
16 15
BOARD 1
10
9
CN901
(Page 37) 5
6
2 1
R739
D
R715
E
04
F
Comon note on Printed Wiring Boards:
•
f
• b : Pattern from the side which enables seeing.
(The other layer's patterns are not indicated.)
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side) the parts face are indicated.
• Note for replacing the parts of the main board:
IC702 and IC705 should be replaced at the same time.
• Main board is six-layer printed board.
However, the patterns of layers 2 to 5 have not been
included in this diagrams.
* IC701, 702 and 703 on main board are not
replaceable.
• Lead Layouts
Lead layout of conventional IC
3 4 5
5 4
IC706
8 1
R725
R744
R734
R737
C757
R721
IC702
C729
R742
C761
R741
R735
JC711
JC703
C732
C746
12 10 5 1
48
13
15
IC701
45
IC704
20
40
37
24
25 30 35 36
C721
: internal component.
Parts on the pattern face side seen from
the pattern face are indicated.
Parts on the parts face side seen from
surface
CSP (chip size package)
– 25 –
6 7 8
R722
R704
20
IC301
IC703
C752
C750
1
C745
C303
R705 R703
R732
C716 C700
JC758
JC757
CN701
C717
10 5 1
JC769
C772
C774
4 3
IC504
1 2
CN501
4 1
IC503
5 8
1 5 7
EJECT
MECHANISM
RECHARGEABLE
BLOCK
BATTERY
(LITHIUM-ION)
DC IN 3.7V
• Semiconductor Location
Ref. No. Location Ref. No.
D503 D-7 IC710
D510 D-10
D511 E-10 Q302
D801 D-13 Q303
D802 E-12 Q305
D807 E-13 Q504
Q506
IC301 B-8 Q507
IC503 E-7 Q508
IC504 E-7 Q601
IC505 E-9 Q705
IC701 E-4 Q715
IC702 C-4 Q801
IC703 C-6 Q802
IC704 E-3 Q803
IC706 B-4 Q804
9 10 11
HP
BOARD
(Page 37)
CN705
2
R551
C102
C
E
C
B C
C302
R552
CN707
R553
C109
20 19 G
15 11 R101
16 15 S
R736 R109
C104
10 9
R201 R209
6 5
C204
C209
5 10
2 1 C551
L301
C304
C202
C C
Q506 Q507
B E
B E
D510 C406
R518
C405
R519
B
C402
C
E
C401
3 2 1
R511
IC505
C504
D511
4 5
D
Q508
G S
Comon note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
specified.
• % : indicates tolerance.
• : internal component.
f
• C : panel designation.
• U : B+ Line.
• Power voltage is dc 5.5 V and fed with regulated dc power
supply from external power voltage jack.
• Voltages and waveforms are dc with respect to ground in
playback mode.
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Location
Voltage variations may be noted due to normal produc-
C-12
tion tolerances.
• Waveforms are taken with a oscilloscope.
B-11
Voltage variations may be noted due to normal produc-
B-11
tion tolerances.
B-11
• Circled numbers refer to waveforms.
D-9
• Signal path.
D-10
F : ANALOG
D-11
E-9 J
: DIGITAL
C-12
B-12 IC701, 702 and 703 on main board are not
*
B-12 replaceable.
D-13
C-13
• The voltages and Waveform of CSP (chip size package)
C-13
cannot be measured, because its lead layout is different
E-12
from that of conventional IC.
– 26 –
12 13
C
B
Q705
E
B E
B
R727
L707
R757
D
Q715
D
G S
C726
C550
E
E
C C
C728 B
B
R708
B
R809
C
C409
E
1 5
2
C802
R808
3 4
C801 D801
R816
C407
R818
C410
C800
C404 B
R813
C
E
C403 R812
C808
D802
R821
R819
C806
R811
D807
E
C
B
1-675-321- 11
1 / W or less unless otherwise
4