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TABLE OF CONTENTS
1.
2.
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3.
......................................................... 5
4.
5.
6.
6-1. Block Diagram ................................................................ 11
6-2. Schematic Diagram - MAIN Board (1/2) - ................... 17
6-3. Schematic Diagram - MAIN Board (2/2) - ................... 21
6-4. Printed Wiring Board - MAIN Board - ........................ 24
6-5. Printed Wiring Board - LCD Board - ........................... 27
6-6. Schematic Diagram - LCD Board - .............................. 28
6-7. IC Pin Function Description ........................................... 38
7.
8.
............................................... 3
..................... 7
......................... 8
................................................ 46
............................... 49
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED
LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
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