HCD-GT111/GT222/GT444/GT555
QQ
3 7 63 1515 0
1.
2.
..................................................................
3.
3-6. Back Panel ...................................................................... 12
3-7. MAIN Board ................................................................... 12
3-10. Base Unit ......................................................................... 14
4.
............................................................ 16
5.
6.
7.
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
www
Flexible Circuit Board Repairing
•
Keep the temperature of soldering iron around 270 °C during
repairing.
.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
2
http://www.xiaoyu163.com
TABLE OF CONTENTS
.............................................
3
7
9
...................... 20
........................ 21
x
ao
u163
y
i
http://www.xiaoyu163.com
2 9
8
8.
8-1. Case Section .................................................................... 63
3
6 7
1 3
1 5
9.
CAUTION
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
This appliance is
classified as a CLASS 1
LASER product. This
marking is located on the
rear exterior.
SAFETY-RELATED COMPONET WARNING!
co
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
.
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE
THESE
COMPONENTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
9 4
2 8
0 5
8
2 9
9 4
2 8
.............................. 73
m
WITH
SONY
PARTS
9 9
9 9