Table of Contents
Advertisement
MZ-E90
6-3-6. PRINTED WIRING BOARD — SYSTEM BOARD —
1
2
SYSTEM BOARD
A
TP204
B
TP104
C
D
E
F
SYSTEM BOARD
(SIDE B)
G
H
C102
I
C202
04
3
4
5
(SIDE A )
TP826
TP817
TP305
TP825
TP304
TP303
TP815
CN803
1
5
10
15
6
1
7
24
IC301
20
12
19
13
18
R301
25
C301
E
C
R303
B
1
MAIN BOARD CN801
(Page 30)
– 39 –
6
7
8
TP821
TP819
TP824
TP816
TP820
TP823
TP818
TP822
C806
C804
50
C807
R810
45
R802
87
88 86 83
69 64
89 85 84
68 65
82 79
73
67 66
96
40
99
98 97
102
103
IC801
C802
35
R826
112
30
117
19
115
119
2
6
8
26
9
12
24
9
10
• Semiconductor
Location
BP801
Ref. No.
11
IC301
( )
1-675-487-
11
IC801
IC802
Q301
R808
R807
Note:
•
f
60
58
• b : Pattern from the side which enables seeing.
(The other layer's patterns are not indicated.)
55
Caution:
4
1
52
Pattern face side: Parts on the pattern face side seen from the
IC802
(Side B)
49
Parts face side: Parts on the parts face side seen from the
5
8
46
(Side A)
43 45
40
• System board is four-layer printed board.
R815
C808
37 38
39
However, the patterns of layers 2 and 3 have not been in-
X801
cluded in this diagrams.
35
36
33
IC801 is not replaceable
*
26
TP829 TP830
25
• Lead Layouts
11
( )
1-675-487-
11
Lead layout of conventional IC
– 40 –
• Waveforms
(MODE:PLAY)
6
1.2Vp-p
16.9344MHz
IC801
rg
(XTAL)
Location
H-4
G-8
G-10
I-3
: internal component.
pattern face are indicated.
parts face are indicated.
surface
CSP (chip size package)
Advertisement
Table of Contents
