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Q17 Technical Service Manual
Thermal Characteristics
Parameter
Characteristics
Thermal resistance, junction - case
Thremal resistance, junction - case, FullPAK
Thermal resistance, junction - ambient, leaded
Thermal resistance, junction - ambient, FullPAK
SMD version, device on PCB:
@ min. footprint
2
@ 6 cm
cooling area
Linear derating factor
Linear derating factor, FullPAK
Soldering temperature,
1.6 mm (0.063 in.) from case for 10s
Electrical Characteristics, at T
Static Characteristics
Drain-source breakdown voltage
V
=0V, I
=0.25mA
GS
D
Drain-source avalanche breakdown voltage
V
=0V, I
=4.5A
GS
D
Gate threshold voltage, V
I
= 200 A
D
Zero gate voltage drain current
V
= 600 V, V
= 0 V, T
DS
GS
V
= 600 V, V
= 0 V, T
DS
GS
Gate-source leakage current
V
=30V, V
=0V
GS
DS
Drain-source on-state resistance
V
=10V, I
=2.8A, T
GS
D
V
=10V, I
=2.8A, T
GS
D
Gate input resistance
f = 1 MHz, open drain
3)
= 25 °C, unless otherwise specified
j
= V
GS
DS
= 25 °C
j
= 150 °C
j
=25°C
j
=150°C
j
Symbol
min.
R
thJC
R
thJC_FP
R
thJA
R
thJA_FP
R
thJA
T
sold
V
600
(BR)DSS
V
(BR)DS
2.1
V
GS(th)
I
DSS
I
GSS
R
DS(on)
R
G
--37--
Values
typ.
max.
-
-
2.5
-
-
4
-
-
62
-
-
80
-
-
62
-
35
-
-
0.4
-
-
-
0.25
-
-
260
-
-
-
700
-
3
3.9
-
0.5
1
-
-
50
-
-
100
-
0.85
0.95
-
2.35
2.62
-
0.95
-
Unit
K/W
W/K
°C
V
A
nA
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