Printed Wiring Board - Dac Section - Sony XDP-4000X Service Manual

4-11. PRINTED WIRING BOARD — DAC SECTION —
Note:
• Semiconductor
• X : parts extracted from the component side.
Location
• : Through hole.
®
Ref. No. Location
• b : Pattern from the side which enables seeing.
IC302 B-1
(The other layer's patterns are not indicated.)
IC305 B-3
IC308 B-4
Caution:
IC311 B-6
Pattern face side: Parts on the pattern face side seen from the
IC530 D-1
(Side B) pattern face are indicated.
IC531 D-3
Parts face side: Parts on the parts face side seen from the
IC532 D-4
(Side A) parts face are indicated.
IC533 D-6
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XDP-4000X
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