Sony HCD-XB66 Service Manual page 31

• Circuit Boards Location
TRANS board
PANEL board
HP/MIC board
TC-A SW
board
LED board
CD-A SW board
DOOR SW board
CD-B2 SW board
CD MOTOR board
TABLE SENSOR board
TCB board
MAIN board
POWER AMP board
TC-B SW board
CD-B1 SW board
MOTOR board
LEAF SWITCH
board
BD board
AUDIO board
BD LED board
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THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
specified.
• : internal component.
¢
• 2 : nonflammable resistor.
• 5 : fusible resistor.
• C : panel designation.
Note: The components identified by mark ! or dotted line
with mark ! are critical for safety.
Replace only with part number specified.
• U : B+ Line.
• V : B– Line.
• H : adjustment for repair.
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: TUNER (FM/AM)
E
: PB (DECK A)
d
: PB (DECK B)
G
: REC (DECK B)
J
: CD
c : digital out
N : MIC INPUT
• Abbreviation
AR : Argentine model.
AUS : Australian model.
MX : Mexican model.
SAF : South African model.
Note on Printed Wiring Boards:
• X : parts extracted from the component side.
• ¢ : internal component.
• b : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
• Indication of transistor.
C
Q
These are omitted.
B E
Q
B C E
These are omitted.
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