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8.2
Drive orientation
The balanced rotary arm actuator design of the drive allows it to be mounted in any orientation. All drive perfor-
mance characterization, however, has been done with the drive in horizontal (discs level) and vertical (drive on
its side) orientations, and these are the two preferred mounting orientations.
8.3
Cooling
Cabinet cooling must be designed by the customer so that the ambient temperature immediately surrounding
the drive will not exceed temperature conditions specified in Section 6.4.1, "Temperature." Specific consider-
ation should be given to make sure adequate air circulation is present around the printed circuit board (PCB) to
meet the requirements of Section 6.4.1, "Temperature."
8.4
Drive mounting
When mounting the drive using the bottom holes (x-y plane in Figure 10) care must be taken to ensure that the
drive is not physically distorted due to a stiff non-flat mounting surface. The allowable mounting surface stiff-
ness is 80 lb/in (14.0 N/mm). The following equation and paragraph define the allowable mounting surface stiff-
ness:
where 'k' represents the mounting surface stiffness (units of lb/in or N/mm), and 'x' represents the out-of-plane
mounting surface distortion (units of inches or millimeters). The out-of-plane distortion ('x') is determined by
defining a plane with three of the four mounting points fixed and evaluating the out-of-plane deflection of the
fourth mounting point when a known force (F) is applied to the fourth point.
Note.
Before mounting the drive in any kind of 3.5-inch to 5.25-inch adapter frame, verify with Seagate Tech-
nology that the drive can meet the shock and vibration specifications given herein while mounted in
such an adapter frame. Adapter frames that are available may not have a mechanical structure capa-
ble of mounting the drive so that it can meet the shock and vibration specifications listed in this manual.
8.5
Grounding
Signal ground (PCBA) and HDA ground are connected together in the drive and cannot be separated by the
user. The equipment in which the drive is mounted is connected directly to the HDA and PCBA with no electri-
cally isolating shock mounts. If it is desired for the system chassis to not be connected to the HDA/PCBA
ground, the systems integrator or user must provide a nonconductive (electrically isolating) method of mount-
ing the drive in the host equipment.
Increased radiated emissions may result if you do not provide the maximum surface area ground connection
between system ground and drive ground. This is the system designer's and integrator's responsibility.
k * x = F < 15lb = 67N
Cheetah 36ES Product Manual, Rev. A
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