Table Of Contents - Intel D525MW Technical Product Specification

Contents
1 Product Description
1.1 Overview ......................................................................................... 11
1.1.1 Feature Summary ................................................................. 11
1.1.2 Board Layout ........................................................................ 13
1.1.3 Block Diagram ...................................................................... 15
1.2 Online Support ................................................................................. 16
1.3 Processor ........................................................................................ 16
1.3.1 Intel
1.4 System Memory ............................................................................... 18
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1.5 Intel NM10 Express Chipset .............................................................. 19
1.5.2 USB ..................................................................................... 21
1.5.3 SATA Support ....................................................................... 21
1.6 Real-Time Clock Subsystem ............................................................... 22
1.7 Legacy I/O Controller ........................................................................ 22
1.8 LAN Subsystem ................................................................................ 23
1.8.1 LAN Subsystem Drivers .......................................................... 23
1.8.2 RJ-45 LAN Connector with Integrated LEDs .............................. 24
1.9 Audio Subsystem .............................................................................. 25
1.9.1 Audio Subsystem Software ..................................................... 26
1.9.2 Audio Connectors and Headers ................................................ 26
1.10 Hardware Management Subsystem ..................................................... 27
1.10.1 Hardware Monitoring ............................................................. 27
1.10.2 Thermal Monitoring ............................................................... 28
1.11 Power Management .......................................................................... 29
1.11.1 ACPI .................................................................................... 29
1.11.2 Hardware Support ................................................................. 32
2 Technical Reference
2.1 Memory Map .................................................................................... 35
2.1.1 Addressable Memory ............................................................. 35
2.2 Connectors and Headers .................................................................... 38
2.2.1 Back Panel ........................................................................... 39
2.2.2 Component-side Connectors and Headers................................. 41
2.3 BIOS Configuration Jumper Block ....................................................... 51
2.4 Mechanical Considerations ................................................................. 53
2.4.1 Form Factor .......................................................................... 53
2.5 Electrical Considerations .................................................................... 54
2.5.1 Fan Header Current Capability ................................................ 54
2.5.2 Add-in Board Considerations ................................................... 54
2.6 Thermal Considerations ..................................................................... 54
2.6.1 Passive Heatsink Design in a Passive System Environment ......... 56
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D525 Graphics Subsystem ............................................. 17
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