Thermal Considerations - Intel DZ87KLT-75K Specification

Intel Desktop Board DZ87KLT-75K Technical Product Specification
2.6

Thermal Considerations

CAUTION
A chassis with a maximum internal ambient temperature of 38
inlet is a requirement. Use a processor heat sink that provides omni-directional airflow
to maintain required airflow across the processor voltage regulator area. If a non
omni-directional thermal solution is used customer might need to provide supplemental
cooling to the processor voltage regulator area.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board's maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit. The processor
voltage regulator area (shown in Figure 19) can reach a temperature of up to 85
an open chassis.
68
o
C at the processor fan
o
C in