Related Manuals for Intel TIGPT1U - Carrier Grade Server
Summary of Contents for Intel TIGPT1U - Carrier Grade Server
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Page 1: Technical Product Specification
® Intel Carrier Grade Server TIGPT1U Technical Product Specification Revision 1.0 June, 2004 Enterprise Platforms & Services Division Intel Secret... -
Page 2: Revision History
PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. Intel disclaims all liability, including liability for infringement of any proprietary rights, relating to use of information in this specification. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein. -
Page 3: Table Of Contents
Cable and Interconnect Descriptions ............24 Exteranly-Accessible Interconnects ............25 3.4.1 Keyboard and Mouse Ports................ 25 3.4.2 Serial Ports ....................26 3.4.3 Video Port ....................27 3.4.4 Universal Serial Bus (USB) Interface ............27 3.4.5 Ethernet Connector..................28 Revision 1.0 Intel Secret... - Page 4 4.6.1 SCSI Drive Power Control................41 4.6.2 Internal SCSI Drive Power Switching............41 4.6.3 SCSI Drive Status LEDs ................42 Specifications..................... 43 4.7.1 Electrical Specifications ................43 5. Power Interconnect System Board ..............44 Features..................... 44 Intel Secret Revision 1.0...
- Page 5 Chapter Structure and Outline ..............58 Introduction ....................58 Mechanical Interface.................. 59 8.4.1 Power Supply Cage Mechanical Outline ............ 59 8.4.2 DC Input Terminal Block Connector............60 8.4.3 DC Output Connector ................61 8.4.4 Power Supply Module LED Indicators............63 Revision 1.0 Intel Secret...
- Page 6 10.2 Electromagnetic Compatibility..............70 10.3 CE Mark ..................... 70 10.4 NEBS Compliance (DC Input Only) ............71 10.5 ETSI Standards Compliance (DC Input Only) ..........71 Appendix A: Glossary....................72 Appendix B: Reference Documents ................76 Intel Secret Revision 1.0...
- Page 7 ® Intel Carrier Grade Server TIGPT1U TPS List of Figures List of Figures ® Figure 2-1. Intel Carrier Grade Server TIGPT1U ............4 ® Figure 2-2. Intel Carrier Grade Server TIGPT1U (shown with top covers and bezel removed) ........................5 ®...
- Page 8 ® List of Figures Intel Carrier Grade Server TIGPT1U TPS Figure 8-5. Edge Finger Layout..................62 Figure 9-1. Power Subsystem Enclosure Outline Drawing..........66 Figure 9-2. Edge Finger Layout..................68 viii Intel Secret Revision 1.0...
- Page 9 Carrier Grade Server TIGPT1U TPS List of Tables List of Tables ® Table 2-1. Intel Carrier Grade Server TIGPT1U Feature List......... 2 Table 2-2. Front Panel Features ..................9 Table 2-3. System Features - Rear ................14 Table 2-4. Environmental Specifications Summary............20 Table 2-5.
- Page 10 Table 8-5. 250 W Load Ratings..................64 Table 9-1. 250 Watt AC-input Power Supply DC Output Ratings........65 Table 9-2. Edge Finger Pinout ..................67 Table 9-3. LED Indicators....................69 Table 9-4. AC Input Rating.................... 69 Intel Secret Revision 1.0...
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Page 11: Introduction
Carrier Grade Server TIGPT1U TPS Introduction Introduction ® This document provides an overview of the Intel Carrier Grade Server TIGPT1U (Telecom Industrial Grade Prescott 1U (1.75”) high) and includes information on chassis hardware, cables, connectors, SE7210TP1-E System Baseboard, system boards, power subsystem, and regulatory requirements. -
Page 12: System Overview
® This chapter describes the features of the Intel Carrier Grade Server TIGPT1U chassis. System Features ® Table 2-1 provides a list and brief description of the features of the Intel Carrier Grade Server TIGPT1U. ® Table 2-1. Intel Carrier Grade Server TIGPT1U Feature List... -
Page 13: Chapter Structure And Outline
This chapter is organized into the following sections. The content of each section is summarized as follows. Section 2.3: Introduction ® Provides an overview and block diagram of the Intel Carrier Grade Server TIGPT1U. Section 2.4: External Chassis Features ®... -
Page 14: Introduction
SDRAM DIMM memory. The Intel TIGPT1U high availability features include hot swap disk ® drives and remote management. The scalable architecture of the Intel TIGPT1U supports a variety of operating systems (OS). Figure 2-1 shows an isometric view of the system. -
Page 15: Figure 2-2. Intel ® Carrier Grade Server Tigpt1U
® Intel Carrier Grade Server TIGPT1U TPS System Overview ® Figure 2-2. Intel Carrier Grade Server TIGPT1U (shown with top covers and bezel removed) A. Power Supply H. SCSI Hard Disk Drive Bays B. PCI card bracket (full-length) I. Peripheral Bay (CDROM or DVD) C. - Page 16 The front bezel can be customized to meet OEM industrial design requirements. The bezel design allows adequate airflow to cool the system components. The front bezel is removed to access the drive bay. ® Figure 2-3 shows a block diagram of the Intel Carrier Grade Server TIGPT1U with interconnections. Revision 1.0...
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Page 17: Figure 2-3. Intel ® Carrier Grade Server Tigpt1U Block Diagram
2. Drive Carrier 2. Drive Carrier Note: The CDROM/DVD 1/2" Drive is positioned above CDROM/DVD SCSI Hard Drive Bay 1 SCSI Hard Drive Bay 1 SCSI Hard Drive Bay 0 ® Figure 2-3. Intel Carrier Grade Server TIGPT1U Block Diagram Revision 1.0... -
Page 18: External Chassis Features
® System Overview Intel Carrier Grade Server TIGPT1U TPS External Chassis Features 2.4.1 Front View of Chassis Figure 2-4 shows the front view of the system. Figure 2-5 shows the front view of the system with the front bezel removed. Removing the front bezel provides access to the two hot-plug hard drive bays. -
Page 19: Figure 2-6. Front Panel Details
® Intel Carrier Grade Server TIGPT1U TPS System Overview C D E F Figure 2-6. Front Panel Details Table 2-2. Front Panel Features Item Feature Description Front Panel Switches Power switch Toggles the system power Reset switch Resets the system... -
Page 20: Chassis Peripheral Bay And Hot-Plug Scsi Hard Drive Bays
Chassis Peripheral Bay and Hot-Plug SCSI Hard Drive Bays ® The Intel TIGPT1U server chassis provides two hot-swap SCSI hard drive bays at the front of the chassis, along with a peripheral bay that supports either a fixed CDROM Drive (read-only or read/write, or a fixed DVD Drive. -
Page 21: Figure 2-8. Peripheral Drive Bay
® Intel Carrier Grade Server TIGPT1U TPS System Overview the USB connection on the front of the unit or one of the USB connections on the back of the unit. Figure 2-8. Peripheral Drive Bay 2.4.3.1.1 Peripheral Drive Carrier Assembly The CDROM drive or DVD drive is installed in the drive carrier assembly before installing it into the system. -
Page 22: Figure 2-10. Scsi Hard Drive Bays
® System Overview Intel Carrier Grade Server TIGPT1U TPS Prior to installing the drive in the system, (1) the interface board is connected to the back of the drive and secured with two 8mm screws. The drive is then installed in the drive carrier metal... -
Page 23: Rear View Of Chassis
® Intel Carrier Grade Server TIGPT1U TPS System Overview 2.4.3.2.1 Hard Drive Tray Each hard drive used in the system must be mounted to a drive tray using four screws inserted into the sides of the drive as shown in the figure. -
Page 24: Table 2-3. System Features - Rear
® System Overview Intel Carrier Grade Server TIGPT1U TPS Table 2-3. System Features - Rear Item Description USB 1, USB 2, USB 3 PS/2 Mouse DB15 Alarm Connector PCI card bracket (full-height) Power supply AC power input ( AC input power supply shown) -
Page 25: Internal Chassis Features
Figure 2-13. Telecom SE7210TP1-E Server Baseboard Block Diagram ® 4 Processor with hyper-threading technology in a µPGA478 o Support for an Intel Pentium ® socket (3.0 GHz frequency, 1 M L2 cache, 800 MHz Front Side Bus (FSB), 90 nm manufacturing technology). -
Page 26: Full-Height, Full-Length Pci Adapter Subsystem
PC2700 (333 MHz): to run 333 MHz memory at full speed requires an Intel Pentium Processor with 533 MHz system bus frequency. ® Note: PC2700 (333 MHZ) memory will run at 320 MHz frequency when using an Intel ® Pentium 4 Processor with 800 MHz system bus frequency. -
Page 27: Power Subsystem
The 250 watt power supply is capable of ® handling the worst-case power requirements for a fully configured Intel Carrier Grade Server ®... -
Page 28: Cooling Subsystem
Figure 2-15. System Fan Assemblies ® One fan assembly contains two 40 x 48 mm counter rotating fans that are used to cool the Intel Pentium 4 Processor, and also contains one 40 x 28 mm fan that is used to cool the DDR ®... -
Page 29: Server Management
System Overview 2.5.4.3 Cooling Summary The four-fan cooling subsystem is sized to provide cooling for: ® • One Intel Pentium 4 Processor (3.0 GHz frequency, 1 M L2 cache, 800 MHz FSB, ® 90nm manufacturing technology) • The SE7210TP1-E System Baseboard components •... -
Page 30: Specifications
500 Hz at a rate of 0.25 octaves/minute, on all three axes as per Bellcore GR- 63-CORE standard. ® 2.2 Grms, 10 minutes per axis on all three axes as per the Intel Environmental Standards Handbook Shock operating Half-sine 2 G, 11 ms pulse, 100 pulses in each direction, on each of the three ®... -
Page 31: Physical Specifications
® Intel Carrier Grade Server TIGPT1U TPS System Overview 2.7.2 Physical Specifications ® Table 2-5 describes the physical specifications of the Intel TIGPT1U. Table 2-5. Dimensions and Weight Height 1.70 inches (43 mm) Width 16.9 inches (430 mm) Depth 20 inches (509 mm) -
Page 32: Cables And Connectors
Carrier ® Grade Server TIGPT1U. In addition, this chapter includes an overview diagram of the Intel TIGPT1U interconnections, as well as tables describing the signals and pin-outs for the connectors on the various system boards. Refer to the appropriate SE7210TP1-E System Baseboard section or system board sections in this document for other connector signal descriptions and pin-outs. -
Page 33: Interconnect Block Diagram
Intel Carrier Grade Server TIGPT1U TPS Cables and Connectors Interconnect Block Diagram ® Figure 3-1 shows interconnections for all of the boards used in the Intel TIGPT1U. Alarm Conn 2 NIC, 2 USB, COM2, 1 Kybd/ System Baseboard Mouse, 1 Video... -
Page 34: Cable And Interconnect Descriptions
® Cables and Connectors Intel Carrier Grade Server TIGPT1U TPS Cable and Interconnect Descriptions ® Table 3-1 describes all cables and connectors of the Intel Carrier Grade Server TIGPT1U. Table 3-1. System Interconnect Descriptions System Connector Description Cable/Device Connector Description... -
Page 35: Exteranly-Accessible Interconnects
® Intel Carrier Grade Server TIGPT1U TPS Cables and Connectors CDROM Interface Board Connections CDROM I/F 2 x 1 Power Connector CDROM Pwr Cb 2 x 1 Power Connector CDROM I/F 2 x 20 IDE Connector IDE Cable 2 x 20 IDE Connector... -
Page 36: Serial Ports
2 x 5 serial port connector COM2. COM2 is brought out the front of the chassis by an RJ45 ® connector. by cabling between the 2 x 5 serial port connector on the Intel Server Board SE7210TP1-E and a mating connector on the extended front panel board. The following tables detail the pin outs of these two ports. -
Page 37: Video Port
® Intel Carrier Grade Server TIGPT1U TPS Cables and Connectors 3.4.3 Video Port The video port interface is a standard VGA compatible, 15-pin connector. Onboard video is supplied by an ATI* Rage* XL video controller with 8 MB of onboard video SGRAM. -
Page 38: Ethernet Connector
® Cables and Connectors Intel Carrier Grade Server TIGPT1U TPS 3.4.5 Ethernet Connector The server board SE7210TP1-E supports two NIC RJ45 connectors for the Ethernet ports. The following table details the pin-out of each of the connectors. Table 3-7. Magjack Connector (RJ45, 10/100/1000) Pin Out (J5A1, J6A2) -
Page 39: Dc Power Input For Dc-Input Power Supply
® Intel Carrier Grade Server TIGPT1U TPS Cables and Connectors Figure 3-3. AC Power Input Connector 3.4.8 DC Power Input for DC-Input Power Supply A DC power terminal block is provided at the rear of the DC-input power supply. It is recommended to use appropriately sized power wire and DC main. -
Page 40: Extended Front Panel System Board
Carrier Grade Server TIGPT1U TPS Extended Front Panel System Board This chapter describes the basic functions and interface requirements of the Extended Front ® Panel system board that is designed for the Intel Carrier Grade Server TIGPT1U. Features • Four switches to control power-on, reset, NMI, and the system ID LED •... -
Page 41: Introduction
® Intel Carrier Grade Server TIGPT1U TPS Extended Front Panel System Board Introduction The extended front panel system board provides the means of mounting and electrically connecting switches and indicators for system operation and status. These features are accessible and visible from the front of the chassis. In addition, it contains the hard drive hot- plug control circuitry necessary for the hot-plug SCSI disk drives. -
Page 42: Front Panel Leds
® Extended Front Panel System Board Intel Carrier Grade Server TIGPT1U TPS 4.4.2 Front Panel LEDs Table 4-2. LED Specifications LED Function LED Color Peak Wavelength Luminous Luminous (nm) Intensity Intensity Typ(mcd) Min(mcd) White Blue Green Green DRV 1/0 Activity... -
Page 43: System Fault Leds
LEDs. The OEM SKU supports a blue ID LED and red hard disk drive (HDD) fault LEDs. ® Selecting between the two SKUs are done during board build. For an Intel SKU, install a white LED at location DS4J2 and install n-FETs at locations Q5W6 and Q5W2. For an OEM SKU, install a blue LED at location DS4J2 and remove n-FETs at locations Q5W6 and Q5W2. -
Page 44: System Fault Relays
® Extended Front Panel System Board Intel Carrier Grade Server TIGPT1U TPS 4.4.6 System Fault Relays The front panel board contains four relays. These relays are for power, critical, major and minor alarms. The relays are controlled via the SMBus. See Section 4.4.7 for programming information. -
Page 45: Connector Information
Connector Information The following tables show all the connectors on the XFPB and the interconnection to other ® devices within the Intel TIGPT1U. In addition, the first column references the location on the following figure of the connector location. Table 4-8. Extended Front Panel System Board Connector Information... -
Page 46: Figure 4-1. Extended Front Panel Board
Extended Front Panel System Board Intel Carrier Grade Server TIGPT1U TPS Figure 4-2. Extended Front Panel Board Connector Location Table 4-9. Connector Housing Information Conn Function Intel PN s/k/l/p* Extended Front Panel Board J2G1 1 x 8 C13083-007 Molex 43650-0817 y/y/y/y 30u”... -
Page 47: Extended Front Panel Board Usb Connector Pinout
® Intel Carrier Grade Server TIGPT1U TPS Extended Front Panel System Board 4.5.1 Extended Front Panel Board USB Connector Pinout The following table details the pin-out of the USB connector to the SE7210TP1-E System Baseboard. Table 4-10. 8-pin (1 x 8) USB J2G1 Connector... -
Page 48: Extended Front Panel Board Front Panel Connector Pinout
® Extended Front Panel System Board Intel Carrier Grade Server TIGPT1U TPS 4.5.3 Extended Front Panel Board Front Panel Connector Pinout The following table details the pin-out of the front panel connector to the SE7210TP1-E System Baseboard. Table 4-12. 34-pin (2 x 17) Front Panel J8A1 Connector... -
Page 49: Extended Front Panel Board Power/Signal Connector Pinout
® Intel Carrier Grade Server TIGPT1U TPS Extended Front Panel System Board 4.5.5 Extended Front Panel Board Power/Signal Connector Pinout The following table details the pin-out of the power/signal connector to the SE7210TP1-E System Baseboard. Table 4-14. 10-pin (2 x 5) Power/Signal J9A1 Connector... -
Page 50: Extended Front Panel Board Baseboard Power Connector Pinout
® Extended Front Panel System Board Intel Carrier Grade Server TIGPT1U TPS 4.5.7 Extended Front Panel Board Baseboard Power Connector Pinout The following table details the pin-out of the baseboard power connector to the SE7210TP1-E System Baseboard Table 4-16. 20-pin (2 x 10) Baseboard Power J10A1 Connector... -
Page 51: Scsi Power Subsystem
SCSI hot-swappable hard drives that are mated to the midplane peripheral board. The design enables on-demand power delivery of +5 V and +12 V to the SCSI drives, ® without the need to power cycle the Intel TIGPT1U during drive insertion/removal. 4.6.1... -
Page 52: Scsi Drive Status Leds
® Extended Front Panel System Board Intel Carrier Grade Server TIGPT1U TPS 4.6.3 SCSI Drive Status LEDs The status LEDs give the user a visual indication of the drives’ condition. There is a single LED for each drive. The LEDs are bi-colored and use a combination of color and blinking frequency to indicate multiple conditions. -
Page 53: Specifications
Extended Front Panel System Board Specifications 4.7.1 Electrical Specifications ® DC specifications for the Intel TIGPT1U extended front panel board power connectors are summarized in this section. All power rails must operate within +/- 5% voltage range. Table 4-20. Maximum Power Requirements (mA) POWER... -
Page 54: Power Interconnect System Board
Carrier Grade Server TIGPT1U TPS Power Interconnect System Board This chapter describes the basic functions and interface requirements of the power interconnect ® board that is designed for the Intel Carrier Grade Server TIGPT1U. Features • Used to interconnect between the power supply and the extended front panel board •... -
Page 55: Connector Description
® Intel Carrier Grade Server TIGPT1U TPS Power Interconnect System Board Connector Description 5.4.1 Connector Mating to the Power Supply Pinout The following table details the pin-out of the 2 x 31 connector that is used to interface to the card-edge connector on the 250 watt power supply. -
Page 56: Connector Mating To The Extended Front Panel System Board Pinout
® Power Interconnect System Board Intel Carrier Grade Server TIGPT1U TPS 5.4.2 Connector Mating to the Extended Front Panel System Board Pinout The following table details the pin-out of the 2 x 31 connector that is used to interface to the card-edge connector on the extended front panel system board. -
Page 57: Nebs 3.3 V Riser Board
Carrier Grade Server TIGPT1U TPS NEBS 3.3 V Riser Board NEBS 3.3 V Riser Board ® This chapter describes the design and external interface of the Intel TIGPT1U NEBS 3.3 V riser board. Features of the NEBS 3.3 V riser board include: •... -
Page 58: Connector Interface
® NEBS 3.3 V Riser Board Intel Carrier Grade Server TIGPT1U TPS 1/1 – Board 8 – Connector 10028958-X3184 Conn, PCI, 3.3 V, Low Profile 1 x 3 Connector – Molex 39-30-3036 Figure 6-1. Physical Layout of NEBS 3.3 V Riser Board Connector Interface Table 6-1 describes the common signals between the edge finger and the system baseboard. -
Page 59: Table 6-2. Pci Card Connector Signals
® Intel Carrier Grade Server TIGPT1U TPS NEBS 3.3 V Riser Board Side B Side A Side B Side A AD[27] AD[26] AD[61] Ground AD[25] Ground +3V_IO AD[60] +3.3 V AD[24] AD[59] AD[58] C/BE[3]# IDSEL AD[57] Ground AD[23] +3.3 V... -
Page 60: Nebs Riser Power Connector Pinout
® NEBS 3.3 V Riser Board Intel Carrier Grade Server TIGPT1U TPS Side B Side A Side B Side A Ground RST# Connector Key Connector Key +3V_IO Connector Key Connector Key Ground GNT_N Reserved Ground REQ_N Ground Ground C/BE[7]# +3V_IO... -
Page 61: Electrical Specification
® Intel Carrier Grade Server TIGPT1U TPS NEBS 3.3 V Riser Board Electrical Specification The PCI slot on the riser is limited to a maximum of 25 W total power from the installed PCI adapter. This maximum power per slot conforms to PCI Specification 2.2. -
Page 62: Midplane Board
Intel Carrier Grade Server TIGPT1U TPS Midplane Board ® This chapter describes the design and external interface of the Intel TIGPT1U Midplane system board. Features of the midplane system board include: • SCSI Hot Swap Hard Disk Drive SCA Connectors •... -
Page 63: Functional Description
® Intel Carrier Grade Server TIGPT1U TPS Midplane Board Functional Description The SCSI subsystem on the midplane board is designed to give the end user support for two SCSI hot-plug hard drives. The design enables easy use and replacement of the SCSI hard drives without powering down the system. -
Page 64: Scsi Bus
® Midplane Board Intel Carrier Grade Server TIGPT1U TPS 7.3.2 SCSI Bus The midplane system board SCSI subsystem passes the SCSI bus from the SE7210TP1-E System Baseboard to the internal SCSI drives. The SCSI bus is Ultra 320 (SPI-4) capable. -
Page 65: Table 7-1. Lvd Scsi Bus Signals - J2L1, J4A1, J8A1
® Intel Carrier Grade Server TIGPT1U TPS Midplane Board 7.3.4.1 LVD SCSI Connectors The low voltage differential (LVD) connector carries signals between the midplane SCSI bus and internal SCSI drives through the SCSI SCA connectors. The LVD SCSI bus’s signals are driven by either the baseboard SCSI controller, the LVD/SE Transceiver, or the internal SCSI drives. -
Page 66: Connector Interface
® Midplane Board Intel Carrier Grade Server TIGPT1U TPS Signal Type Driver Name and Description Ground. These pins provide Secondary Ground reference. P12V +12-V supply. Max 1.5 A of continuous current. Max 5 amps peak current. +5-V supply. Max 1.5 A of continuous current. Max 5 amps peak current. -
Page 67: Midplane Power/Signal Connector Pinout
2 is hardwired to SCSI ID 1 on the SCSI bus. Specifications 7.5.1 Electrical Specifications ® DC specifications for the Intel TIGPT1U midplane system board power connectors are summarized in this section. All power rails must operate within +/- 5% voltage range. Table 7-5. MPB Power Requirements POWER... -
Page 68: Dc Power Subsystem
DC Power Subsystem This chapter defines the features and functionality of the DC-input power supply. The DC-input ® power supply will be NEBS hardened, so NEBS certification of the Intel Carrier Grade Server ® TIGPT1U will be performed with the Intel TIGPT1U configured with a DC-input power supply. -
Page 69: Mechanical Interface
DC Power Subsystem Mechanical Interface 8.4.1 Power Supply Cage Mechanical Outline ® The Intel Carrier Grade Server TIGPT1U’s C-input power supply mechanical outline and dimensions are shown below. The unit of measurement is millimeters. Air Flow direction Figure 8-1. Power Subsystem Enclosure Outline Drawing Note: The power subsystem enclosure has dimensions of 40.0 mm (1.57”) H X 106.0 mm... -
Page 70: Dc Input Terminal Block Connector
® DC Power Subsystem Intel Carrier Grade Server TIGPT1U TPS 8.4.2 DC Input Terminal Block Connector The power input DC line connector is a 4-position terminal strip that accepts crimp ring terminals. The terminal strip has 0.325” (8.26 mm) center spacing and accepts 0.25” outside diameter (OD) crimp ring terminals for up to 14 AWG wire. -
Page 71: Dc Output Connector
® Intel Carrier Grade Server TIGPT1U TPS DC Power Subsystem 8.4.3 DC Output Connector The power supply provides card edge fingers, which mate to a connector located in the system. This is a blind mating type connector that connects the power supply’s output voltages and signals. - Page 72 ® DC Power Subsystem Intel Carrier Grade Server TIGPT1U TPS Top View of Power Supply Keying Notch 7.62 MIN 21.59 +/-0.05 1.27 1.27 +/-0.05 6.35 +/-0.05 6.35 +/-0.05 6.35 +/-0.05 6.35 +/-0.05 1.07 +/-0.05 0.38 x 45 9 spaces @ 2.54 51.89 +/-0.05...
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Page 73: Power Supply Module Led Indicators
® Intel Carrier Grade Server TIGPT1U TPS DC Power Subsystem 8.4.4 Power Supply Module LED Indicators There is a single bi-color LED to indicate power supply status. When DC line is applied to the Power Supply Unit (PSU) and standby voltages are available the LED blinks green. The LED turns on solid green to indicate that all the power outputs are available. -
Page 74: Dc Output Current Specifications
® DC Power Subsystem Intel Carrier Grade Server TIGPT1U TPS 8.5.3 DC Output Current Specifications The combined output power of all outputs can not exceed 250 W. Each output has a maximum and minimum current rating shown. The power supply meets both static and dynamic voltage regulation requirements for the minimum loading conditions. -
Page 75: Ac Power Subsystem
This chapter defines the features and functionality of the AC-input switching power subsystem. ® The AC power supply will not be NEBS hardened, so NEBS certification of an Intel Carrier Grade Server TIGPT1U configured with an AC power subsystem will not be possible. -
Page 76: Mechanical Interface
Carrier Grade Server TIGPT1U TPS Mechanical Interface 9.4.1 Power Supply Cage Mechanical Outline ® The Intel TIGPT1U’s AC-input power supply mechanical outline and dimensions are shown below. The unit of measurement is millimeters. Air Flow direction Figure 9-1. Power Subsystem Enclosure Outline Drawing Note: The power subsystem enclosure has dimensions of 40.0 mm (1.57”) H X 106.0 mm... -
Page 77: Dc Output Connector
® Intel Carrier Grade Server TIGPT1U TPS AC Power Subsystem 9.4.3 DC Output Connector The power supply provides card edge fingers, which mate to a connector located in the system. This is a blind mating type connector that connects the power supply’s output voltages and signals. - Page 78 ® AC Power Subsystem Intel Carrier Grade Server TIGPT1U TPS Top View of Power Supply Keying Notch 7.62 MIN 21.59 +/-0.05 1.27 1.27 +/-0.05 6.35 +/-0.05 6.35 +/-0.05 6.35 +/-0.05 6.35 +/-0.05 1.07 +/-0.05 0.38 x 45 9 spaces @ 2.54 51.89 +/-0.05...
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Page 79: Power Supply Module Led Indicators
® Intel Carrier Grade Server TIGPT1U TPS AC Power Subsystem 9.4.4 Power Supply Module LED Indicators There is a single bi-color LED to indicate power supply status. When AC is applied to the PSU and standby voltages are available the LED blinks green. The LED turns on solid green to indicate that all the power outputs are available. -
Page 80: 10. Regulatory Specifications
Regulatory Specifications Intel Carrier Grade Server TIGPT1U TPS 10. Regulatory Specifications ® The Intel Carrier Grade Server TIGPT1U meets the specifications and regulations for safety and EMC defined in this chapter. 10.1 Safety Compliance USA/Canada UL 60950, 3rd Edition/CSA 22.2, No. 60950-0, 3rd Edition... -
Page 81: Nebs Compliance (Dc Input Only)
Intel Carrier Grade Server TIGPT1U TPS Regulatory Specifications 10.4 NEBS Compliance (DC Input Only) ® The Intel TIGPT1U with DC input is compliant with the following NEBS specifications: • NEBS GR-63-CORE, Issue 2 – Physical Protection • NEBS GR-1089-CORE, Issue 3 – Electromagnetic Compatibility and Electrical Safety 10.5 ETSI Standards Compliance (DC Input Only) -
Page 82: Appendix A: Glossary
Error checking and correcting EEPROM Electrical erasable programmable read-only memory Electromagnetic compatibility Electromagnetic interference Emergency management port European Standard (Norme Européenne or Europäische Norm) External product specification ESCD Extended system configuration data Electrostatic discharge Equivalent series resistance Fahrenheit Intel Secret Revision 1.0... - Page 83 ® Intel Carrier Grade Server TIGPT1U TPS Appendix A: Glossary Term Definition Federal Communications Commission Flexible flat connector Flash ROM EEPROM Front panel controller Fault resilient booting Field replaceable unit Acceleration in gravity units, 1G = 980665 m/s Gigabyte - 1024 MB...
- Page 84 Sverge Elektriske Materiellkontroll (Swedish Board of Testing and Approval of Electrical Equipment) SGRAM Synchronous graphics RAM Server management SMBIOS System management BIOS SMBus Subset of I C bus/protocol (developed by Intel) System management interrupt Server management mode Symmetric multiprocessing SMRAM System management RAM Server management software Intel Secret Revision 1.0...
- Page 85 ® Intel Carrier Grade Server TIGPT1U TPS Appendix A: Glossary Term Definition Serial presence detect Server system infrastructure Technischer Uberwachungs-Verein (A safety testing laboratory with headquarters in Germany) Underwriters Laboratories, Inc. Universal Serial Bus Under-voltage Volt Volt-amps (volts multiplied by amps)
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Page 86: Appendix B: Reference Documents
• Intel 82541EI Gigabit Ehternet Controller Datasheet, Intel Corporation, http://www.intel.com/design/network/products/lan/controllers/82541gi.htm Flash • Intel 5 VOLT FlashFile™ Memory (28F008SA x8) Datasheet, December 1998, Intel Corporation, Number 290429-008, http://developer.intel.com/design/flcomp/datashts/290429.htm. • Intelligent Input/Output (I O) Architecture Specification, Revision 1.0, I O Special Interest Group, http://www.Intelligent-IO.com... - Page 87 PC SDRAM Registered DIMM Specification, Revision 1.2, Intel Corporation, http://developer.intel.com/technology/memory/. • PC SDRAM Specification, Revision 1.63, Intel Corporation, http://developer.intel.com/technology/memory/. • PC SDRAM Serial Presence Detect (SPD) Specification, Revision 1.2A, Intel Corporation, http://developer.intel.com/technology/memory/. • PCI Bus Power Management Interface Specification, Revision 1.1, PCI Special Interest Group, http://www.pcisig.com/. •...
- Page 88 Server Management • Emergency Management Port v1.0 Interface External Product Specification, Revision 0.83, Intel Corporation. • Intelligent Platform Management Interface (IPMI) Specification, Version 1.0, Revision 1.1, Intel Corporation, http://developer.intel.com/design/servers/ipmi/spec.htm. SMBIOS • System Management BIOS Reference Specification, Version 2.3, http://www.ptltd.com/techs/specs.html. Super I/O •...
- Page 89 ® Intel Carrier Grade Server TIGPT1U TPS Appendix B: Reference Documents Wired for Management • Wired for Management (WfM) Baseline Specifications, Version 2.0, Intel Corporation, http://developer.intel.com/ial/wfm/wfmspecs.htm. Windows • Hardware Design Guide for Microsoft* Windows NT Server*, Version 2.0, http://www.microsoft.com/HWDEV/serverdg.htm. Miscellaneous •...