Hp Thermal Logic Technologies; Active Cool 200 Fans - HP Xw460c - ProLiant - Blade Workstation Overview

Figure 12. HP BladeSystem c7000 interconnect bay crosslinks as indicated by the arrows

HP Thermal Logic technologies

The HP BladeSystem c7000 Enclosure incorporates a variety of HP Thermal Logic technologies,
including mechanical design, built-in power and thermal monitoring, and control capabilities. Thermal
Logic technologies can provide significant power and cooling savings compared to traditional rack
and tower based servers.
temperature at the server, enclosure, or rack level. They automatically adjust power and thermal
controls to minimize power and cooling use while maintaining adequate cooling for all devices and
ensuring high availability.
HP Thermal Logic technologies include the following elements and capabilities:

Active Cool 200 fans

Parallel Redundant Scalable Enclosure Cooling (PARSEC) design
Instant power and thermal monitoring
Pooled power for a variety of power redundancy modes
Dynamic Power Saver mode
Power Regulator
Dynamic Power Capping
Active Cool 200 fans
Quite often, dense, full-featured, small form-factor servers use very small fans designed to provide
localized cooling in the specific areas needed by the server blade. Because such fans generate fairly
low airflow (in cubic feet per minute, or CFM) at medium back pressure, a single server often requires
multiple fans to ensure adequate cooling. If each server blade contains several fans, installing many
server blades together in an enclosure can result in a significant cost and space overhead.
A second solution for cooling is to use larger, blower-style fans that can provide cooling across an
entire enclosure. Such fans generate high airflow, but they typically require higher power input and
more space. They are loud and must be designed for the maximum load in an enclosure. As a result,
designers may have to sacrifice server features to allow large, high-power fans to fit in the enclosure.
Even then, ensuring adequate airflow to all the servers without leakage, over provisioning, or bypass
is a challenge.
3 For more information see the IDC technical brief titled ―Next-Generation Power and Cooling for Blade
Environments‖: http://h20195.www2.hp.com/v2/GetPDF.aspx/4AA2-5177ENW.pdf
3 Thermal Logic technologies also provide an instant view of power use and
.
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