Airflow Requirements; Blanking Panels; Hp Rack Airflow Optimization Kit; Space Requirements - HP BL685c - ProLiant - 4 GB RAM Site Planning Manual

Airflow requirements

HP rack-mountable products typically draw in cool air through the front and exhaust warm air out through
the rear of the rack. The front door of the rack must be ventilated adequately to enable ambient room air
to enter the rack with as little restriction as possible. Likewise, the rear door must offer as little restriction
as possible to the warm air escaping from the rack.
The free area of a door determines the amount of airflow that can pass through the doors. Rack doors
must have a minimum of 63% free area compared to the total area of the door. Some doors appear to
have sufficient free area but do not.
To prevent air recirculation from the rear of the rack, the computer room air conditioning system must
deliver sufficient airflow to the front of the rack to meet the airflow requirements of the installed equipment
in the rack. Idle, normal operating, and maximum airflow requirements for blade configurations can be
obtained from the HP Blade Power Sizer on the HP website
(http://www.hp.com/go/bladesystem/powercalculator).
Route cables away from fans and air inlets and outlets to ensure proper airflow. Improperly routed cables
can impede airflow, cause the cooling fans to work harder, consume more power, and reduce cooling
system efficiency.

Blanking panels

If the front of the rack is not filled completely with components, unused equipment mounting space
between the components can adversely affect cooling within the rack. Cover unused equipment mounting
space with blanking panels.
Seal air gaps in the rack and between adjacent racks to prevent recirculation of hot-air from the rear of
the rack to the front of the rack. Use cable brushes to seal cable entry and exit cutouts and cabinet fillers
to seal the space between the cabinets to provide improved cooling efficiency.

HP Rack Airflow Optimization Kit

The HP Rack Airflow Optimization Kit helps seal air gaps inside the rack, between two bayed racks, and
the clearance between the floor and the rack. The kit also prevents hot exhaust air from the rear of the
rack from reaching the front of the rack through pressure differential between the hot and cold aisles. This
feature maximizes server cold air intake, which improves datacenter cooling efficiency and reduces
datacenter power usage.
The HP Rack Airflow Optimization Kit supports all HP 10000 Series (G1 and G2) rack heights including
22U, 36U, 42U, and 47U. It also supports 800-mm wide HP racks.

Space requirements

When deciding where to place your rack:
•
At least 1219 mm (48 in) of clearance is needed all the way around the pallet and above the rack
to enable the removal of the packing material.
•
At least 1219 mm (48 in) of clearance is needed in front of the rack to enable the door to open
completely.
Environmental requirements 19