1. Manuals
  2. Brands
  3. LG Manuals
  4. Cell Phone
  5. KE600
  6. Service manual

LG KE600 - Cell Phone Service Manual

Service manual
Hide thumbs Also See for KE600 - Cell Phone:
Table of Contents

Advertisement

Quick Links

Download this manual See also: User Manual
Service Manual
KE600
Date: October, 2006 / Issue 1.0

Advertisement

Table of Contents
loading

Related Manuals for LG KE600 - Cell Phone

Summary of Contents for LG KE600 - Cell Phone

  • Page 1 Service Manual KE600 Date: October, 2006 / Issue 1.0...
  • Page 2 REVISED HISTORY Editor Date Issue Contents of Changes S/W Version S. H. RYU 2006/07/06 Initial Release S. H. RYU 2006/08/24 The second Release S. H. RYU 2006/10/16 Final Release * The information in this manual is subject to change without notice and should not be construed as a commitment by LGE Inc.
  • Page 3 - 4 -...

  • Page 4: Table Of Contents

    Table Of Contents 1. INTRODUCTION .......7 5. Trouble shooting......76 1.1 Purpose ..........7 5.1 Trouble shooting test setup....76 1.2 Regulatory Information......7 5.2 Power on Trouble........76 1.3 ABBREVIATION ........9 5.3 Charging trouble ........80 5.4 LCD display trouble........82 2. PERFORMANCE ......11 5.5 Camera Trouble ........83 2.1 H/W Features.........11 5.6 Speaker trouble........86...
  • Page 5 - 6 -...

  • Page 6: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of the KE600/KE608. 1.2. Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges you’re your telecommunications services.
  • Page 7 1. INTRODUCTION E. Notice of Radiated Emissions The KE600/KE608 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 8: Abbreviation

    1. INTRODUCTION 1.3 ABBREVIATION For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current - Constant Voltage Cigar Lighter Adapter Digital to Analog Converter Digital Communication System dB relative to 1 milli-watt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory...
  • Page 9 1. INTRODUCTION LG Electronics OPLL Offset Phase Locked Loop Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave...

  • Page 10: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Feature Item Feature Comment Li-Poly, 950mAh Standard Battery Battery Size :36.50(W)x58.50(H)x3.65(T)[mm] AVG TCVR Current 280mA Standby Current <2.7 mA @PP9 Talk time Up to 3 hours (GSM900,TX Level :5) Standby time Up to 220 hours (Paging period :9, RSSI: -85dBm ) Charging time Under 3 hours RX Sensitivity...

  • Page 11: Technical Specification

    2. PERFORMANCE 2.2 Technical specification Item Description Specification GSM900 TX: 890 + 0.2 x n MHz RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 ) EGSM Frequency Band TX: 890 + 0.2 x (n-1024) MHz RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 ) DCS1800 TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885)
  • Page 12 2. PERFORMANCE Item Description Specification GSM900/EGSM Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 Output RF Spectrum 6,000 (due to modulation) DCS1800/PCS1900 Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000...
  • Page 13 2. PERFORMANCE Item Description Specification DCS1800/PCS1900 Offset from Carrier (kHz). Max. (dBm) Output RF Spectrum (due to switching transient) 1,200 1,800 Spurious Emissions Conduction, Emission Status GSM900/EGSM BER (Class II) < 2.439% @-102dBm Bit Error Ratio DCS1800/PCS1900 BER (Class II) < 2.439% @-100dBm Rx Level Report accuracy 3 dB 8 3 dB...
  • Page 14 2. PERFORMANCE Item Description Specification STMR 13 5 dB Stability Margin > 6 dB dB to ARL (dB) Level Ratio (dB) 17.5 22.5 30.7 Distortion 33.3 33.7 31.7 25.5 Side tone Distortion Three stage distortion < 10% <Change> System frequency 2.5ppm (26 MHz) tolerance <Change>32.768KHz tolerance...
  • Page 15 2. PERFORMANCE Item Description Specification Battery Bar Number Voltage( 0.05V) 3.86V~4.2V Battery Indicator 3.75V~3.85V 3.75V~3.69V 3.69V~3.58V 3.58V~ 3.58V↓ 0.05V (Call) Low Voltage Warning 3.50V↓ 0.05V (Standby) Forced shut down Voltage 3.35 0.05 V Li-ion Battery Standard Voltage = 3.7 V Battery Type Battery full charge voltage = 4.2 V Capacity: 950mAh...
  • Page 16 2. PERFORMANCE * EDGE RF Specification (Option: KE608 is not serviced for “EDGE mode”) Item Description Specification RMS EVM Peak EVM Percentile EVM ≥ Origin Offset Suppression 30dB GSM900/EGSM Level Power Toler. Level Power Toler. 27dBm 17dBm 27dBm 15dBm 27dBm 13dBm 27dBm 11dBm...
  • Page 17 2. PERFORMANCE Item Description Specification Output RF Spectrum DCS1800, PCS1900 (due to modulation) Offset from carrier(kHz) Max. dBc +0.5 600~<1,200 1,200~<1,800 1,800~<3,000 3,000~<6,000 6,000 Output RF Spectrum GSM900/EGSM (due to switching transient) Offset from carrier(kHz) Max. dBm 1,200 1,800 --30 DCS1800, PCS1900 Offset from carrier(kHz) Max.

  • Page 18: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF Baseband circuit 3.1 KE600 / KE608 Component Block diagram. Figure 1 KE600/KE608 Hardware architecture KE600/KE608 is composed with 3 different PCB part such as main PCB, sub PCB and FPCB. - 19 -...
  • Page 19 3. TECHNICAL BRIEF The functional component arrangement is mentioned below diagram. Figure 2 KE600/KE608 Functional block diagram - 20 -...

  • Page 20: Baseband Processor (Bbp) Introduction

    3. TECHNICAL BRIEF 3.2. Baseband Processor (BBP) Introduction Figure 3. Top level block diagram of the S-GOLD2 (PMB8876) 3.2.1 General Description S-GOLD2 is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital functionality of a cellular radio. Additionally S-GOLD2 Provides multimedia extensions such as camera, software MIDI, MP3 sound.

  • Page 21: Block Description

    3. TECHNICAL BRIEF 3.2.2. Block Description • Processing core ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the Jazelle Java extension for Java acceleration. - TEAKLite DSP core • ARM-Memory - 32k Byte Boot ROM on the AHB - 96k Byte SRAM on the AHB, flexibly usable as program or data RAM - 16k Byte Cache for Program (internal) - 8k Byte tightly coupled memory for Program(internal)
  • Page 22 3. TECHNICAL BRIEF - Advanced static and dynamic power management features including TDMA-Frame synchronous low power mode and enhanced CPU modes(idle and sleep modes) - Pulse Number Modulation output for Automatic Frequency Correction(AFC) - Serial RF Control interface: support of direct conversion RF - A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial data transmission - 1 Serial Synchronous SPI compatible interfaces in the controller domain...
  • Page 23 3. TECHNICAL BRIEF 3.2.5. USART Interface KE600/KE608 have two UART Drivers as follow : - USART1 : Hardware Flow Control / SW upgrade / Calibration - USART2 : SW debug trace. Table 3 USART Interface Spec. USART_0(USART1) Resource Name Remark USART0_TXD TXD_0 Transmit Data...
  • Page 24 3. TECHNICAL BRIEF 3.2.7. GPIO map Over a hundred allowable resources, KE600/KE608 is using as follows except dedicated to SIM and Memory. KE600/KE608 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table. Table 5 S-Gold2 GPIO pin Map Port function KE820 Net Name Description...
  • Page 25 3. TECHNICAL BRIEF MEMORY &CLK GPIO_20 F_DPD For INTEL Memory CLK32K CLK32K For FM Radio & BLUETOOTH GPIO_22 Not Use CAMERA I/F CIF_D0 CIF_D(0) Camera DATA[0] CIF_D1 CIF_D(1) Camera DATA[1] CIF_D2 CIF_D(2) Camera DATA[2] CIF_D3 CIF_D(3) Camera DATA[3] CIF_D4 CIF_D(4) Camera DATA[4] CIF_D5 CIF_D(5)
  • Page 26 3. TECHNICAL BRIEF GPIO_99 CHG_LED_CTRL Charging indicator LED control GPIO_100 TF_PWR_EN TransFlash card power enable(active High) DIF_RESET1_GPIO DIF_RESET1 LCD Reset EINT6 REMOTE_INT For Remote Control Headset I2C_SCL For SM-Power, FM Radio, Audio AMP I2C_SDA " PM_INT (EINT) PM_INT SM-Power interrupt SIM CARD CC_IO SIM_IO SIM CARD I/O...
  • Page 27 3. TECHNICAL BRIEF I2S1_RX I2S1_RX For Bluetooth I2S1_TX I2S1_TX " I2S1_WA0 I2S1_WA0 " MMCI_DAT[1] TF_DAT1 For T-Flash MMCI_DAT[2] TF_DAT2 " MMCI_DAT[3] TF_DAT3 " AUDIO I/F EPN1 RCV_N For Receiver EPP1 RCV_P " EPPA1 BBP_SND_L For Speaker EPPA2 BBP_SND_R For Speaker MICN1 MIC1_N For Mic...
  • Page 28 3. TECHNICAL BRIEF TRIG_IN TRIG_IN " MON1 MON1 " MON2 MON2 " TRACESYNC TRACESYNC " TRACECLK TRACECLK " PIPESTAT[2] PIPESTAT[2] " PIPESTAT[1] PIPESTAT[1] " PIPESTAT[0] PIPESTAT[0] " TRACEPKT[0] TRACEPKT[0] " TRACEPKT[1] TRACEPKT[1] " TRACEPKT[2] TRACEPKT[2] " TRACEPKT[3] TRACEPKT[3] " TRACEPKT[4] TRACEPKT[4] "...
  • Page 29 3. TECHNICAL BRIEF EBU_RD_n Read strobe EBU_BC0_n _BC0 EBU_BC1_n _BC1 EBU_A[0] A(0) Address bus[0] EBU_A[1] A(1) Address bus[1] EBU_A[2] A(2) Address bus[2] EBU_A[3] A(3) Address bus[3] EBU_A[4] A(4) Address bus[4] EBU_A[5] A(5) Address bus[5] EBU_A[6] A(6) Address bus[6] EBU_A[7] A(7) Address bus[7] EBU_A[8] A(8)
  • Page 30 3. TECHNICAL BRIEF EBU_WAIT_n _WAIT EBU_SDCLKO SDCLKO EBU_SDCLKI SDCLKI EBU_BFCLKO BFCLKO EBU_BFCLKI BFCLKI EBU_CKE SSC1_SCLK F_DPD T_OUT0 TXON_PA RF Power amp turn on GPIO_44 VIBRATOR_EN Vibrator enable(High: enable, Low:disable) T_OUT2 PA_BAND RF band select T_OUT3 ANT_SW1 RF FEM control signal 1 T_OUT4 ANT_SW2 RF FEM control signal 2...
  • Page 31 3. TECHNICAL BRIEF F32K Sleep crystal 32.768KHz OSC32K Sleep crystal 32.768KHz RESET_n _RESET Baseband processor reset CC1CC1IO TRIG_OUT For JTAG & ETM Interface Wake up signal to alarm (High; RTC_OUT RTC_OUT wake up, Low: Power off) VCXO_EN VCXO_EN 26MHz clock enable DSPIN0 _BT_RESET Bluetooth chip reset...

  • Page 32: Power Management Ic

    3. TECHNICAL BRIEF 3.3. Power management IC 3.3.1. General Description SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has been specially designed for usage with S-Gold2. Although optimized for usage with the Infineon S- GOLD baseband device it is suitable for the S-GOLDlite and the E-GOLD+ baseband devices as well.
  • Page 33 3. TECHNICAL BRIEF Figure 4 Top level block diagram of the SM-Power(PMB6812) SM-POWER is a further step on the successful E-Power product line with enhanced and optimized functionality. SM-POWER features a baseband supply concept with a DC/DC step-down converter (SDBB) cascaded by two linear regulators (LBB1/2) - SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone functions (e.g.
  • Page 34 3. TECHNICAL BRIEF SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off the linear regulator LBB1 for the DSP during mobile standby whenever this subsystem is not used. In this phase the ARM controller and most peripherals including parts of the on-chip SRAM are kept powered-up with power being supplied by the other linear regulator LBB2.
  • Page 35 3. TECHNICAL BRIEF Table 6 LDO Output Table of SM-Power Net name Output Voltage Output Current Usage SDBB 1V8_MEM 1.8V 850mA Memory & for LDO LRFC 1V5_RF 1.5V 120mA RF transceiver LBB1 1V5_DSP 1.5V 170mA DSP in BBP LBB2 1V5_CORE 1.5V 300mA ARM core in BBP...
  • Page 36 3. TECHNICAL BRIEF VCHG 2V11_RTC 1V5_CORE 1V5_DSP 2V85_RF VBAT 2V7_VCXO 2V65_BT R202 220K R203 4.7K RTC_OUT PWRON VBACKUP R204 470K SPOWER_INT VCH_CTL C203 C204 C205 C206 C207 C208 C209 PMRSTn VBAT 2.2u 2.2u 2.2u 2.2u 2.2u 2.2u 2.2u 1V8_MEM 3V1_USB 1V5_RF VBAT 2V65_ANA...
  • Page 37 3. TECHNICAL BRIEF 3.3.2. Charging SM-POWER provides together with an external p-channel FET Siliconix Si3455 an external AC- adapter a complete charge control function for charging of Li-Ion or Li-Ion-Polymer batteries. Either a 1-cell Li-Ion or Li-Ion-Polymer battery with 4.1, 4.2 or 4.4 Volts may be used. Figure 7 Battery Block Indication 1.

  • Page 38: Power On/Off

    3. TECHNICAL BRIEF 3.4. Power ON/OFF KE600/KE608 Power State : Defined 3cases as follow ] Power-ON : Power key detect ( SM-Power’s ON port ] Power-ON-charging : Charger detect. ] Power-ON-remote : remote power on detect (Factory use only) Figure 8 Power on application. Input ON is a power-on input for SM-POWER with 2 active high levels (see Figure 8).

  • Page 39: Sim Interface

    3. TECHNICAL BRIEF VBAT R213 U203 NLAST4599DFT2G VBAT 6 NO R215 U206 R1114D281D-TR-F PWRON R252 VOUT RPWRON END_KEY C240 GND1 RPWRON_EN GND2 C244 C245 RPWRON 100p 1000p VBAT KP_OUT1 R401 2SC5585 END_KEY Q401 END_KEY R402 KP_IN5 Figure9 Remote power on and End-key power on circuit 3.5.

  • Page 40: Memory

    3. TECHNICAL BRIEF 3.6. Memory 1Gbit Flash & 512Mbit SDRAM employed on KE600/KE608 with 16 bit parallel data bus thru ADD(0) ~ ADD(24). The 256Mbit Sibley Wireless Flash memory with LPSDRAM stacked device family offers multiple high-performance solutions. The Sibley flash die is manufactured on 90 nm process technology.

  • Page 41: Lcd Display

    3. TECHNICAL BRIEF 3.7. LCD Display LCD module include: - LCD : 240 x 320 262K Colors TFT LCD - Backlight : 3 piece of white LED illumination LCD module is connected to sub board thru 35 pins connector. LCD FPC Interface Spec: Table 7 LCD FPC Interface Spec.

  • Page 42: Keypad Switching & Scanning

    3. TECHNICAL BRIEF 3.8. Keypad Switching & Scanning The keypad interface is a peripheral which can be used for scanning keypads up to 8 rows (outputs from Port Control Logic) and 8 columns (inputs to PCL). The number of rows and columns depend on settings of the PCL.

  • Page 43: Keypad Back-Light Illumination

    3. TECHNICAL BRIEF Numeric keys, Camera key and volume up & down keys are located on the MAIN PCB, Jog key for menu navigation, Power on (End key), MP3 hot key and Send key is on the SUB PCB, are connected via 50pin board to board connector between main PCB and FPCB.
  • Page 44 3. TECHNICAL BRIEF VBAT 05.09.05 JOG LED ANODE AND CATHODE FOR 4 LEDs R123 2.7K SLIDE_KEY_BACKLIGHT JOG_LED_ANODE JOG_LED_CATHODE C107 R124 0.1u Q101 EMX18 R131 KEYPAD BACKLIGHT BLUE LED KEYPAD BACKLIGHT DRIVER Figure 15 SUB Keypad Back-light LEDs VBAT R420 KEY_BACKLIGHT R421 Figure 16 Keypad Back-light LEDs - 45 -...

  • Page 45: Lcd Back Light Illumination

    3. TECHNICAL BRIEF 3.10. LCD back light illumination Employed the AAT2807 is a dual charge pump designed to support both the white LED backlight and flash applications for systems operating with lithium-ion/polymer batteries. The backlight charge pump is capable of driving up to three LEDs at a total of 60mA. The current sinks may be operated individually or in parallel for driving higher current LEDs.
  • Page 46 3. TECHNICAL BRIEF Figure 19 S2Cwire EN/SET port control method Table 8. Charge pump IC LCD part current setting table - 47 -...

  • Page 47: Battery Current Consumption Monitor

    3. TECHNICAL BRIEF 3.11 Battery current consumption monitor KE600/KE608 use a current monitoring function to calculate the battery capacity and the remaining time, as monitoring current flow from the battery thru 47mohm resistor. VSUPPLY CN404 R462 BATT_TEMP R465 IOUT I_MONITOR 47mohm VBAT LOAD...

  • Page 48: Audio

    3. TECHNICAL BRIEF 3.13. Audio KE600/KE608 Audio signal flow diagram as following diagram. Figure 22 Audio signal flow diagram - 49 -...
  • Page 49 3. TECHNICAL BRIEF 3.13.1. Audio amplifier sub system IC with 3D effect Audio amplifier sub system IC is an audio power amplifier capable of delivering 540mW of continuous average power into a mono 8ߟ bridged-tied load(BTL) with 1% THD+N, 35mW per channel of continuous average power into stereo 32ߟ...
  • Page 50 3. TECHNICAL BRIEF 3.13.2. Microphone The microphone is a omni-directional microphone condenser microphone with -42 3dB sensitivity. C342 C343 MIC301 R364 C344 0.1u MIC1_P R365 C345 0.1u MIC1_N OB4-15L42-C33L C349 C350 R345 1.2K VMICN C351 1000p R348 1.2K VMICP C367 Figure 25 Microphone with Gain switching circuit - 51 -...

  • Page 51: Usb Charging Circuit

    3. TECHNICAL BRIEF 3.14. USB charging circuit The USB charging circuit is a fully integrated USB VBUS voltage single-cell Li-ion battery charger circuit. The charger uses a CC/CV charge profile required by Li-ion batteries. CC charging current and End of charging current is programmable I &...

  • Page 52: Fm Radio With Rds Function

    3. TECHNICAL BRIEF 3.15 FM radio with RDS function The FM receiver uses a digital low-IF architecture which allows for the elimination of external components and factory adjustments. The receive (RX) section integrates a low noise amplifier (LNA) supporting the worldwide FM broadcast band (87.5 to 108 MHz). An automatic gain control (AGC) circuit controls the gain of the LNA to optimize sensitivity and rejection of strong interferers.

  • Page 53: Bluetooth

    3. TECHNICAL BRIEF 3.16. BLUETOOTH Figure 28 BLUETOOTH Functional block diagram. - 54 -...

  • Page 54: General Features

    3. TECHNICAL BRIEF 3.16.1. General Features • Single Chip Bluetooth device for cellular applications integrating radio, baseband and memory • Fabricated in advanced low power 0.13•Ïm CMOS technology • Very low component count (6 external components) • Ultra low power design - Peak current 40mA for basic data rate - Peak current 45mA for enhanced data rate - Bluetooth low power mode typ.
  • Page 55 3. TECHNICAL BRIEF 3.16.5. RF-Section • Integrated antenna switch to minimize external components count • Programmable RF transmit power between -55dBm...+6dBm - Fine tuning in 2dB programmable steps also supported • 20dBm power class 1 supported with external power amplifier - Separate TX output interface to PA (bypass of internal T/R switch) - Digital power step control •...
  • Page 56 3. TECHNICAL BRIEF 3.16.6 System Integration Figure 29 Mobile system integration The UART (serial interface) is used for the software interface between S-Gold2 baseband and the Bluetooth chip. For the HCI UART transport layer four interface lines are needed, two for data (UARTTXD and UARTRXD) and two for hardware flow control (UARTRTS and UARTCTS).

  • Page 57: Micro Sd External Memory Card Slot

    3. TECHNICAL BRIEF BLUETOOTH 2V72_IO 1V8_MEM R201 C201 C202 0.1u 0.1u R205 USIF_TXD I2S1_CLK R206 USIF_RXD I2S1_WA I2S1_RX I2S1_TX TP201 TP202 TP203 SCL0_P0_13 2V65_BT 1V5_CORE 1V8_MEM VBALUN TP204 PCMFR2_SDA0_P0_12 BT_VCXO_EN TP205 SLEEPX_P0_15 R207 CLK32_P1_5 CLK32K TP206 TP207 TRST_ TP208 RTCK WAKEUP_HOST_P1_8 TP209 JTAG_...
  • Page 58 3. TECHNICAL BRIEF Table 9 Micro SD memory pad assign. SD mode Pin No. Name Type Description DAT2 Data bit [2] CD/DAT3 Data bit [3] Command response Power Power supply Clock Ground Power ground DAT0 Data bit [0] DAT1 Data bit [1] Figure 32 Micro SD memory card detection scheme Table 10 Micro SD memory card detect truth table.

  • Page 59: 12Pin Multi Media Interface Connector

    3. TECHNICAL BRIEF Figure 35 Micro SD socket circuit with power control 3.18. 12pin Multi Media Interface connector Table 11 Multi media interface pin assign KE600/KE608 MMI Pin Function Description FM_ANT FM radio antenna / Audio ground Headset microphone positive signal / HS_MIC_P / HS_ VMICP HS_ Mic positive source Headset microphone negative signal /...
  • Page 60 3. TECHNICAL BRIEF C301 C302 R301 MIC2_P OUT301 R302 MIC2_N OUT302 C307 C308 R304 VMICN 1.2K 1000p 2V72_IO C309 R305 VMICP SNDOUT_L C364 1.2K CN302 SNDOUT_R R306 C318 100u AMP_OUT_L 100K FB301 FB302 FB303 R366 FB304 R367 FB305 C314 100u FB306 AMP_OUT_R REMOTE_ADC...

  • Page 61: General Description

    3. TECHNICAL BRIEF RF circuit RF Block Diagram 3.19. General Description The RF transceiver (PMB 6272 SMARTi-PM) is an integrated single chip, quad-band transceiver for GSM850/GSM900/GSM1800/GSM1900 designed for voice and data transfer applications. The transceiver provides an analog I/Q baseband interface and consists of a direct conversion receiver and a quad-band polar transmitter for GSM and EDGE with integrated PGA functionality.
  • Page 62 3. TECHNICAL BRIEF Figure 35 RF transceiver PMB7262 SMARTi-PM functional block diagram C614 C615 C616 C617 C618 C619 2.5p 2.5p 1.5p 1.5p 1.2p 1.2p L602 L603 L604 18nH 6.8nH 6.8nH 1V5_RF 2V85_RF 1V5_RF 2V85_RF 2V7_VCXO C622 0.1u 2V85_RF R615 C624 C626 C627 C623...

  • Page 63: Receiver Part

    3. TECHNICAL BRIEF 3.20. Receiver part Figure 37 Receiver part block diagram The constant gain direct conversion receiver contains all active circuits for a complete receiver chain for GSM/GPRS/EDGE (see Figure 37). The GSM850/900/DCS1800/ PCS1900 LNAs with balanced inputs are fully integrated. No inter-stage filtering is needed. The orthogonal LO signals are generated by a divider-by-four for GSM850/900 band and a divider-by-two for the DCS1800/PCS1900 band.
  • Page 64 3. TECHNICAL BRIEF The digital transmitter architecture is based on a polar modulation architecture, where the analog modulation data (rectangular I/Q coordinates) is converted to digital data stream and is subsequently transformed to polar coordinates by means of a CORDIC algorithm. The resulting amplitude information is fed into a digital multiplier for power ramping and level control.

  • Page 65: Rf Synthesizer

    3. TECHNICAL BRIEF 3.22. RF synthesizer The transceiver contains a fractional-N sigma-delta synthesizer for the frequency synthesis in the RX operation mode. For TX operation mode the fractional-N sigma-delta synthesizer is used as Sigma- Delta modulation loop to process the phase/frequency signal. The 26MHz reference signal is provided by the internal crystal oscillator.

  • Page 66: Front End Module Control

    3. TECHNICAL BRIEF 3.24. Front End Module control Implemented in the S-Gold2 (U101) are three outputs which are ANT_SW1, ANT_SW2 and ANT_SW3 for direct control of front end modules with three logic input pins to select RX and TX mode as well as low and high band operation.

  • Page 67: Dual Mode Operation

    3. TECHNICAL BRIEF Table 13 PAM pin description Function Description HB_RFIN RF input to the High-band PA 2 BAND_SEL Logic low=low band, Logic high=high band select TX_EN PA Enable VBATT Main supply VMODE Logic low=GMSK mode, Logic high=8PSK mode select VRAMP Ramped burst pin LB_RFIN...

  • Page 68: Pcb Layout

    4. PCB layout 4. PCB layout 4.1 Main & Sub PCB component placement Figure 43 Main PCB top Figure 44 Main PCB top placement - 69 -...
  • Page 69 4. PCB layout Figure 45 Main PCB bottom Figure 46 Main PCB bottom placement - 70 -...
  • Page 70 4. PCB layout Figure 47 Sub PCB top Figure 48 Sub PCB top placement - 71 -...
  • Page 71 4. PCB layout Figure 49 Sub PCB bottom Figure 50 Sub PCB bottom placement - 72 -...
  • Page 72 4. PCB layout Hole effect switch 80pin socket Antenna feeding Hole effect switch Speaker PAD Flash LE D socket FM radio p rt Antenna feeding Mobile SW RF PAM FM radio part attery contact Audio Amp Mobile SW RF PAM 26MHz Main clock Audio A 50pin FPCB connector...
  • Page 73 4. PCB layout Key light LED FPCB connector Jog wheel LCD connector connector Back_up battery - 74 -...
  • Page 74 4. PCB layout 40pin FPCB connector connected in Main Pcb 50pin FPCB connector connected in Main Pcb Vibrator Receiver - 75 -...

  • Page 75: Trouble Shooting

    5. Trouble shooting 5. Trouble shooting 5.1 Trouble shooting test setup 4.000V 0.0000A Figure 51 Equipment setup Power on all of test equipment - Connect PIF-UNION JIG or dummy battery to the DUT for power up. - Connect mobile switch cable between Communication test set and DUT when you need to make a phone call.
  • Page 76 5. Trouble shooting VBAT R213 U203 NLAST4599DFT2G VBAT 6 NO R215 U206 R1114D281D-TR-F PWRON R252 VOUT RPWRON END_KEY C240 GND1 RPWRON_EN GND2 C244 C245 RPWRON 100p 1000p VBAT KP_OUT1 R401 2SC5585 END_KEY END_KEY Q401 R402 KP_IN5 End key RESETn - 77 -...
  • Page 77 5. Trouble shooting VCHG 2V11_RTC 1V5_CORE 1V5_DSP 2V85_RF VBAT 2V7_VCXO 2V65_BT R202 220K R203 4.7K RTC_OUT PWRON VBACKUP R204 470K SPOWER_INT VCH_CTL C203 C204 C205 C206 C207 C208 C209 PMRSTn VBAT 2.2u 2.2u 2.2u 2.2u 2.2u 2.2u 2.2u 1V8_MEM 3V1_USB 1V5_RF VBAT 2V65_ANA...
  • Page 78 5. Trouble shooting START Connect power supply to the Vbat = over 3.35V Check the "PWRON" RPWRON, signal replace U203 Check solder "RESETn" U206 or replace it signal Check solder Check the all U201 or replace it LDO's output Check solder Is the 26MHz X601, U602 clock From...

  • Page 79: Charging Trouble

    5. Trouble shooting 5.3 Charging trouble Check Points -Connection of TA (check TA voltage 4.8V) -Charging Current Path component voltage drop -Battery voltage • Charging method : CC-CV • Switch-off voltage : 3.35V • Charger detect voltage : about 4.0V •...
  • Page 80 5. Trouble shooting START Resolder the 24pin CN403 MMI(CN403) The TA can be Source pin broken of Q201= Change other TA Check solder Drain pin Q201 or replace it of Q201 = D201 voltage Replace it drop Waiting until battery Battery voltage Voltage goes up is over 3.4V?

  • Page 81: Lcd Display Trouble

    5. Trouble shooting 5.4 LCD display trouble Check Points -LCD assembly status ( FPCB) -EMI filter soldering -Connector combination 2V85_MMC 2V72_IO VBAT FL505 ICVE21184E150R101FR INOUT_A1 INOUT_B1 DIF_CD CN503 INOUT_A2 INOUT_B2 DIF_WR MLED INOUT_A3 INOUT_B3 DIF_VSYNC MLED1 INOUT_A4 INOUT_B4 DIF_CS MLED2 VBACKUP MLED3 FL506...

  • Page 82: Camera Trouble

    5. Trouble shooting START Check LCD connector combination then LCD test with New LCD Replace LCD Is LCD FPCB module normal? Check solder and Signal is normal on repair FL305, FL306, L307 Damaged filter Assemble 5.5 Camera Trouble Check Points -Connectors combination -EMI filter soldering -FPCB status...
  • Page 83 5. Trouble shooting Checking Point 50pin main PCB connector Check the connector combination FL502 Check signal flow via EMI filter FL504 FL503 FL501 - 84 -...
  • Page 84 5. Trouble shooting START Check camera connector, 35pin main PCB connector combination then Camera test with equipped camera FL501,FL502, Resolder FL503,FL504 Replace Replace New Replace New Main PCB Camera FPCB module Replace Camera module Replace FPCB module Assemble Assemble - 85 -...

  • Page 85: Speaker Trouble

    5. Trouble shooting 5.6 Speaker trouble Check Points -Speaker spring contact -Audio amp soldering -analog switch soldering VBAT FB309 OUT301 2V85_IO2 FB310 OUT302 C306 C357 4.7u 0.1u C304 C310 C311 2V85_IO2 C361 220n MONO_IN+ SNDOUT_L C362 220n TP304 MONO_IN- SNDOUT_R TP303 C317 C316...
  • Page 86 5. Trouble shooting START Check Speaker tension and Contacts are clear. Check signals Resolder from FB309, FB309, FB310 or FB310 is Replace them correct? then retest Check signal Replace U301 from C312, C313 then retest is flowed Check signal Replace U302 from R327, R330 Then retest is flowed...

  • Page 87: Receiver Trouble

    5. Trouble shooting 5.7 Receiver trouble Check Points -Receiver soldering -FPCB Assembled status R118 R120 - 88 -...

  • Page 88: Microphone Trouble

    5. Trouble shooting 5.8 Microphone trouble Check Points -Microphone hole -Mic. Bias & signal come from C342 C343 MIC301 R364 C344 0.1u MIC1_P R365 C345 0.1u MIC1_N OB4-15L42-C33L C349 C350 R345 1.2K VMICN C351 1000p R348 1.2K VMICP C367 Checking Point C367 Check solder related...
  • Page 89 5. Trouble shooting - 90 -...

  • Page 90: Vibrator Trouble

    5. Trouble shooting 5.9 Vibrator trouble Check Points -Vibrator contact -IC is working correct R424 U401 VIBRATOR SUY98005LT1G R425 VIBRATOR_EN L401 R426 VIBRATOR- VOUT 100nH R428 C404 100K Checking Point U401 Check the driver IC Check the contact is clear, if there is some Enable signal goes to high then obstacles then remove them vibration...
  • Page 91 5. Trouble shooting START Check Vibrator contact Check U401 or Pin1 of U401 is replace it high ? Check U401 or Pin3 of U401 is replace it low? Replace Vibrator Assemble - 92 -...

  • Page 92: Keypad Back Light Trouble

    5. Trouble shooting 5.10 Keypad back light trouble Check Points -Signal path is connected well -Control IC is working properly VBAT R420 KEY_BACKLIGHT R421 Checking Point Check R420 resistor - 93 -...
  • Page 93 5. Trouble shooting START Check All of LEDs solder Check U201's pin16 R420 's voltages or replace it goes down Assemble - 94 -...
  • Page 94 5. Trouble shooting 5.11 SIM card trouble Check Points -Power control FET is working -Socket soldering -Proper SIM is used 2V85_SIM SI1305-E3 SIM_ENn Q301 C339 0.1u J301 GND1 SIM_RST SIM_IO SIM_CLK GND5 GND2 GND4 GND3 C340 C341 Checking Point Q301 Pin 5 / 1 2 3 2V85_SIM...

  • Page 95: Sim Card Trouble

    5. Trouble shooting START Check All of SIM card voltage KE600/KE608 support 1.8V & 3V SIM only 6 pins are Repair it soldered well? Replace the Q301 is damaged part working? Assemble - 96 -...

  • Page 96: Microsd Trouble

    5. Trouble shooting 5.12 MicroSD trouble Check Points -Power control FET is working -Socket soldering -Card detect is working 2V9_TF VBAT 2V9_TF Tflash Connector U307 BH29FB1WHFV R363 TF_PWR_EN STBY BGND VOUT C360 C359 2.2u J302 TFLASH_DAT2 DAT2 DAT1 TFLASH_DAT1 TFLASH_DAT3 DAT3 DAT0 TFLASH_DAT0...
  • Page 97 5. Trouble shooting TFlash_DETECT Q1_Point START Check the Card detect signal if it operate as above picture TF_DETECT pins Repair it are soldered well? Replace the Q1 is working damaged properly? part Assemble - 98 -...

  • Page 98: Bluetooth Trouble

    5. Trouble shooting 5.13 Bluetooth trouble Check Points -A condition of Bluetooth Antenna soldering -Balun filter is correctly working -Bluetooth data is perfectly flowed -Power and clock signals are supplied in U202 BLUETOOTH 2V72_IO 1V8_MEM R201 C201 C202 0.1u 0.1u R205 USIF_TXD I2S1_CLK...
  • Page 99 5. Trouble shooting Checking Flow Check a condition of Balun filter output(FL201) power by using Spectrum Replace Bluetooth antenna More than 0dBm (BT201) Bluetooth Working is good? Check a condition of power supply (C220-2.85V, C221-1.5V, C222-1.8V, C230-1.8V C201-2.72V, C202-2.8V) condition is Replace U202 good? Check a condition of Clock...

  • Page 100: Fm Radio Trouble

    5. Trouble shooting 5.14 FM Radio trouble Check Points -Ear_mic_set is correctly operated as FM radio antenna (When user uses the FM radio function, Ear_mic_set must be connected in phone) -A condition of FM_Radio module soldering -FM_Radio signal is flowed correctly -Power and clock signals are supplied in U303 D308 C326...
  • Page 101 5. Trouble shooting Checking Flow Check a condition of Ear jack connector A condition is Replace CN302 Good? Check a condition of Matching components (C326, L303, C332, D308) Give the additory solder in A condition is C326, L303, C332, D308 good? FM_Radio Working is good?

  • Page 102: Rf Part Troubleshooting

    5. Trouble shooting 5.15 RF PART TROUBLESHOOTING 5.15.1 RF Components FL601 U601 SW601 U602 X601 Figure 1. RF Components REFERENCE PART Description U601 PAM (Power Ampilifier Module) X601 VCTCXO (26MHz) FL601 FEM (Front End Module) U602 Transceiver SW601 Mobile Switch Table 1.

  • Page 103: Trouble Shooting Of Receiver Part

    5. Trouble shooting 5.15.2 Trouble Shooting of Receiver Part Checking Flow Checking Points START Setup Test Equipment Cell Power : -7 4dBm EGSM CH30 DCS CH699 Check point X601 VCTCXO RX_I RX_Q Check point C633 PLL Control Figure 2. Receiver Part Check point FL601 Mobile SW &...

  • Page 104: Checking Vctcxo Circuit

    5. Trouble shooting 5.15.3 Checking VCTCXO Circuit Checking Points Checking Flow Is the waveform Replace X601 of Pin3 similar to Checking U201 Is the waveform (PMIC) of Pin4 similar to Pin : 2.7V VCTCXO Circuit is OK. X601 See next page to check PLL Circuit.
  • Page 105 5. Trouble shooting 5.15.4 Checking PLL Control signals Checking Points Checking Flow Figure 7. Transceiver RF Transceiver Circuit Diagram Waveform 1V5_RF 2V85_RF 2V7_VCXO 85_RF R615 C624 C626 C627 C623 C625 C628 0.1u 0.1u 0.1u 0.1u 0.1u VBIAS VDDTX1V5 VDDRX2V8 VDDRX1V5 U602 R616 VCO_RC...
  • Page 106 5. Trouble shooting 5.15.5 Checking Mobile SW & FEM Mobile SW & FEM Circuit Diagram OUT601 2V85_RF R624 R606 C605 C606 0.1u FL601 YGHF-S006T OUT604 GND11 KMS-510 L607 3.3nH SW601 GND10 C642 15p GND9 GND8 GND7 L608 C607 C604 22nH C614 C615 C616...
  • Page 107 5. Trouble shooting Checking Flow Check Pin 1, 2 of SW601 with RF Cable Replace Mobile SW Signal is OK ? (SW601) Control signal Check (R601, R602, R603) of FL601? Control Signal is Check PMB8876 (U101) C614, C615, C616, C617 Replace FEM (FL601) Signal is normal ?
  • Page 108 5. Trouble shooting 5.15.6 Checking RX I/Q Signals Checking Flow 2V7_VCXO Check RX I/Q Signals 26MHz C641 C632 R619 680 VCONT X601 C634 C633 100p R620 Replace Signals are Transceiver Normal ? C635 1000p BT_CLK PMB6272(U602) RF_CLK RF_DA 2V85_RF 1V5_CORE R622 10 RX Part is OK.

  • Page 109: Trouble Shooting Of Transmitter Part

    5. Trouble shooting 5.15.7 Trouble Shooting of Transmitter Part Checking Flow Checking Points Setup Test Equipment Cell Power : -7 4dBm EGSM CH30 DCS CH699 FL601 U601 Check point U602 X601 VCTCXO Check point U602 PLL Control Figure 17. RF Part Check point point TX I/Q Signal Check point...

  • Page 110: Checking Pll Control Signal

    5. Trouble shooting 5.15.8 Checking VCTCXO Circuit See RX Part “1. Checking VCTCXO Circuit” 5.15.9 Checking PLL Control Signal See RX Part “2. Checking PLL Control Signal” 5.15.10 Checking TX I/Q Signals Checking Flow 2V7_VCXO Check TX I/Q Signals 26MHz C641 C632 R619 680...
  • Page 111 5. Trouble shooting 5.15.11 Checking Transceiver Output Signals 1V5_RF 2V85_RF C622 0.1u 2V85_RF C623 0.1u VBIAS VDDTX1V5 LBAND_PAM_IN HBAND_PAM_IN VDDTX2V8 R617 10 VDDMIX2V8 GND3 GND4 C630 C631 0.1u 0.1u Figure 22. Transceiver Output Circuit Checking Points LBAND PAM IN U601 HBAND PAM IN (DCS/PCS) Figure 23.
  • Page 112 5. Trouble shooting Checking Flow Check U602 Output Signal Replace Signals( LBAND_PAM_IN, PMB6272(U602) are normal ? HBAND_PAM_IN Transceiver is OK. See next page to check PAM Control Circuit. LBAND_PAM_IN (MODE: GMSK) LBAND_PAM_IN (MODE: 8PSK) Figure 24. Transceiver Output (GMSK) Figure 25. Transceiver Output (8PSK) - 113 -...
  • Page 113 5. Trouble shooting 5.15.12 Checking PAM Control Signals LBAND_PAM_IN LB_RFIN R611 PA_LEVEL VRAMP MODE VMODE VBATT TXON_PA LB_RFOUT TX_EN BAND_SEL PA_BAND HBAND_PAM_IN HB_RFOUT HB_RFIN R612 R613 R614 RF3158 U601 100K 100K 100K VSUPPLY C620 C621 C613 C638 C639 Figure 26. PAM Control Signals Circuit Checking Points PA LEVEL(R611) Mode (R612)
  • Page 114 5. Trouble shooting Checking Flow Check Control Signals (R611, R612, R613) Check Signals are PMB8876(U101) Normal ? PAM Control Signal is See next page to check FEM & Mobile SW Circuit. Figure 28. GSMK Control Signal Figure 29. 8PSK Control Signal - 115 -...

  • Page 115: Download & S/W Upgrade

    6. Download & S/W upgrade 6. Download & S/W upgrade 6.1 S/W download setup 4.000V 0.0000A Figure S/W download & upgrade setup Preparation • Target terminal • PIF-Union • RS-232 Cable and PIF-UNION to Phone interface Cable • Power Supply or Battery •...

  • Page 116: Download Program User Guide

    6. Download & S/W upgrade 6.2 Download program user guide - 117 -...
  • Page 117 6. Download & S/W upgrade - 118 -...
  • Page 118 6. Download & S/W upgrade ➜ ➜ - 119 -...
  • Page 119 6. Download & S/W upgrade - 120 -...

  • Page 120: Circuit Diagram

    R120 ON_SW ON_SW RPWRON_EN RCV_P VBAT VBAT VSUPPLY URXD C131 C132 Engineer: Engineer: LG ELECTRONICS INC. UTXD D.H.SEO Mobile Handsets R&D Center Drawn by: Drawn by: RTS_0 HW Group, Develpment Lab 4 D.H.SEO CTS_0 R&D CHK: R&D CHK: Size: Size:...
  • Page 121 RPWRON 100p 1000p R216 USB_CHG_ENn PGND C242 C243 C241 R251 0.1u Engineer: Engineer: LG ELECTRONICS INC. D.H.SEO Mobile Handsets R&D Center Drawn by: Drawn by: HW Group, Develpment Lab 4 D.H.SEO R&D CHK: R&D CHK: Size: Size: TITLE: TITLE: GSM-NEO-MAIN-1.1...
  • Page 122 TFLASH_CLK GND1 GND3 R358 TFLASH_DETECT GND2 GND4 C355 C356 R359 470K Engineer: Engineer: LG ELECTRONICS INC. D.H.SEO Mobile Handsets R&D Center Drawn by: Drawn by: HW Group, Develpment Lab 4 D.H.SEO R&D CHK: R&D CHK: Size: Size: TITLE: TITLE: GSM-NEO-MAIN-1.1...
  • Page 123 C412 C413 ZXCT1010E5TA U403 2.2K C408 C409 C410 C418 C419 C414 Engineer: Engineer: LG ELECTRONICS INC. D.H.SEO Mobile Handsets R&D Center Drawn by: Drawn by: HW Group, Develpment Lab 4 D.H.SEO R&D CHK: R&D CHK: Size: Size: TITLE: TITLE: GSM-NEO-MAIN-1.1...
  • Page 124 RCV_N RCV_P C511 C512 C513 C514 C515 C516 0.1u 0.1u 0.1u Engineer: Engineer: LG ELECTRONICS INC. D.H.SEO Mobile Handsets R&D Center Drawn by: Drawn by: HW Group, Develpment Lab 4 D.H.SEO R&D CHK: R&D CHK: Size: Size: TITLE: TITLE: GSM-NEO-MAIN-1.1...
  • Page 125 RF_DA 2V85_RF 1V5_CORE R621 R622 10 RF_TEMP R623 C636 C637 0.1u 0.1u Engineer: Engineer: LG ELECTRONICS INC. D.H.SEO Mobile Handsets R&D Center Drawn by: Drawn by: HW Group, Develpment Lab 4 D.H.SEO R&D CHK: R&D CHK: Size: Size: TITLE: TITLE: GSM-NEO-MAIN-1.1...
  • Page 126 BAT101 EMX18 R131 OUT101 OUT102 OUT103 OJ101 OJ102 KEYPAD BACKLIGHT BLUE LED KEYPAD BACKLIGHT DRIVER Engineer: Engineer: LG ELECTRONICS INC. D.H.SEO GSM HANDSETS LAB. Drawn by: Drawn by: D.H.SEO DEVELOPMENT GROUP 4 R&D CHK: R&D CHK: TITLE: TITLE: Size: Size: D.H.SEO...

  • Page 127: Pcb Layout

    8. PCB LAYOUT - 128 -...
  • Page 128 8. PCB LAYOUT - 129 -...
  • Page 129 8. PCB LAYOUT - 130 -...
  • Page 130 8. PCB LAYOUT - 131 -...
  • Page 131 - 132 -...

  • Page 132: Rf Calibration

    9. RF Calibration 9. RF Calibration 9.1 Test Equipment Setup 4.00 V 0.000 A 9.2 Calibration Steps 9.2.1. Turn on the Phone. 9.2.2. Execute “HK_24.exe” - 133 -...
  • Page 133 9. RF Calibration 9.2.3. Click “SETTING” Menu 9.2.4. Setup “Ezlooks” menu such as the following figure - 134 -...
  • Page 134 9. RF Calibration 9.2.5. Setup “Line System” menu such as the following figure Adjust the number of times. 9.2.6. Setup Logic operation such as the following figure. Operation Mode 1. By-Pass: not control by GPIB 2. Normal : control by GPIB Setup UART Port PWR : Power Supply CELL :Call-Test Equipment...
  • Page 135 9. RF Calibration 9.2.7. Select “MODEL” . 9.2.8. Click “START” for RF calibration 9.2.9. RF Calibration finishes. - 136 -...
  • Page 136 9. RF Calibration 9.2.10. Calibration data will be saved to the following folder. Saving format: year/month/day_PASS - 137 -...
  • Page 137 9. RF Calibration Notices: 1. The state of Phone is “test mode” during the CALIBRATION. 2. Calibration program automatically changes either “normal mode” or “ptest mode” . 3. RF Calibration steps as follow: TX Channel compensation: EGSM->DCS->PCS->EDGE EGSM->EDGE DCS->EDGE PCS RX Channel compensation: EGSM->DCS->PCS 3.

  • Page 138: Stand-Alone Test

    10. Stand-alone Test 10. Stand-alone Test 1. Test Program Setting 1 Set COM Port. 2 Check PC Baud rate. 3 Confirm EEPROM & Delta file prefix name. 4 Click “Update Info” for communicating Phone and Test-Program. - 139 -...
  • Page 139 10. Stand-alone Test 5 For the purpose of the Standalone Test, Change the Phone to “ptest mode” and then Click the “Reset” bar. 6 Select “Non signaling” in the Quick Bar menu. Then Standalone Test setup is finished. - 140 -...
  • Page 140 10. Stand-alone Test 2.Tx Test 1 Click “Non signaling mode” bar and then confirm “OK” text in the command line. ➀ 2 Put the number of TX Channel in the ARFCN. 3 Select “Tx” in the RF mode menu and “PCL” in the PA Level menu. 4 Finally, Click “Write All”...
  • Page 141 10. Stand-alone Test 3. Rx Test 1 Put the number of RX Channel in the ARFCN. 2 Select “Rx” in the RF mode menu. 3 Finally, Click “Write All” bar and try the efficiency test of Phone. ➂ ➁ ➀ 4 The Phone must be changed “normal mode”...

  • Page 142: Engineering Mode

    11. ENGINEERING MODE 11. ENGINEERING MODE Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. The key sequence for switching the engineering mode on is “2945#*# “Select. Pressing END will switch back to non-engineering mode operation.
  • Page 143 - 144 -...

  • Page 144: Exploded View & Replacement Part List

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.1 EXPLODED VIEW - 145 -...
  • Page 145 - 146 -...

  • Page 146: Replacement Parts

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Mechanic component> Location Level Description Part Number Specification Color Remark GSM(SLIDE) TGLL0005302 Black AAAY00 ADDITION AAAY0136641 Black...
  • Page 147 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MTAZ00 TAPE MTAZ0139301 COMPLEX, (empty), , , , , MTAZ01 TAPE MTAZ0139401 COMPLEX, (empty), , , , , MTAC00 TAPE,SHIELD MTAC0040901 COMPLEX, (empty), , , , , ACGQ00 COVER ASSY,SLIDE ACGQ0009602...
  • Page 148 COMPLEX, (empty), , , , , MKAZ00 KEYPAD MKAZ0030002 COMPLEX, (empty), , , , , Black MLAK00 LABEL,MODEL MLAK0019001 LG(30.5x19.5 4-1R) White Pearl MPBZ00 MPBZ0140001 COMPLEX, (empty), , , , , MPBZ01 MPBZ0165801 COMPLEX, (empty), , , , , ADCA00...

  • Page 149: Main Component

    12. EXPLODED VIEW & REPLACEMENT PART LIST <Main component> Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark SMZY00 MODULE,ETC SMZY0014203 512MB MicroSD SNGF00 ANTENNA,GSM,FIXED SNGF0017701 5.0 ,0 dBd, ,Linear Pol, Tri-band Antenna,Pb-Free SUSY00...
  • Page 150 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark D101 DIODE,TVS EDTY0008501 TFSC ,5 V,50 W,R/TP ,small size D102 DIODE,TVS EDTY0008501 TFSC ,5 V,50 W,R/TP ,small size D103 DIODE,TVS EDTY0008501 TFSC ,5 V,50 W,R/TP ,small size D104 DIODE,TVS EDTY0008501...
  • Page 151 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark SJMY00 VIBRATOR,MOTOR SJMY0006503 3 V,0.08 A,10*3.45 ,17mm double tape SURY00 RECEIVER SURY0009501 ASSY ,107 dB,32 ohm,11*07 ,3T MAIN ,240*320 2.0" ,37.2*52.1*1.9(t) ,262k ,TFT ,TM SVLM00 LCD MODULE SVLM0012602 ,uPD161802 (G)/uPD161964 (S)-NEC ,...
  • Page 152 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C117 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C118 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C119 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C120 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 153 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C219 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C220 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C221 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C222 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 154 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C323 CAP,CERAMIC,CHIP ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP C324 CAP,CERAMIC,CHIP ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP C327 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C328 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C330 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 155 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C411 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C412 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP C413 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C414 CAP,CHIP,MAKER ECZH0000841...
  • Page 156 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C629 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C630 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C631 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C632 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 157 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark FB308 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead FB309 FILTER,BEAD,CHIP SFBH0007103 75 ohm,1005 ,CHIP BEAD, 300mA FB310 FILTER,BEAD,CHIP SFBH0007103 75 ohm,1005 ,CHIP BEAD, 300mA FB401 FILTER,BEAD,CHIP SFBH0007102 10 ohm,1005 ,Ferrite Bead FB402 FILTER,BEAD,CHIP...
  • Page 158 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R109 RES,CHIP,MAKER ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP R110 RES,CHIP,MAKER ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP R112 RES,CHIP,MAKER ERHZ0000465 3300 ohm,1/16W ,J ,1005 ,R/TP R113 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP...
  • Page 159 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R320 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP R322 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R339 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP R345 RES,CHIP,MAKER ERHZ0000412 1200 ohm,1/16W ,J ,1005 ,R/TP...
  • Page 160 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R602 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP R603 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP R606 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R611 RES,CHIP ERHY0000128 15K ohm,1/16W,F,1005,R/TP...
  • Page 161 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark 26 MHz,2 PPM,10 pF,SMD ,3.2*2.5*0.9 ,2.5ppm at -20 to X601 VCTCXO EXSK0007301 +75, AFC 0.5V to 2.5V, Supply 2.6V ZD402 DIODE,TVS EDTY0007501 SOD-523 ,5 V,240 W,R/TP ,Vc 12.5V , 160pF , 1.6*0.8*.06 SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0070801...
  • Page 162 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C506 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C507 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C508 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C509 CAP,CERAMIC,CHIP ECCH0005602...
  • Page 163 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R105 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R106 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R203 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP R213 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP...
  • Page 164 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R412 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP R413 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP R414 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP R415 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP...
  • Page 165 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark 3*3 DFN ,10 PIN,R/TP ,Dual(1.8V/150mA, 2.8V/300mA) U502 EUSY0294001 LDO Regulator VA401 VARISTOR SEVY0003901 5.5 V, ,SMD ,480pF, 1005 VA402 VARISTOR SEVY0003901 5.5 V, ,SMD ,480pF, 1005 VA403 VARISTOR SEVY0003901...

  • Page 166: Accessory

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.3 Accessory Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark MHBY00 HANDSTRAP MHBY0003604 MLAA00 LABEL,APPROVAL MLAA0040101 PRINTING, (empty), , , , , 3.7 V,950 mAh,1 CELL,PRISMATIC ,KE600 BATT, Black, BATTERY PACK,LI- SBPP00...
  • Page 167 Note...
  • Page 168 Note...

Table of Contents