Localized High Temperature Zones; Thermal Considerations For Components - Intel BLKDP55SB Technical Product Specification

Intel Desktop Board DP55SB Technical Product Specification
Table 24 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 24. Thermal Considerations for Components
Component
Processor
Intel P55 Express Chipset
For information about
Processor datasheets and specification updates
58
Item Description
A Processor voltage regulator area
B Processor
C Intel P55 Express Chipset
Figure 17. Localized High Temperature Zones
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
o
111 C (under bias)
Refer to
Section 1.3, page 14