Table Of Contents - Intel BLKD945GCLF - MB 533FSB DDR2 667 533 Aud+Vdo+Lan mATX Technical Product Specification

Product specification
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Contents
1 Product Description .............................................................. 9
1.1 Overview........................................................................................ 10
1.1.1
Feature Summary ................................................................ 10
1.1.2
Board Layout ....................................................................... 12
1.1.3
Block Diagram ..................................................................... 14
1.2 Legacy Considerations...................................................................... 15
1.3 Online Support................................................................................ 15
1.4 Processor ....................................................................................... 15
1.5 System Memory .............................................................................. 16
1.6 Intel ® 945GC Chipset ...................................................................... 17
1.6.1
Intel 945GC Graphics Subsystem............................................ 17
1.6.2
USB ................................................................................... 19
1.6.3
IDE Support ........................................................................ 20
1.7 Real-Time Clock Subsystem .............................................................. 21
1.8 Legacy I/O Controller ....................................................................... 22
1.8.1
Serial Port ........................................................................... 22
1.8.2
Parallel Port......................................................................... 22
1.8.3
Keyboard and Mouse Interface ............................................... 22
1.9 Audio Subsystem............................................................................. 23
1.9.1
Audio Subsystem Software .................................................... 24
1.9.2
Audio Connectors and Headers ............................................... 24
1.10 LAN Subsystem ............................................................................... 25
1.10.1 LAN Subsystem Software....................................................... 25
1.10.2 RJ-45 LAN Connector with Integrated LEDs .............................. 26
1.11 Hardware Management Subsystem .................................................... 27
1.11.1 Hardware Monitoring............................................................. 27
1.11.2 Thermal Monitoring .............................................................. 28
1.12 Power Management ......................................................................... 29
1.12.1 ACPI................................................................................... 29
1.12.2 Hardware Support ................................................................ 32
1.12.3 ENERGY STAR* .................................................................... 36
2 Technical Reference ............................................................ 37
2.1 Memory Map................................................................................... 37
2.1.1
Addressable Memory............................................................. 37
2.2 Connectors and Headers................................................................... 40
2.2.1
Back Panel Connectors .......................................................... 41
2.2.2
Component-side Connectors and Headers ................................ 42
2.3 Jumper Block .................................................................................. 49
2.4 Mechanical Considerations ................................................................ 50
2.4.1
Form Factor......................................................................... 50
2.5 Electrical Considerations ................................................................... 51
2.5.1
Power Supply Considerations ................................................. 51
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