Table Of Contents - Intel BLKD425KT Technical Product Specification

Contents
1 Product Description .............................................................. 9
1.1 Overview.......................................................................................... 9
1.1.1 Feature Summary .................................................................. 9
1.1.2 Board Layout ....................................................................... 11
1.1.3 Block Diagram ..................................................................... 13
1.2 Online Support................................................................................ 14
1.3 Processor ....................................................................................... 14
1.3.1 Intel D425 Graphics Subsystem.............................................. 15
1.4 System Memory .............................................................................. 16
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1.5 Intel NM10 Express Chipset............................................................. 17
1.5.2 USB ................................................................................... 19
1.5.3 SATA Support ...................................................................... 19
1.6 Real-Time Clock Subsystem .............................................................. 20
1.7 Legacy I/O Controller ....................................................................... 20
1.8 LAN Subsystem ............................................................................... 21
1.8.1 LAN Subsystem Drivers ......................................................... 21
1.8.2 RJ-45 LAN Connector with Integrated LEDs .............................. 22
1.9 Audio Subsystem............................................................................. 23
1.9.1 Audio Subsystem Software .................................................... 24
1.9.2 Audio Connectors and Headers ............................................... 24
1.10 Hardware Management Subsystem .................................................... 25
1.10.1 Hardware Monitoring............................................................. 25
1.10.2 Thermal Monitoring .............................................................. 26
1.11 Power Management ......................................................................... 27
1.11.1 ACPI................................................................................... 27
1.11.2 Hardware Support ................................................................ 30
2 Technical Reference ............................................................ 33
2.1 Memory Map................................................................................... 33
2.1.1 Addressable Memory............................................................. 33
2.2 Connectors and Headers................................................................... 36
2.2.1 Back Panel .......................................................................... 37
2.2.2 Component-side Connectors and Headers ................................ 39
2.3 BIOS Configuration Jumper Block....................................................... 49
2.4 Mechanical Considerations ................................................................ 51
2.4.1 Form Factor......................................................................... 51
2.5 Electrical Considerations ................................................................... 52
2.5.1 Fan Header Current Capability................................................ 52
2.5.2 Add-in Board Considerations .................................................. 52
2.6 Thermal Considerations .................................................................... 52
2.6.1 Passive Heatsink Design in a Passive System Environment ......... 54
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