Reduced Logistical Delay Time; Conclusion - Compaq BL10e - HP ProLiant - 512 MB RAM Configuration

Hp bladesystem c-class architecture
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Finally, Onboard Administrator's thermal monitoring of the entire system ensures that the Active Cool
fans deliver adequate cooling to the entire enclosure. Because the fan design uses a high-performance
motor and impeller, it consumes less power and uses less airflow to cool an enclosure than a
traditional fan design would. Because of its unique fan blade, housing, motor windings, bearings,
and drive circuit, the Active Cool fan provides higher reliability than typical server fans.

Reduced logistical delay time

Like other ProLiant servers, the BladeSystem c-Class was designed with ease-of-use as a priority.
Several important technologies in the BladeSystem c-Class reduce the amount of time needed to
replace, upgrade, and configure systems: Onboard Administrator and the related Insight Display,
Virtual Connect technology, and hot-plug devices.
Onboard Administrator and Virtual Connect technologies have already been discussed in the section
titled "Configuration and management technologies." With the intelligence of the Onboard
Administrator and the easy-to-use Insight Display panel, administrators can configure and troubleshoot
their systems in minutes, rather than hours or days. Adopting Virtual Connect technology removes
administrative burdens from LAN and SAN administrators because that they are not required to
change their network setup every time a configuration change occurs within the server blade
environment. Furthermore, because the network connections are made to a pool of server blades, it is
quick and easy to migrate the network service from a failed server blade to a functional server blade.
Finally, the fans, power supplies, interconnect modules, Onboard Administrator modules, server
blades, and storage blades are hot-pluggable, meaning that they can be removed without affecting
any other components in the enclosure.

Conclusion

HP designed the BladeSystem c-Class as an architecture that would deliver on the promise of a
modular, adaptive, automated data center. To do this, HP worked very closely with its customers to
understand their requirements and challenges in managing their data centers. By combining this
knowledge with the recognition of emerging industry standards and technologies, architects from
multiple business units within HP collaborated to define the c-Class architecture, enclosure design, and
Thermal Logic cooling technologies.
The c-Class architectural model provides scalable device and interconnect bays plus power and
cooling headroom that allows customers to add the components they need, when they need them.
Customers can easily scale the enclosure from the minimum of one server blade to the maximum by
adding more fans and power supplies. By designing a unique NonStop signal midplane that can
adapt to customer needs and technology directions over multiple generations, HP has ensured
flexibility and a long life for the BladeSystem c-Class. By consolidating key resources—volume space,
power, cooling, and signal traces across the midplane—the BladeSystem c-Class ensures that
resources can be shared efficiently to meet customer needs. The c-Class architecture is designed for
longevity and interoperability with server blades, storage blades, and interconnect modules for
several generations of products. The c-Class architecture enables multiple enclosure designs,
optimized for different market segments.
With the BladeSystem c-Class, HP has delivered even more hardware control, intelligent monitoring,
automation capabilities, and virtualization capabilities than with previous generations of blade
systems. The Onboard Administrator and Insight Display work in conjunction with the intelligent
management processors on each server blade to provide information and control to administrators. In
addition, HP has differentiated the BladeSystem c-Class from its competitors through HP Thermal Logic
that dynamically monitors and controls power and cooling in an extremely cost-effective manner, and
HP Virtual Connect technology that simplifies network management and IT changes by virtualizing
I/O connections.
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