Texas Instruments TPSM63610 Manual page 34

TPSM63610
SLVSGU1 – NOVEMBER 2022
10.2 Documentation Support
10.2.1 Related Documentation
For related documentation, see the following:
• Texas Instruments, Quick Reference Guide to TI Buck Switching DC/DC Application Notes
Application Notes
• Texas Instruments, Innovative DC/DC Power Modules
• Texas Instruments, Enabling Small, Cool and Quiet Power Modules with Enhanced HotRod™ QFN Package
Technology white paper
• Texas Instruments, Benefits and Trade-offs of Various Power-Module Package Options
• Texas Instruments, Simplify Low EMI Design with Power Modules
• Texas Instruments, Power Modules for Lab Instrumentation
• Texas Instruments, An Engineer's Guide To EMI In DC/DC Regulators
• Texas Instruments, Soldering Considerations for Power Modules
• Texas Instruments, Practical Thermal Design With DC/DC Power Modules
• Texas Instruments, Using New Thermal Metrics
• Texas Instruments, AN-2020 Thermal Design By Insight, Not Hindsight
• Texas Instruments, Using the TPSM53602/3/4 for Negative Output Inverting Buck-Boost Applications
application report
10.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
10.4 Support Resources
TI E2E ™ support forums
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's
10.5 Trademarks
™ ™
HotRod and TI E2E
WEBENCH ® is a registered trademark of Texas Instruments.
All trademarks are the property of their respective owners.
10.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
10.7 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this datasheet, refer to the left-hand navigation.
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