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Samsung PS42P2SBX/XEC Service Manual

Plasma display tv
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PLASMA DIAPLAY TV
PLASMA DISPLAY TV
Chassis :
D53A(P)_42"_SetTop
Model:
PS42P2SBX/XEC
PS42P2SBX/XEH
PS42P2SBX/XEU
PS42PNSBX/XEC
1.
2.
3.
4.
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6.
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10.
11.
12.
C O N T E N T S
Precautions
Reference Information
Specifications
Alignment and Adjustments
Circuit Operation Description
Troubleshooting
Exploded View and Parts List
Electric Parts List
Handling Description
Glossary
Wiring Diagram
Schematic Diagrams

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Summary of Contents for Samsung PS42P2SBX/XEC

  • Page 1 PLASMA DISPLAY TV Chassis : D53A(P)_42”_SetTop Model: PS42P2SBX/XEC PS42P2SBX/XEH PS42P2SBX/XEU PS42PNSBX/XEC PLASMA DIAPLAY TV C O N T E N T S Precautions Reference Information Specifications Alignment and Adjustments Circuit Operation Description Troubleshooting Exploded View and Parts List Electric Parts List...
  • Page 2 ELECTRONICS © Samsung Electronics Co., Ltd. Nov. 2002 Printed in Korea AA82-00157A...
  • Page 3 6. CXA2151Q-1 13. Reset 7. MN82860 Release Time : 4-1-2(B) BUTTONS OPERATIONS WITHIN SERVICE MODE Menu Entire menu display Joystick UP/DOWN Cursor move to select items Joystick Left/Right Enable to increase and decrease the data of the selected items Samsung Electronics...
  • Page 4 Sub Item Range Default Value PIP H-Position 0 ~ 63 PIP V-Position 0 ~ 63 Bright YUV 0 ~ 127 Cont YUV 0 ~ 63 Luma Delay 0 ~ 9 Brightness 0 ~ 127 Contrast 0 ~ 63 Samsung Electronics...
  • Page 5 0 ~ 127 TTX Phase 0 ~ 248 Only for white balance adjustment ADC calibration 4-1-3(F) CXA2151Q-1 Sub Item Range Default Value G Gain Sel 0 ~ 3 Cb Gain 0 ~15 Cr Gain 0 ~15 Y Gain 0 ~15 Samsung Electronics...

  • Page 6: Osd Position

    OSD V-Position 0 ~100 4-1-3(J) TEST PATTERN Sub Item Sub_Item Description Luma Ramp(16 Step) Internal Test Pattern Luma Ramp(256 Step) Internal Test Pattern White 16 Internal Test Pattern White 240 Internal Test Pattern Color Bar Internal Test Pattern Samsung Electronics...

  • Page 7: Option Table

    0 ~ 100 High Light Luminance Adjustment Red Gain 0 ~ 255 Hight Light X-Coordinate Adjustment Green Gain 0 ~ 255 No Adjustment Blue Gain 0 ~ 255 High Light Y-Coordinate Adjustment Contrast 0 ~ 100 No Adjustment Samsung Electronics...
  • Page 8 High 21.0 DVI Source 720P 0.80 Asia Model(RCA Jack Type) Field Y(fL) High 30.0 VIDEO 0.75 Highe 28.0 DTV Source (480P, 720P, 1080i) 0.60 High 21.0 PC Source 1024 x 768(60Hz) 0.80 High 28.5 DVI Source 720P 0.75 Samsung Electronics...
  • Page 9 Blue Offset Birghtness Brightness Brightness Birghtness Sub-Contrast Sub-Contrast Sub-Contrast Sub-Contrast Red Gain Red Gain Red Gain Red Gain Green Gain Green Gain Green Gain Green Gain Blue Gain Blue Gain Blue Gain Blue Gain Contrast Contrast Contrast Contrast Samsung Electronics...
  • Page 10 4. White 240 7. MN82860 5. Color Bar Release Time White Balance Coordinate Table in above Position Field Y(fL) High 30.0 VIDEO 0.58 Highe 28.9 Component (480P) 0.31 High 29.4 (1024 x 768,60Hz) 0.54 High 28.0 (720P) 0.76 Samsung Electronics...

  • Page 11: Adjustment Method

    Using the above Sub-Items, We recommend the order of Luminance → Y Coordinate → X Coordinate so as to adjust the White Balance In Adjusting the X, Y Coordinates. To get the decreased Coordinates Value, must increase the Sub-Item value. Samsung Electronics...
  • Page 12 720 x 400 70.1 31.5 SVGA 800 x 600 85.1 53.7 46.9 72.2 48.1 60.3 37.9 56.3 35.2 1024 x 768 85.0 68.7 75.0 60.0 70.1 56.5 60.0 48.3 WXGA 848 x 480 42.9 37.5 36.1 35.0 29.8 4-10 Samsung Electronics...
  • Page 13 Voltage adjustment is made for Vs by using VR in 7 Vs is 175±5V Va is the voltage of the no.7 PIN of SX Connector. Voltage adjustment is made for Va by using right VR in 6 Va is 75±5V Samsung Electronics 4-11...
  • Page 14 Alignment and Adjustments Vw is the voltage of the right terminal for R4414 Voltage adjustment is made for Vw by using VR4400 Standard voltage for Vw is 175V±5V 4-12 Samsung Electronics...
  • Page 15 Between E and C Infinity Infinity For PNP(KSA539-Y) C (COLLECTOR) B(BASE) E (EMITTER) Forward Direction Reverse Direction Between B and E Hundreds of ohms Infinity Between B and C Hundreds of ohms Infinity Between E and C Infinity Infinity Samsung Electronics 4-13...
  • Page 16 IC has built in DIODE against overvoltage in PIN. Generally, except for internal circuit defects, IC defects can be found, by measuring the DIODE. Forward Direction Hundreds of ohms Varying depending on IC but generally normal Reverse Direction Infinity in DIODE TEST MODE Defects have SHORT(0 ohm) for both forward and reverse direction. 4-14 Samsung Electronics...

  • Page 17: Circuit Description

    Vset +220V 0.05A +185V 0.05A +18.3V 0.3A Vfan +12V 0.8A 0.3A V5(A) 1.0A Analog IC Drive Voltage of Video Board V5(D) +5.3V 3.5A IC Drive Voltage of Logic Board Stand-by for Remote Control +12V 1.2A Vsamp +12V 1.5A Samsung Electronics...
  • Page 18 The board is designed using PFC circuit so that PF (Power Factor) can be over 0.95, because low PF can be a problem in high voltage power. (5) Protection The OCP (Over Current Protection), the OVP (Over voltage Protection), and the Short Circuit Protection functions are added against system malfunction. Samsung Electronics...
  • Page 19 Circuit Operation Description 5-1-2(D) PDP-PS-42 BLOCK DIAGRAM Samsung Electronics...

  • Page 20: Auxiliary Power Supply

    In addition, surge current protection, insulation management, and static electricity protection circuit should be added, because it uses commercial power source as an input. PDP SMPS should be designed using auxiliary power and relay to provide remote control capability. Samsung Electronics...
  • Page 21 87.8W by Equation (1). Table 4 shows internal power loss as a function of output power for various power conversion efficiencies. η = η = η = Internal Power Loss ( W) η = η = Direct Current Output Power (W) Table 4. Power Conversion Efficiency vs. Internal Power Loss Samsung Electronics...
  • Page 22 Class C : Lighting devices p Class D : Devices with special current waveforms Application Schedule : Except the devices less than rating input of 75W (1996~1999) Except the devices less than rating input of 50W (2000 and after) Samsung Electronics...
  • Page 23 Power stage for PDP can be designed using the lightweight SMPS feature. It is important to design SMPS considering system load, stability, and related international standards. Samsung Electronics...

  • Page 24: Driver Circuit

    (i.e., the same state of wall and space electric discharges). The ramp reset discharge section, therefore, is important to secure the drive margin, and methods most widely used to date include wall voltage controlling by ramp pulse. Samsung Electronics...
  • Page 25 And, weak discharge is generated because of a small impressed voltage. Samsung Electronics...
  • Page 26 Circuit Operation Description 5-2-2 SPECIFICATION OF DRIVE PULSES 5-2-2(A) DRIVE PULSES 5-10 Samsung Electronics...
  • Page 27 5~6 times dis- charges, subject to variations depending on the structure and environment of electrodes. The purpose of impressing the initial sustaining pulses long is to obtain stable initial discharges and generate wall electric charges as much as possible. Samsung Electronics 5-11...

  • Page 28: Y Drive Board

    Va pulse and scan pulse impressed on Y electrodes. It is in the form of COF, and a COF is equipped with 4 data drive IC’s (STMicroelectronics STV7610A with 96 outputs). For a single scan, 7 COF’s are required. 5-12 Samsung Electronics...
  • Page 29 Circuit Operation Description 5-2-3(B) DRIVING BOARD'S BLOCK DIAGRAM (1) Y POWER 220V 170V (2) X POWER 220V 170V Samsung Electronics 5-13...
  • Page 30 - For logic signaling buffer: 5V; and - For gate driver IC: 15V. 2) Generated by the internal DC/DC part - For generating Vw pulse: 180V. 2. Logic signal 1) Supplied from the logic board - Gate signals for FETs. 5-14 Samsung Electronics...
  • Page 31 G2, FET2 gets short-circuited, thereby causing GND to be outputted to output terminals. (2) With signal impressed on G1, FET1 gets short- circuited, and with no signal impressed on G2, FET2 gets open-circuited, thereby causing 180V to be outputted to output terminals. Samsung Electronics 5-15...

  • Page 32: Driver Circuit Diagram

    Circuit Operation Description 5-2-3 (D) DRIVER CIRCUIT DIAGRAM 5-16 Samsung Electronics...
  • Page 33 Circuit Operation Description 5-2-3(E) DRIVER BOARD CONNECTOR LAYOUT Samsung Electronics 5-17...

  • Page 34: Circuit Operation Description

    Circuit Operation Description 5-18 Samsung Electronics...
  • Page 35 Circuit Operation Description Samsung Electronics 5-19...
  • Page 36 Circuit Operation Description 5-20 Samsung Electronics...
  • Page 37 Circuit Operation Description Samsung Electronics 5-21...
  • Page 38 Circuit Operation Description 5-22 Samsung Electronics...
  • Page 39 Circuit Operation Description Samsung Electronics 5-23...
  • Page 40 Circuit Operation Description 5-24 Samsung Electronics...
  • Page 41 Circuit Operation Description Samsung Electronics 5-25...
  • Page 42 Circuit Operation Description 5-26 Samsung Electronics...
  • Page 43 Circuit Operation Description Samsung Electronics 5-27...
  • Page 44 Circuit Operation Description 5-28 Samsung Electronics...
  • Page 45 Circuit Operation Description Samsung Electronics 5-29...
  • Page 46 Circuit Operation Description 5-30 Samsung Electronics...

  • Page 47: Logic Part

    Circuit Operation Description 5-3 Logic part 5-3-1 Logic Board Block diagram Samsung Electronics 5-31...
  • Page 48 - Outputs XY drive board control signal. E Buffer board Sends data and control signal to left-bottom COF Buffer board F Buffer board Sends data and control signal to right-bottom COF 5-3-1 (B) NAME AND DESCRIPTION OF MAJOR COMPONENTS OF LOGIC BOARD 5-32 Samsung Electronics...
  • Page 49 ❑ 42°” SD s1.0 logic main board T/S Required test equipment: : - Oscilloscope (digital 400 MHz 3 channel or more) - Multi meter Other equipment: : - DC power supply (5V: 1EA ) - Sub-PCB ASS'Y for JIG: 1 EA Samsung Electronics 5-33...
  • Page 50 While T/S, set it to internal clock as the following figure shows. ❈ It is set to external clock in normal. Set it to internal clock while examination, and set it to external clock again after examination. Figure 1. Jumper Settings to Select Internal / External Clock Signal 5-34 Samsung Electronics...
  • Page 51 Circuit Operation Description 160mm LA03 CN01 LD2000 256k TP31 GND7 LE01 LE02 Figure 2. Layout of 42" Signal Logic Main Board. Samsung Electronics 5-35...
  • Page 52 Circuit Operation Description (1) Checking Y S /W Figure 3. Connecting The Logic Main Board and The Test JIG Board Figure 4. Connecting Oscilloscope Probe 1 (Trigger) 5-36 Samsung Electronics...
  • Page 53 @ Connect Probe 2 to LY1 28 of The JIG Board (7 (STB_Y) of The Logic Main Board F2016). # Connect Probe 2 to LY1 25 of The JIG Board (6 (TCS_Y) of The Logic Main Board F2016). Samsung Electronics 5-37...
  • Page 54 % Connect Probe 2 to LY1 21 of The JIG Board (8 (SIB) of The Logic Main Board F2016). ^ Connect Probe 2 to LY1 20 of The JIG Board (7 (SIA) of The Logic Main Board F2016). 5-38 Samsung Electronics...
  • Page 55 * Connect Probe 2 to LY1 13 of The JIG Board (6 (YSC) of The Logic Main Board F2016). ( Connect Probe 2 to LY1 10 of The JIG Board (7 (YER) of The Logic Main Board F2016). Samsung Electronics 5-39...
  • Page 56 1 Connect Probe 2 to LY1 8 of The JIG Board (6 (YRR) of The Logic Main Board F2016). 2 Connect Probe 2 to LY1 5 of The JIG Board (5 (YG) of The Logic Main Board F2016). 5-40 Samsung Electronics...
  • Page 57 4 Connect Probe 2 to LY1 2 of The JIG Board (6 (YR) of The Logic Main Board F2016). 5 Connect Probe 2 to LY1 1 of The JIG Board (5 (YS) of The Logic Main Board F2016). Samsung Electronics 5-41...
  • Page 58 6 Connect Probe 2 to 1 and 72 of IC2005, and Check The Following Waveform Shows at Oscilloscope. 7 Connect Probe 2 to 1 and 72 of IC2006, and Check The Following Waveform Shows at Oscilloscope. 8 Connect Probe 2 to 1 and 81 of IC2007, and Check The Following Waveform Shows at Oscilloscope. 5-42 Samsung Electronics...
  • Page 59 Circuit Operation Description 9 Connect Probe 2 to 1 and 81 of IC2008, and Check The Following Waveform Shows at Oscilloscope. Samsung Electronics 5-43...
  • Page 60 @ Connect Probe 2 to LX1 4 of The JIG Board (7 (XR) of The Logic Main Board F2016). # Connect Probe 2 to LX1 6 of The JIG Board (8 (XS) of The Logic Main Board F2016). 5-44 Samsung Electronics...
  • Page 61 $ Connect Probe 2 to LX1 8 of The JIG Board (5 (XF) of The Logic Main Board F2016). % Connect Probe 2 to LX1 10 of The JIG Board (6 (XG) of The Logic Main Board F2016). Samsung Electronics 5-45...

  • Page 62: Other Equipment

    R0(TP13,TP49), R1(TP16,TP52), G0(TP14,TP50), G1(TP17,TP53), B0(TP15,TP51), and B1(TP18,TP54) in The JIG Board (8) After T/S, turn off the power supply, and disconnect the connector. Record the result on the examina- tion sheet. 5-46 Samsung Electronics...
  • Page 63 Circuit Operation Description Figure 5. 42” Single logic buffer Samsung Electronics 5-47...
  • Page 64 Circuit Operation Description (3) Checking buffer data ! TP 13 ~ 18, 49 ~ 54 of The Test JIG Board @ 21, 57 of The Test JIG Board # 24, 31, 60, 67 of The Test JIG Board 5-48 Samsung Electronics...
  • Page 65 Circuit Operation Description $ TP 25, 32, 61, 68 of The Test JIG Board % TP 19, 26, 55, 62 of The Test JIG Board ^ TP 20, 27, 56, 63 of The Test JIG Board Samsung Electronics 5-49...

  • Page 66: Main Board Block Diagram

    Circuit Operation Description 5-4 Block Diagram 5-4-1 Main Board Block Diagram 5-50 Samsung Electronics...
  • Page 67 - It is the waveform when it is not connected to the panel. * You should check that a single scan waveform is outputted!!! Y output waveform (200us/div, 100V/div) * You should check that energy recovery software is in operation!!! Samsung Electronics 5-51...
  • Page 68 Circuit Operation Description ❏ X output waveform - It is the waveform when it is not connected to the panel. X output waveform (200us/div, 100V/div) * You should check that energy recovery software is in operation!!! 5-52 Samsung Electronics...
  • Page 69 Circuit Operation Description 5-6 Main I/O signal pules and voltages 5-6-1 Signal Pulses of Image Board(Input Signal Conditions : 7 Color bar) Samsung Electronics 5-53...

  • Page 70: Circuit Operation Description

    Circuit Operation Description 5-54 Samsung Electronics...
  • Page 71 Circuit Operation Description Samsung Electronics 5-55...
  • Page 72 MEMO 5-56 Samsung Electronics...
  • Page 73 Circuit Operation Description Samsung Electronics 5-57...

  • Page 74: Electrical Parts List

    Electrical Parts List 8. Electrical Parts List 8-1 PS42P2SBX/XEC Level Loc. No. Code No. Description ; Specification Remark Level Loc. No. Code No. Description ; Specification Remark ASSY STB-PDP ..4 C062 2203-000274 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 C063 2203-000274 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, BN91-00564A ASSY STB-PDP;D53A,PS-42PNSB,RFAVFAV SN.A...
  • Page 75 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C531 2203-000761 C-CERAMIC,CHIP;330nF,10%,16V,X7R,TP,2012 ..4 C321 2203-000405 C-CERAMIC,CHIP;0.18nF,5%,50V,NP0,TP,1608 ..4 C532 2203-000761 C-CERAMIC,CHIP;330nF,10%,16V,X7R,TP,2012 ..4 C325 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C533 2203-000938 C-CERAMIC,CHIP;0.47nF,5%,50V,NP0,TP,2012 ..4 C326 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C534 2203-000761 C-CERAMIC,CHIP;330nF,10%,16V,X7R,TP,2012 ..4 C327 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C535 2203-000761 C-CERAMIC,CHIP;330nF,10%,16V,X7R,TP,2012 Samsung Electronics...
  • Page 76 2203-000440 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,- ..4 C813 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C662 2203-000975 C-CERAMIC,CHIP;47nF,10%,25V,X7R,TP,1608, ..4 C814 2402-001049 C-AL,CHIP;10uF,20%,16V,GP,TP,3.3x3.3x5.4 ..4 C663 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C815 2402-001049 C-AL,CHIP;10uF,20%,16V,GP,TP,3.3x3.3x5.4 ..4 C664 2203-000975 C-CERAMIC,CHIP;47nF,10%,25V,X7R,TP,1608, ..4 C816 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C665 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C817 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, Samsung Electronics...
  • Page 77 2203-000634 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,201 ..4 CP063 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CC803 2203-000634 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,201 ..4 CP070 2402-001071 C-AL,SMD;220uF,20%,10V,GP,TP,8.3x8.3x6..4 CC869 2203-000634 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,201 ..4 CP071 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CC870 2203-000634 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,201 ..4 CP075 2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6.6x5.4 ..4 CC885 2203-000634 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,201 ..4 CP076 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, Samsung Electronics...
  • Page 78 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 DZ210 0403-001117 DIODE-ZENER;RLZ12B,5%,500mW,LL-34,TP ..4 CS675 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 DZ421 0403-001117 DIODE-ZENER;RLZ12B,5%,500mW,LL-34,TP ..4 CS676 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 DZ441 0403-001117 DIODE-ZENER;RLZ12B,5%,500mW,LL-34,TP ..4 CT051 2203-000274 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 DZ451 0403-001016 DIODE-ZENER;RLZ6.2B,6.2V,5.96-6.27V,400m ..4 CT052 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 DZ452 0403-001016 DIODE-ZENER;RLZ6.2B,6.2V,5.96-6.27V,400m Samsung Electronics...
  • Page 79 3301-001404 CORE-FERRITE BEAD;AB,30ohm,20x1.25x1mm,2 ..4 IC804 1203-001824 IC-VOL. DETECTOR;7042,SOT-89,3P,-,PLASTI ..4 EFP210 3301-001404 CORE-FERRITE BEAD;AB,30ohm,20x1.25x1mm,2 ..4 IC805 0801-002267 IC-CMOS LOGIC;74LCX14,-,SOIC,14P,150MIL, ..4 EFP211 3301-001404 CORE-FERRITE BEAD;AB,30ohm,20x1.25x1mm,2 ..4 IC971 0909-001032 IC-REAL TIME CLOCK;8563,-,SOP,8P,153MIL, ..4 EFP212 3301-001404 CORE-FERRITE BEAD;AB,30ohm,20x1.25x1mm,2 ..4 ICB602 1205-001606 IC-BUFFER;CY2305SC-1H,SOIC,8P,150MIL,PLA Samsung Electronics...
  • Page 80 2007-000071 R-CHIP;22ohm,5%,1/16W,DA,TP,1608 ..4 R246 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 ..4 R005 2007-000290 R-CHIP;100OHM,5%,1/10W,DA,TP,2012 ..4 R247 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 ..4 R006 2007-000290 R-CHIP;100OHM,5%,1/10W,DA,TP,2012 ..4 R248 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 ..4 R007 2007-000290 R-CHIP;100OHM,5%,1/10W,DA,TP,2012 ..4 R249 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 ..4 R008 2007-001009 R-CHIP;51KOHM,5%,1/10W,DA,TP,2012 ..4 R252 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 Samsung Electronics...
  • Page 81 2007-000072 R-CHIP;47ohm,5%,1/16W,DA,TP,1608 ..4 R663 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R511 2007-000072 R-CHIP;47ohm,5%,1/16W,DA,TP,1608 ..4 R668 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R514 2007-001167 R-CHIP;75ohm,5%,1/16W,DA,TP,1608 ..4 R669 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R515 2007-001166 R-CHIP;75OHM,5%,1/10W,DA,TP,2012 ..4 R670 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 ..4 R516 2007-001167 R-CHIP;75ohm,5%,1/16W,DA,TP,1608 ..4 R671 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 Samsung Electronics...
  • Page 82 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 RB433 2007-000586 R-CHIP;22KOHM,5%,1/10W,DA,TP,2012 ..4 R840 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 RB434 2007-000586 R-CHIP;22KOHM,5%,1/10W,DA,TP,2012 ..4 R841 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 RB436 2007-000931 R-CHIP;470OHM,5%,1/10W,DA,TP,2012 ..4 R842 2007-000290 R-CHIP;100OHM,5%,1/10W,DA,TP,2012 ..4 RB437 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R843 2007-000931 R-CHIP;470OHM,5%,1/10W,DA,TP,2012 ..4 RB438 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 Samsung Electronics...
  • Page 83 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608 ..4 RS165 2007-001166 R-CHIP;75OHM,5%,1/10W,DA,TP,2012 ..4 RE408 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608 ..4 RS166 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 RE409 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608 ..4 RS167 2007-000290 R-CHIP;100OHM,5%,1/10W,DA,TP,2012 ..4 RE410 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608 ..4 RS168 2007-000468 R-CHIP;1KOHM,5%,1/10W,DA,TP,2012 ..4 RE411 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608 ..4 RS169 2007-001167 R-CHIP;75ohm,5%,1/16W,DA,TP,1608 8-10 Samsung Electronics...
  • Page 84 2007-000071 R-CHIP;22ohm,5%,1/16W,DA,TP,1608 ..4 LS004 AA27-00119A COIL CHOKE;10uH,-,10uH,10%,0.07,0.1ohm M ..4 RT055 2007-000071 R-CHIP;22ohm,5%,1/16W,DA,TP,1608 ..4 LS005 AA27-00119A COIL CHOKE;10uH,-,10uH,10%,0.07,0.1ohm M ..4 RT056 2007-000071 R-CHIP;22ohm,5%,1/16W,DA,TP,1608 ..4 LS006 AA27-00119A COIL CHOKE;10uH,-,10uH,10%,0.07,0.1ohm M ..4 RT071 2007-000309 R-CHIP;10ohm,5%,1/16W,DA,TP,1608 ..4 LS007 AA27-00119A COIL CHOKE;10uH,-,10uH,10%,0.07,0.1ohm M Samsung Electronics 8-11...
  • Page 85 CB+SCR 6003-001026 SCREW-TAPTITE;RH,+,B,M4,L15,ZPC(BLK),SWR S.N.A ...3 SW01 3404-000178 SWITCH-TACT;12V,50mA,120gf,6x6mm,SPST ...3 PM+CB 6003-000334 SCREW-TAPTITE;RH,+,2S,M3,L6,ZPC(YEL),SWR S.N.A ...3 SW02 3404-000178 SWITCH-TACT;12V,50mA,120gf,6x6mm,SPST ...3 PS+CB 6006-001035 SCREW-ASS’Y MACH;WSP,PH,+,M3,L8,ZPC(YEL) ...3 SW03 3404-000178 SWITCH-TACT;12V,50mA,120gf,6x6mm,SPST ...3 PS+CB 6003-000334 SCREW-TAPTITE;RH,+,2S,M3,L6,ZPC(YEL),SWR S.N.A ...3 SW04 3404-000178 SWITCH-TACT;12V,50mA,120gf,6x6mm,SPST ...3 MD63-00005B COVER-TOP;SM-C30,T165,SECC,T0.8,GRAY S.N.A 8-12 Samsung Electronics...
  • Page 86 ..4 MD64-00037D INLAY-CONTROL;SM-C30 PPR2200,PS SHEET,T0 S.N.A ..4 C133 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 MD64-00038A INLAY-AV;SM-C30,PS SHEET,T0.3 S.N.A ..4 C134 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 AA64-70127A BADGE-BRAND;-,AL,-,-,L=40,SAMSUNG,SILVER S.N.A ..4 C135 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 MD61-00025A SPRING ETC-FLAT,R;SM-C30,SUS,T0.3 S.N.A ..4 C136 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 MD63-00004D COVER-FRONT;SM-C30,PPR2200,ABS,HB,GRAY,G S.N.A ..4 C137...
  • Page 87 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 EY818 AA60-40011A K EYELET;ID2.0,OD2.8,BST S.N.A ..4 RC134 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 ..4 EY823 AA60-40011A K EYELET;ID2.0,OD2.8,BST S.N.A ..4 RC135 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 EY824 AA60-40011A K EYELET;ID2.0,OD2.8,BST S.N.A ..4 RF121 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 EY825 AA60-40011A K EYELET;ID2.0,OD2.8,BST S.N.A 8-14 Samsung Electronics...
  • Page 88 S.N.A BLF+CH 6006-001035 SCREW-ASS’Y MACH;WSP,PH,+,M3,L8,ZPC(YEL) BSA+CB 6006-001035 SCREW-ASS’Y MACH;WSP,PH,+,M3,L8,ZPC(YEL) CB+CF 6003-001019 SCREW-TAPTITE;RH,+,B,M4,L12,ZPC(BLK),SWR S.N.A CB+CHB 6006-001112 SCREW-ASS’Y MACH;WP,PH,+,M8,L16,ZPC(BLK) CF+CHB 6003-001026 SCREW-TAPTITE;RH,+,B,M4,L15,ZPC(BLK),SWR S.N.A CG+GS 6006-001035 SCREW-ASS’Y MACH;WSP,PH,+,M3,L8,ZPC(YEL) COB+CF 6001-000059 SCREW-MACHINE;TH,+,M4,L10,ZPC(BLK),SWRCH S.N.A GS+CHB 6006-001039 SCREW-ASS’Y MACH;WSP,PH,+,M4,L12,ZPC(YEL IFBCHB 6006-001035 SCREW-ASS’Y MACH;WSP,PH,+,M3,L8,ZPC(YEL) Samsung Electronics 8-15...
  • Page 89 2203-000236 C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,1608 ..4 C024 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CT61 2203-000236 C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,1608 ..4 C025 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CT62 2203-000440 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,- ..4 C026 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CT63 2203-000440 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,- ..4 C027 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CT64 2203-000236 C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,1608 ..4 C028 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, 8-16 Samsung Electronics...
  • Page 90 2203-000142 C-CERAMIC,CHIP;1.5nF,10%,50V,X7R,TP,2012 ..4 C319 2203-000818 C-CERAMIC,CHIP;0.033nF,5%,50V,NP0,TP,201 ..4 C224 2402-000135 C-AL,SMD;22uF,20%,16V,GP,TP,5.3x5.3x5.4 ..4 C320 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C225 2402-000135 C-AL,SMD;22uF,20%,16V,GP,TP,5.3x5.3x5.4 ..4 C321 2203-000405 C-CERAMIC,CHIP;0.18nF,5%,50V,NP0,TP,1608 ..4 C226 2402-000135 C-AL,SMD;22uF,20%,16V,GP,TP,5.3x5.3x5.4 ..4 C325 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C227 2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6.6x5.4 ..4 C326 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, Samsung Electronics 8-17...
  • Page 91 2203-000761 C-CERAMIC,CHIP;330nF,10%,16V,X7R,TP,2012 ..4 C659 2203-000975 C-CERAMIC,CHIP;47nF,10%,25V,X7R,TP,1608, ..4 C531 2203-000761 C-CERAMIC,CHIP;330nF,10%,16V,X7R,TP,2012 ..4 C660 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C532 2203-000761 C-CERAMIC,CHIP;330nF,10%,16V,X7R,TP,2012 ..4 C661 2203-000440 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,- ..4 C533 2203-000938 C-CERAMIC,CHIP;0.47nF,5%,50V,NP0,TP,2012 ..4 C662 2203-000975 C-CERAMIC,CHIP;47nF,10%,25V,X7R,TP,1608, ..4 C534 2203-000761 C-CERAMIC,CHIP;330nF,10%,16V,X7R,TP,2012 ..4 C663 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, 8-18 Samsung Electronics...
  • Page 92 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CC679 2203-000634 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,201 ..4 C812 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CC680 2203-000634 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,201 ..4 C813 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CC803 2203-000634 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,201 ..4 C814 2402-001049 C-AL,CHIP;10uF,20%,16V,GP,TP,3.3x3.3x5.4 ..4 CC869 2203-000634 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,201 ..4 C815 2402-001049 C-AL,CHIP;10uF,20%,16V,GP,TP,3.3x3.3x5.4 ..4 CC870 2203-000634 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,201 Samsung Electronics 8-19...
  • Page 93 2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6.6x5.4 ..4 CS672 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CP063 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CS673 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CP070 2402-001071 C-AL,SMD;220uF,20%,10V,GP,TP,8.3x8.3x6..4 CS674 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CP071 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CS675 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CP075 2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6.6x5.4 ..4 CS676 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, 8-20 Samsung Electronics...
  • Page 94 3301-001404 CORE-FERRITE BEAD;AB,30ohm,20x1.25x1mm,2 ..4 DZ201 0403-001117 DIODE-ZENER;RLZ12B,5%,500mW,LL-34,TP ..4 EFP131 3301-001404 CORE-FERRITE BEAD;AB,30ohm,20x1.25x1mm,2 ..4 DZ210 0403-001117 DIODE-ZENER;RLZ12B,5%,500mW,LL-34,TP ..4 EFP201 3301-001404 CORE-FERRITE BEAD;AB,30ohm,20x1.25x1mm,2 ..4 DZ421 0403-001117 DIODE-ZENER;RLZ12B,5%,500mW,LL-34,TP ..4 EFP210 3301-001404 CORE-FERRITE BEAD;AB,30ohm,20x1.25x1mm,2 ..4 DZ441 0403-001117 DIODE-ZENER;RLZ12B,5%,500mW,LL-34,TP ..4 EFP211 3301-001404 CORE-FERRITE BEAD;AB,30ohm,20x1.25x1mm,2 Samsung Electronics 8-21...
  • Page 95 2007-000071 R-CHIP;22ohm,5%,1/16W,DA,TP,1608 ..4 IC803 1006-001076 IC-DRIVER/RECEIVER;232,SOP,16P,300MIL,DU ..4 R003 2007-000071 R-CHIP;22ohm,5%,1/16W,DA,TP,1608 ..4 IC804 1203-001824 IC-VOL. DETECTOR;7042,SOT-89,3P,-,PLASTI ..4 R004 2007-000071 R-CHIP;22ohm,5%,1/16W,DA,TP,1608 ..4 IC805 0801-002267 IC-CMOS LOGIC;74LCX14,-,SOIC,14P,150MIL, ..4 R005 2007-000290 R-CHIP;100OHM,5%,1/10W,DA,TP,2012 ..4 IC971 0909-001032 IC-REAL TIME CLOCK;8563,-,SOP,8P,153MIL, ..4 R006 2007-000290 R-CHIP;100OHM,5%,1/10W,DA,TP,2012 8-22 Samsung Electronics...
  • Page 96 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 ..4 R509 2007-000072 R-CHIP;47ohm,5%,1/16W,DA,TP,1608 ..4 R245 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 ..4 R510 2007-000072 R-CHIP;47ohm,5%,1/16W,DA,TP,1608 ..4 R246 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 ..4 R511 2007-000072 R-CHIP;47ohm,5%,1/16W,DA,TP,1608 ..4 R247 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 ..4 R514 2007-001167 R-CHIP;75ohm,5%,1/16W,DA,TP,1608 ..4 R248 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 ..4 R515 2007-001166 R-CHIP;75OHM,5%,1/10W,DA,TP,2012 Samsung Electronics 8-23...
  • Page 97 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R837 2007-000290 R-CHIP;100OHM,5%,1/10W,DA,TP,2012 ..4 R663 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R838 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R668 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R839 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R669 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R840 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R670 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 ..4 R841 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 8-24 Samsung Electronics...
  • Page 98 2007-001166 R-CHIP;75OHM,5%,1/10W,DA,TP,2012 ..4 RE406 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608 ..4 RB432 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 RE407 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608 ..4 RB433 2007-000586 R-CHIP;22KOHM,5%,1/10W,DA,TP,2012 ..4 RE408 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608 ..4 RB434 2007-000586 R-CHIP;22KOHM,5%,1/10W,DA,TP,2012 ..4 RE409 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608 ..4 RB436 2007-000931 R-CHIP;470OHM,5%,1/10W,DA,TP,2012 ..4 RE410 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608 Samsung Electronics 8-25...
  • Page 99 2007-000072 R-CHIP;47ohm,5%,1/16W,DA,TP,1608 ..4 RT051 2007-000300 R-CHIP;10KOHM,5%,1/10W,DA,TP,2012 ..4 RS165 2007-001166 R-CHIP;75OHM,5%,1/10W,DA,TP,2012 ..4 RT052 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012 ..4 RS166 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 RT053 2007-001001 R-CHIP;510OHM,5%,1/10W,DA,TP,2012 ..4 RS167 2007-000290 R-CHIP;100OHM,5%,1/10W,DA,TP,2012 ..4 RT054 2007-000071 R-CHIP;22ohm,5%,1/16W,DA,TP,1608 ..4 RS168 2007-000468 R-CHIP;1KOHM,5%,1/10W,DA,TP,2012 ..4 RT055 2007-000071 R-CHIP;22ohm,5%,1/16W,DA,TP,1608 8-26 Samsung Electronics...
  • Page 100 6003-001023 SCREW-TAPTITE;RWH,+,B,M3,L10,ZPC(YEL),SW S.N.A ..5 CIS BP62-00013A HEAT SINK-PS;HLM507W,A1050S,T1.0,21,44.6 S.N.A ...3 PV+CF 6003-001023 SCREW-TAPTITE;RWH,+,B,M3,L10,ZPC(YEL),SW S.N.A ..4 LS004 AA27-00119A COIL CHOKE;10uH,-,10uH,10%,0.07,0.1ohm M ...3 MD96-00003D ASSY COVER P-COVER,FRONT;SM-C30 PPR2200, S.N.A ..4 LS005 AA27-00119A COIL CHOKE;10uH,-,10uH,10%,0.07,0.1ohm M ..4 SF+CF 6003-001023 SCREW-TAPTITE;RWH,+,B,M3,L10,ZPC(YEL),SW S.N.A Samsung Electronics 8-27...
  • Page 101 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ASSY MISC-PDP PBA ..4 C163 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 C164 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 ..4 C165 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, BN91-00535A ASSY MISC-PDP PBA;PS42P2SBX/XEC,D53A S.N.A ..4 C166 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 C167 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 BN94-00369A ASSY PCB MISC-REMOCON MODULE;,42 PDP ..4 C168 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ...3...
  • Page 102 ...3 RX811S 2002-001021 R-COMPOSITION;560KOHM,10%,1/2W,AA,TP,3.7 ..4 RF126 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ...3 VX811S 1405-000152 VARISTOR;560V,2500A,14x8.5mm,TP ..4 RF127 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ...3 BN61-00260B BRACKET-LINE FILTER,ASSY;42P2S,SPC,T1.0, S.N.A ..4 RF128 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 ..4 AA61-00582C BRACKET-LINE,FILTER;SPD-42P2H,SPC,T1.0,N S.N.A ..4 RJ101 2007-000080 R-CHIP;2Kohm,5%,1/16W,DA,TP,1608 ..4 BN63-00414A SHIELD-NOISE;SPD-42P2S1,SUS,T0.5 S.N.A Samsung Electronics 8-29...
  • Page 103 AA41-00807A PCB-MODULE CONTROL;PPR-2200,FR-1,1L,A,1. S.N.A ..4 RC01 2001-000857 R-CARBON;560OHM,5%,1/8W,AA,TP,1.8X3.2MM ASSY COVER REAR ..4 RC02 2001-001026 R-CARBON;910OHM,5%,1/8W,AA,TP,1.8X3.2MM ..4 RC03 2001-000258 R-CARBON;1.8KOHM,5%,1/8W,AA,TP,1.8X3.2MM BN90-00430A ASSY COVER REAR;42P2,PS42P2SBX/XEC S.N.A ..4 RC04 2001-000857 R-CARBON;560OHM,5%,1/8W,AA,TP,1.8X3.2MM ..4 RC05 2001-001026 R-CARBON;910OHM,5%,1/8W,AA,TP,1.8X3.2MM AA91-01611P ASSY-CABINET,BACK;KUJU,HIPS V2 BLK WP100 ..4 RC06 2001-000258 R-CARBON;1.8KOHM,5%,1/8W,AA,TP,1.8X3.2MM ...3...
  • Page 104 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C220 2203-000444 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,2012,- ..4 C027 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C221 2203-000444 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,2012,- ..4 C028 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C222 2203-000142 C-CERAMIC,CHIP;1.5nF,10%,50V,X7R,TP,2012 ..4 C029 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C223 2203-000142 C-CERAMIC,CHIP;1.5nF,10%,50V,X7R,TP,2012 ..4 C051 2203-000274 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 C224 2402-000135 C-AL,SMD;22uF,20%,16V,GP,TP,5.3x5.3x5.4 Samsung Electronics 8-31...
  • Page 105 2203-000818 C-CERAMIC,CHIP;0.033nF,5%,50V,NP0,TP,201 ..4 C526 2402-001049 C-AL,CHIP;10uF,20%,16V,GP,TP,3.3x3.3x5.4 ..4 C316 2203-000595 C-CERAMIC,CHIP;0.22nF,5%,50V,NP0,TP,2012 ..4 C527 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C317 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C528 2402-001071 C-AL,SMD;220uF,20%,10V,GP,TP,8.3x8.3x6..4 C318 2203-000818 C-CERAMIC,CHIP;0.033nF,5%,50V,NP0,TP,201 ..4 C529 2203-000989 C-CERAMIC,CHIP;47nF,10%,50V,X7R,TP,2012 ..4 C319 2203-000818 C-CERAMIC,CHIP;0.033nF,5%,50V,NP0,TP,201 ..4 C530 2203-000761 C-CERAMIC,CHIP;330nF,10%,16V,X7R,TP,2012 8-32 Samsung Electronics...
  • Page 106 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C808 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C657 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C809 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C658 2203-000440 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,- ..4 C810 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C659 2203-000975 C-CERAMIC,CHIP;47nF,10%,25V,X7R,TP,1608, ..4 C811 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C660 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C812 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, Samsung Electronics 8-33...
  • Page 107 2203-000634 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,201 ..4 CP058 2402-001071 C-AL,SMD;220uF,20%,10V,GP,TP,8.3x8.3x6..4 CC605 2203-000634 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,201 ..4 CP059 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CC677 2203-000634 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,201 ..4 CP060 2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6.6x5.4 ..4 CC678 2203-000634 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,201 ..4 CP061 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CC679 2203-000634 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,201 ..4 CP062 2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6.6x5.4 8-34 Samsung Electronics...
  • Page 108 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 DZ114 0403-000314 DIODE-ZENER;RLZJ9.1B,9.1V,8.80-9.30V,400 ..4 CS626 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 DZ115 0403-000314 DIODE-ZENER;RLZJ9.1B,9.1V,8.80-9.30V,400 ..4 CS671 2402-000179 C-AL,SMD;47uF,20%,16V,GP,TP,6.6x6.6x5.4 ..4 DZ130 0403-001117 DIODE-ZENER;RLZ12B,5%,500mW,LL-34,TP ..4 CS672 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 DZ131 0403-001117 DIODE-ZENER;RLZ12B,5%,500mW,LL-34,TP ..4 CS673 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 DZ201 0403-001117 DIODE-ZENER;RLZ12B,5%,500mW,LL-34,TP Samsung Electronics 8-35...
  • Page 109 ..4 EFP103 3301-001404 CORE-FERRITE BEAD;AB,30ohm,20x1.25x1mm,2 ..4 IC701 1006-001131 IC-RECEIVER;151,QFP,100P,-,-,TR,PLASTIC, ..4 EFP104 3301-001404 CORE-FERRITE BEAD;AB,30ohm,20x1.25x1mm,2 ..4 IC761 1103-000129 IC-EEPROM;24C02,256x8BIT,SOP,8P,150MIL,1 ..4 EFP105 3301-001404 CORE-FERRITE BEAD;AB,30ohm,20x1.25x1mm,2 ..4 IC801 1003-001492 IC-LCD CONTROLLER;PW166B-20T,PBGA,256P,2 ..4 EFP130 3301-001404 CORE-FERRITE BEAD;AB,30ohm,20x1.25x1mm,2 ..4 IC802 1103-001195 IC-EEPROM;24C64,8Kx8Bit,SOP,8P,150MIL,10 8-36 Samsung Electronics...
  • Page 110 ..4 R241 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 QS462 0501-000344 TR-SMALL SIGNAL;KSC1623-G,NPN,200mW,SOT- ..4 R242 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R001 2007-000468 R-CHIP;1KOHM,5%,1/10W,DA,TP,2012 ..4 R243 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R002 2007-000071 R-CHIP;22ohm,5%,1/16W,DA,TP,1608 ..4 R244 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 ..4 R003 2007-000071 R-CHIP;22ohm,5%,1/16W,DA,TP,1608 ..4 R245 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 Samsung Electronics 8-37...
  • Page 111 2007-001166 R-CHIP;75OHM,5%,1/10W,DA,TP,2012 ..4 R658 2007-001166 R-CHIP;75OHM,5%,1/10W,DA,TP,2012 ..4 R506 2007-001166 R-CHIP;75OHM,5%,1/10W,DA,TP,2012 ..4 R659 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R507 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R660 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012 ..4 R508 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R661 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R509 2007-000072 R-CHIP;47ohm,5%,1/16W,DA,TP,1608 ..4 R662 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 8-38 Samsung Electronics...
  • Page 112 2007-000290 R-CHIP;100OHM,5%,1/10W,DA,TP,2012 ..4 RB426 2007-000931 R-CHIP;470OHM,5%,1/10W,DA,TP,2012 ..4 R834 2007-000290 R-CHIP;100OHM,5%,1/10W,DA,TP,2012 ..4 RB427 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R836 2007-000872 R-CHIP;4.7KOHM,5%,1/10W,DA,TP,2012 ..4 RB428 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R837 2007-000290 R-CHIP;100OHM,5%,1/10W,DA,TP,2012 ..4 RB431 2007-001166 R-CHIP;75OHM,5%,1/10W,DA,TP,2012 ..4 R838 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 RB432 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 Samsung Electronics 8-39...
  • Page 113 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 RS160 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 RE403 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608 ..4 RS161 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 RE404 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608 ..4 RS162 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 RE405 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 ..4 RS163 2007-000468 R-CHIP;1KOHM,5%,1/10W,DA,TP,2012 ..4 RE406 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608 ..4 RS164 2007-000072 R-CHIP;47ohm,5%,1/16W,DA,TP,1608 8-40 Samsung Electronics...
  • Page 114 2007-001167 R-CHIP;75ohm,5%,1/16W,DA,TP,1608 ..4 ICS001 BP96-00141A ASSY HEAT SINK P;H/S,SPRING,TA2020,OIL S S.N.A ..4 RS492 2007-001167 R-CHIP;75ohm,5%,1/16W,DA,TP,1608 ..5 CIS 0205-001027 OIL-SILICON;G746,-,- S.N.A ..4 RT051 2007-000300 R-CHIP;10KOHM,5%,1/10W,DA,TP,2012 ..5 CIS 1201-001885 IC-AUDIO AMP;TA2020-020,SSIP,32P,649MIL, ..4 RT052 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012 ..5 CIS BP61-00129A BRACKET-TR;,617W,T0.4,SUS-1 S.N.A Samsung Electronics 8-41...
  • Page 115 ..4 MD64-00037D INLAY-CONTROL;SM-C30 PPR2200,PS SHEET,T0 S.N.A ..6 CS002 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 MD64-00038A INLAY-AV;SM-C30,PS SHEET,T0.3 S.N.A ..6 CS003 2402-000130 C-AL,SMD;2.2uF,20%,50V,GP,TP,4.3x4.3x5..4 AA64-70127A BADGE-BRAND;-,AL,-,-,L=40,SAMSUNG,SILVER S.N.A ..6 CS004 2402-000130 C-AL,SMD;2.2uF,20%,50V,GP,TP,4.3x4.3x5..4 MD61-00025A SPRING ETC-FLAT,R;SM-C30,SUS,T0.3 S.N.A ..6 CS005 2203-000440 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,- ..4 MD63-00004D COVER-FRONT;SM-C30,PPR2200,ABS,HB,GRAY,G S.N.A ..6 CS006...
  • Page 116 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ASSY MISC-PDP PBA ..4 C163 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 C164 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 ..4 C165 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, BN91-00535A ASSY MISC-PDP PBA;PS42P2SBX/XEC,D53A S.N.A ..4 C166 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 C167 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 BN94-00369A ASSY PCB MISC-REMOCON MODULE;,42 PDP ..4 C168 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ...3...
  • Page 117 PCB+BL 6006-001035 SCREW-ASS’Y MACH;WSP,PH,+,M3,L8,ZPC(YEL) ..4 RF121 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ...3 PD811S 3711-000203 CONNECTOR-HEADER;1WALL,2P,1R,7.92MM,STRA ..4 RF126 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ...3 RX811S 2002-001021 R-COMPOSITION;560KOHM,10%,1/2W,AA,TP,3.7 ..4 RF127 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ...3 VX811S 1405-000152 VARISTOR;560V,2500A,14x8.5mm,TP ..4 RF128 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 ...3 BN61-00260B BRACKET-LINE FILTER,ASSY;42P2S,SPC,T1.0, S.N.A 8-44 Samsung Electronics...
  • Page 118 AA41-00807A PCB-MODULE CONTROL;PPR-2200,FR-1,1L,A,1. S.N.A ..4 RC01 2001-000857 R-CARBON;560OHM,5%,1/8W,AA,TP,1.8X3.2MM ASSY COVER REAR ..4 RC02 2001-001026 R-CARBON;910OHM,5%,1/8W,AA,TP,1.8X3.2MM ..4 RC03 2001-000258 R-CARBON;1.8KOHM,5%,1/8W,AA,TP,1.8X3.2MM BN90-00430A ASSY COVER REAR;42P2,PS42P2SBX/XEC S.N.A ..4 RC04 2001-000857 R-CARBON;560OHM,5%,1/8W,AA,TP,1.8X3.2MM ..4 RC05 2001-001026 R-CARBON;910OHM,5%,1/8W,AA,TP,1.8X3.2MM AA91-01611P ASSY-CABINET,BACK;KUJU,HIPS V2 BLK WP100 ..4 RC06 2001-000258 R-CARBON;1.8KOHM,5%,1/8W,AA,TP,1.8X3.2MM ...3...
  • Page 119 2203-000274 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 C235 2402-000135 C-AL,SMD;22uF,20%,16V,GP,TP,5.3x5.3x5.4 ..4 C063 2203-000274 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 C236 2402-000135 C-AL,SMD;22uF,20%,16V,GP,TP,5.3x5.3x5.4 ..4 C064 2203-000274 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 C237 2402-000135 C-AL,SMD;22uF,20%,16V,GP,TP,5.3x5.3x5.4 ..4 C065 2203-000274 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 C238 2402-000135 C-AL,SMD;22uF,20%,16V,GP,TP,5.3x5.3x5.4 ..4 C066 2203-000274 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 C239 2402-000135 C-AL,SMD;22uF,20%,16V,GP,TP,5.3x5.3x5.4 8-46 Samsung Electronics...
  • Page 120 2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6.6x5.4 ..4 C554 2203-000575 C-CERAMIC,CHIP;220NF,10%,25V,X7R,TP,2012 ..4 C352 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C555 2203-000575 C-CERAMIC,CHIP;220NF,10%,25V,X7R,TP,2012 ..4 C353 2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6.6x5.4 ..4 C556 2203-000575 C-CERAMIC,CHIP;220NF,10%,25V,X7R,TP,2012 ..4 C354 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C557 2203-000761 C-CERAMIC,CHIP;330nF,10%,16V,X7R,TP,2012 ..4 C355 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C558 2203-000761 C-CERAMIC,CHIP;330nF,10%,16V,X7R,TP,2012 Samsung Electronics 8-47...
  • Page 121 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C823 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C673 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C824 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C677 2402-001150 C-AL,SMD;47UF,20%,16V,-,TP,6.3X5.8MM ..4 C825 2203-000761 C-CERAMIC,CHIP;330nF,10%,16V,X7R,TP,2012 ..4 C678 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C826 2402-001049 C-AL,CHIP;10uF,20%,16V,GP,TP,3.3x3.3x5.4 ..4 C679 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 C827 2203-000429 C-CERAMIC,CHIP;0.018nF,5%,50V,NP0,TP,201 8-48 Samsung Electronics...
  • Page 122 2203-000260 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,2012 ..4 CS137 2203-000181 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, ..4 CE056 2203-000260 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,2012 ..4 CS138 2402-001049 C-AL,CHIP;10uF,20%,16V,GP,TP,3.3x3.3x5.4 ..4 CE057 2203-000683 C-CERAMIC,CHIP;0.027nF,5%,50V,NP0,TP,201 ..4 CS139 2402-001049 C-AL,CHIP;10uF,20%,16V,GP,TP,3.3x3.3x5.4 ..4 CE058 2203-000239 C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,2012 ..4 CS140 2402-001049 C-AL,CHIP;10uF,20%,16V,GP,TP,3.3x3.3x5.4 ..4 CE059 2402-001049 C-AL,CHIP;10uF,20%,16V,GP,TP,3.3x3.3x5.4 ..4 CS141 2402-001049 C-AL,CHIP;10uF,20%,16V,GP,TP,3.3x3.3x5.4 Samsung Electronics 8-49...
  • Page 123 DZE051 0403-001016 DIODE-ZENER;RLZ6.2B,6.2V,5.96-6.27V,400m ..4 CT060 2203-000274 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 EF110 3301-001593 CORE-FERRITE BEAD;AB,200OHM,2.0X1.2X1.3M ..4 CT061 2203-000274 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 EF111 3301-001593 CORE-FERRITE BEAD;AB,200OHM,2.0X1.2X1.3M ..4 CT062 2203-000274 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 EF112 3301-001593 CORE-FERRITE BEAD;AB,200OHM,2.0X1.2X1.3M ..4 CT063 2402-001049 C-AL,CHIP;10uF,20%,16V,GP,TP,3.3x3.3x5.4 ..4 EF113 3301-001593 CORE-FERRITE BEAD;AB,200OHM,2.0X1.2X1.3M 8-50 Samsung Electronics...
  • Page 124 3301-001404 CORE-FERRITE BEAD;AB,30ohm,20x1.25x1mm,2 ..4 ICS621 1001-001067 IC-ANALOG SWITCH;QS34X245-Q3,CMOS,TQSOP, ..4 EFP351 3301-001404 CORE-FERRITE BEAD;AB,30ohm,20x1.25x1mm,2 ..4 ICS671 1001-001067 IC-ANALOG SWITCH;QS34X245-Q3,CMOS,TQSOP, ..4 EFP401 3301-001404 CORE-FERRITE BEAD;AB,30ohm,20x1.25x1mm,2 ..4 ICT051 1205-001778 IC-TRANSMITTER;SII160CT100,TQFP,100P,551 ..4 EFP451 3301-001404 CORE-FERRITE BEAD;AB,30ohm,20x1.25x1mm,2 ..4 IQ031 1203-001815 IC-POSI.FIXED REG.;78M09,TO-252,3P,-,PLA Samsung Electronics 8-51...
  • Page 125 2007-000872 R-CHIP;4.7KOHM,5%,1/10W,DA,TP,2012 ..4 R271 2007-000872 R-CHIP;4.7KOHM,5%,1/10W,DA,TP,2012 ..4 R016 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R272 2007-000395 R-CHIP;150KOHM,5%,1/10W,DA,TP,2012 ..4 R017 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R273 2007-001039 R-CHIP;56KOHM,5%,1/10W,DA,TP,2012 ..4 R018 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R274 2007-001039 R-CHIP;56KOHM,5%,1/10W,DA,TP,2012 ..4 R101 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R275 2007-000282 R-CHIP;100KOHM,5%,1/10W,DA,TP,2012 8-52 Samsung Electronics...
  • Page 126 2007-001167 R-CHIP;75ohm,5%,1/16W,DA,TP,1608 ..4 R705 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012 ..4 R554 2007-001166 R-CHIP;75OHM,5%,1/10W,DA,TP,2012 ..4 R706 2007-000300 R-CHIP;10KOHM,5%,1/10W,DA,TP,2012 ..4 R555 2007-001166 R-CHIP;75OHM,5%,1/10W,DA,TP,2012 ..4 R709 2007-000774 R-CHIP;33KOHM,5%,1/10W,DA,TP,2012 ..4 R556 2007-001166 R-CHIP;75OHM,5%,1/10W,DA,TP,2012 ..4 R715 2007-000872 R-CHIP;4.7KOHM,5%,1/10W,DA,TP,2012 ..4 R557 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R716 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 Samsung Electronics 8-53...
  • Page 127 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 RB447 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R852 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 RB448 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R853 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 RB451 2007-001166 R-CHIP;75OHM,5%,1/10W,DA,TP,2012 ..4 R854 2007-000290 R-CHIP;100OHM,5%,1/10W,DA,TP,2012 ..4 RB452 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..4 R856 2007-000872 R-CHIP;4.7KOHM,5%,1/10W,DA,TP,2012 ..4 RB453 2007-000586 R-CHIP;22KOHM,5%,1/10W,DA,TP,2012 8-54 Samsung Electronics...
  • Page 128 2007-000290 R-CHIP;100OHM,5%,1/10W,DA,TP,2012 ..4 RS177 2007-001247 R-CHIP;91OHM,5%,1/10W,DA,TP,2012 ..4 RE419 2007-000290 R-CHIP;100OHM,5%,1/10W,DA,TP,2012 ..4 RS201 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 ..4 RE420 2007-000872 R-CHIP;4.7KOHM,5%,1/10W,DA,TP,2012 ..4 RS202 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 ..4 RF655 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 ..4 RS203 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 ..4 RF659 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 ..4 RS204 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 Samsung Electronics 8-55...
  • Page 129 2007-000309 R-CHIP;10ohm,5%,1/16W,DA,TP,1608 ..5 CS014 2305-000665 C-FILM,MPEF;100nF,5%,63V,TP,7.5x4.0x5.0m ..4 RT079 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 ..5 CS015 2305-000412 C-FILM,MPEF;470nF,5%,63V,TP,-,5mm ..4 RT080 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 ..5 CS016 2305-000412 C-FILM,MPEF;470nF,5%,63V,TP,-,5mm ..4 RT082 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..5 CS017 2305-000412 C-FILM,MPEF;470nF,5%,63V,TP,-,5mm ..4 RT083 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ..5 RS010 2008-001033 R-FUSIBLE(S);10ohm,5%,2W,AF,TP,3.9x10mm 8-56 Samsung Electronics...
  • Page 130 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V ...3 PV+CF 6003-001023 SCREW-TAPTITE;RWH,+,B,M3,L10,ZPC(YEL),SW S.N.A ..4 CC03 2401-000922 C-AL;22uF,20%,16V,GP,TP,5x5,5 ...3 MD96-00003D ASSY COVER P-COVER,FRONT;SM-C30 PPR2200, S.N.A ..4 LC01 2701-000114 INDUCTOR-AXIAL;10uH,10%,2.5x3.4mm ..4 SF+CF 6003-001023 SCREW-TAPTITE;RWH,+,B,M3,L10,ZPC(YEL),SW S.N.A ..4 AA41-00721A PCB-CONTROL KEY;PPR-2200,FR-1,1L,A,1.6T, S.N.A ..4 MD64-00030A KNOB-POWER;SM-C30,ABS,HB,GRAY,NE VACUUM S.N.A Samsung Electronics 8-57...
  • Page 131 ..4 MD64-00037D INLAY-CONTROL;SM-C30 PPR2200,PS SHEET,T0 S.N.A ..4 C133 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 MD64-00038A INLAY-AV;SM-C30,PS SHEET,T0.3 S.N.A ..4 C134 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 AA64-70127A BADGE-BRAND;-,AL,-,-,L=40,SAMSUNG,SILVER S.N.A ..4 C135 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 MD61-00025A SPRING ETC-FLAT,R;SM-C30,SUS,T0.3 S.N.A ..4 C136 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, ..4 MD63-00004D COVER-FRONT;SM-C30,PPR2200,ABS,HB,GRAY,G S.N.A ..4...
  • Page 132 ..4 RP152 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ...3 6021-000222 NUT-HEXAGON;2C,M3,ZPC(YEL),SM20C,- S.N.A ..4 RP153 2007-000123 R-CHIP;1.5Kohm,5%,1/16W,DA,TP,1608 AA63-10002A BAND-TIE;NYLON66 V2,L100,NTR S.N.A ..4 RP154 2007-000123 R-CHIP;1.5Kohm,5%,1/16W,DA,TP,1608 BN64-00124A SCREEN-EMI,FITER;FILTER,42P2,T47%,984*58 S.N.A ..4 RP155 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608 MD39-00076A LEAD CONNECTOR;PPR-2200,UL2835#28,UL/CSA ..4 RP156 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608 AA39-00267C LEAD CONNECTOR;T19A/PPR-2200,UL1007#26,U Samsung Electronics 8-59...
  • Page 133 BN96-00117C ASSY COVER P-FRONT;42PNSB,ABS V0,GRAY,G4 ...3 KC+CF 6003-000333 SCREW-TAPTITE;RH,+,2S,M3,L10,ZPC(YEL),SW ...3 BN64-00067A KNOB-CONTROL;42PND,ABS HB,BLK ...3 BN64-00065D CABINET-FRONT;42P2,ABS HB,GRAY,SVM-2012H S.N.A ...3 AA64-01560C BADGE-BRAND;PDP,AL FORGING,L68(45),SILVE S.N.A ...3 AA64-01549B WINDOW-RMC;PDP,ACRYL VIOLET,20:1 S.N.A ...3 AA63-60122D SPACER-FELT;PDP ,FELT,BLK,T0.3,L30*8 S.N.A BN61-00137C BRACKET-FILTER TOP,ASSY;SHIELD-FORM,42PN BN61-00223C BRACKET-FILTER BOT,ASSY;SHIELD-FORM,42PN 8-60 Samsung Electronics...
  • Page 134 AA61-00582C BRACKET-LINE,FILTER;SPD-42P2H,SPC,T1.0,N S.N.A AA95-01819A ASSY SUB-PCB,LINE FILTER;PS42P2S,D53A,AA 6006-001035 SCREW-ASS’Y MACH;WSP,PH,+,M3,L8,ZPC(YEL) PCB+BL 2901-001222 FILTER-EMI AC LINE;250V,10A,UL,CSA,D,N,S AA98-00188A ASSY-PBA,SMPS;,SPD-42P2S,D51A,42SD,90~26 BN91-00535A ASSY MISC-PDP PBA;PS42P2SBX/XEC,D53A S.N.A MD94-01015A ASSY PCB MISC-INTERFACE;PPR-2200,T19A SHIELD-SCALER,BOT 6006-001035 SCREW-ASS’Y MACH;WSP,PH,+,M3,L8,ZPC(YEL) BLFCHB ASSY SUB-PCB TERMINAL BN72-00316A SPONGE-EMI,BOT(L);PDP,SHELD FROM S.N.A AA63-00491H COVER-TERMINAL;42P2SB,SUS,T0.5 S.N.A...
  • Page 135 Anode where discharge of DC panel has little contribution to light output power. Back ground luminance : Referring to the panel luminance in off mode or black screen, in other words, luminance in the vicinity of the screen. Samsung Electronics 10-1...
  • Page 136 (x, y). Here x=X/(X+Y+Z), y=Y/(X+Y+Z). Method for colors, known as (u, v), where image colors are expressed in more even color dimension. Colors of matter are expressed as color coordinates pair (u, v). Here, u=4X/(X+15Y+3Z), y=6Y/(X+15Y+3Z). 10-2 Samsung Electronics...
  • Page 137 I CL - ratio of white luminance to black luminance in white line against black screen of black line against white screen. I CR - the ratio of white luminance to black luminance. Samsung Electronics 10-3...
  • Page 138 Discharge electrode : Another term for sustained electrode. Discharge efficiency : Another term for gloss efficiency Discharge gap : The gap among sustained electrodes in discharge space of three-electrode plasma panel. Discharge slit : (Refer to discharge gap) 10-4 Samsung Electronics...
  • Page 139 Refer to luminous efficacy. Energy recovery circuit : Circuit degauss caught after reusing the power that drove AC plasma panel. Erase : Process where cells are erased from AC plasma panel. Erase pulse : Cell erasing waveform Samsung Electronics 10-5...
  • Page 140 The range of luminance acquired when displayed from black to white. High strain point glass : Glass of which strain point (temperature with viscosity of 1014.5 poise) is relatively high Image retention : Continuous existence of image after the stimulation is removed. 10-6 Samsung Electronics...
  • Page 141 Plasma display panel made up of matrix with rows and columns. Matrix type : Refer to matrix PDP Maximum firing voltage : Voltage value required for triggering discharge in all cells. Maximum sustain voltage : Maximum drive voltage required not to turn off the cells. Samsung Electronics 10-7...
  • Page 142 Opposed discharge PDP : (Refer to opposed discharge.) Peak luminance : Maximum luminance generated in one pixel in panel. Peak luminance enhancement : Circuit and drive technology that accommodates increasing peak luminance. 10-8 Samsung Electronics...
  • Page 143 Rear substrate : Efficiency measurement that is directly expressed with the number of output particles against the number of input particles. In case of plasma panel, the number of photons in visible area, generated from photons in ultraviolet area Samsung Electronics 10-9...
  • Page 144 Plasma display in the form where stimulating discharge occurs for discharge process precedes below panel. Self-scan type PDP : Plasma display in the form where stimulating discharge occurs for discharge process precedes below panel. Self-shift type PDP : Process of combining substrates. High temperature process that melts solder glass combining substrates. 10-10 Samsung Electronics...
  • Page 145 Data electrodes in opposite substrates provide unique writing and erasing signals to each cell Time modulation driving method (Other terms: time division multiplex method) : Modulation method in proportion to certain time applied to stimulation with regular output. Output strength is changed according to input time. Samsung Electronics 10-11...
  • Page 146 Curve expressed with wall transfer that is caused by any changes in electric charges including wall charges and wall charge pulse related parameters. White back : White coating for minimize absorbing valid gloss, located black contrast improvement layer and fluores- cent material. Write electrode : (Refer to data electrode.) 10-12 Samsung Electronics...
  • Page 147 Glossary Write electrode : (Refer to data electrode)[symbol : Pw] Write electrode : (Refer to data electrode)[symbol : Vw] Samsung Electronics 10-13...
  • Page 148 MEMO 10-14 Samsung Electronics...

  • Page 149: Basic Description

    External input selection. MENU Menu display. Volume adjustment. C/P. Channel selection Temporary sound switch off. Rear Panel DISPLAY SIGNAL IN POWER IN Plug the mains lead into an appropriate Connect the video cable between the PDP socket. and Media Station. Samsung Electronics...
  • Page 150 Signals” on page 51. Output of input signal for display. e) SURROUND OUT POWER OUT Surround amplifier (S-L/S-R) or powered speaker Power output. (CENTER/SUB-WOOFER) connection to take full advantage of the surround sound effect. m) POWER IN Power input. Samsung Electronics...
  • Page 151 DISPLAY SIGNAL OUT Output of input signal for display. e) SURROUND OUT Surround amplifier (S-L/S-R) or powered speaker POWER OUT (CENTER/SUB-WOOFER) connection to take full Power output. advantage of the surround sound effect. m) POWER IN Power input. Samsung Electronics...

  • Page 152: Remote Control

    TELETEXT CANCEL TELETEXT OFF (Refer to page 30 for details) STILL THE MAIN PICTURE FASTEXT TOPIC SELECTION In the PIP mode, the main and sub pictures are stilled at the same time. SOUND EFFECT SELECTION PICTURE EFFECT SELECTION Samsung Electronics...

  • Page 153: Wall Mount

    Places subject to vibration or shock. Near high voltage cables. Around heating apparatus. 3. Install the PDP considering the construction of the wall. 4. Use only recommended parts and components for installation. 9-2-2 Parts(wall attachment panel is sold separately.) Fixing bolt Insulation rubber Samsung Electronics...

  • Page 154: Installing The Display On The Wall Attachment Panel

    When the angle has When the panel hasn’t been set to 5 degrees. been set to15 degrees. been tilted. Angle control holes 5 degrees of tilt 10 degrees of tilt 15 degrees of tilt No tilt 20 degrees of tilt Samsung Electronics...
  • Page 155 PDP up the groove on the top of the wall attachment panel. Then, lift down the PDP.(Do not lift down the PDP with too much force. The protruding plastic part might be taken off.) Samsung Electronics...
  • Page 156 Handling Description 9-2-4 Separating the Display from the Wall Attachment Panel : After lifting the PDP up, pull it forward and remove it from the wall attachement panel. Samsung Electronics...

  • Page 157: Connecting Pdp And Speakers

    The speakers MUST have more than 15watts rating(impedance 8Ω ). The ferrite cores are used to attenuate undesired signals. When you connect the speaker wire to the EXTERNAL SPEAKER OUT(8Ω) connector, bind the speaker wire round the ferrite core to secure it. Samsung Electronics...
  • Page 158 MEMO 9-10 Samsung Electronics...

  • Page 159: Safety Precautions

    The current measured should not exceed 3.5 milliamp. Reverse the power- plug prongs in the AC outlet and repeat the test. Samsung Electronics...
  • Page 160 Always determine the cause of damage or overheat- ing, and correct any potential hazards. 14. Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and especially the AC and high Samsung Electronics...

  • Page 161: Servicing Precautions

    Do not apply AC power to the unit (or any of its assemblies) unless all solid-state heat sinks are correctly installed. 7. Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive lead; always remove the instrument’s ground lead last. Samsung Electronics...

  • Page 162: Precautions For Electrostatically Sensitive Devices (Esds)

    4. Do not use freon-propelled chemicals. These unpackaged replacement ESDs. Motions such can generate electrical charges that damage as brushing clothes together, or lifting a foot ESDs. from a carpeted floor can generate enough static electricity to damage an ESD. Samsung Electronics...

  • Page 163: Specifications

    PC In, DVI-I In, Display Signal Out(DVI-I Connector) PDP Monitor : 100~240V Power Supply Media Station : 100~240V Power Consumption PDP Monitor : 350W, Media Station : 35W Screen Size 852 x 474(106 cm)/33.54 x 18.66(42inchs) Adjustment System Electronic Function Adjustment Samsung Electronics...
  • Page 164 MENO Samsung Electronics...

  • Page 165: Reference Information

    Millimeter Hour Millisecond Inches Per Second Millivolt Kilowatt-hour Nanofarad Ω Kilogram Kilohertz Picofarad kΩ Kilohm Pound Kilometer Revolutions Per Minute km/h Kilometer Per Hour Revolutions Per Second Kilovolt Second (Time) Kilovolt-ampere Volt Kilowatt Volt-ampere Liter Watt Megahertz Watt-hour Samsung Electronics...
  • Page 166 Fail Safe Voltage Controlled Oscillator Ground VCXO Voltage Controlled Crystal Oscillator Green-Y Very High Frequency High Video Intermediate Frequency High-Frequency Variable Resistor HI-FI High Fidelity Video Tape Recorder Inductance-Capacitance VTVM Vacuum Tube Voltmeter Integrated Circuit Transistor Intermediate Frequency Samsung Electronics...
  • Page 167 Schematic Diagrams 12. Schematic Diagrams 12-1 RF, AV(SCART) Input & Video Switching TP01 TP01 TP02 TP02 Samsung Electronics 12-1...
  • Page 168 Schematic Diagrams 12-2 Sound Swithcing & Dolby-Prologic processor, Main L-R Amp TP03 TP07 TP08 TP04 TP03 TP04 TP05 TP06 TP07 TP05 TP06 TP08 12-2 Samsung Electronics...
  • Page 169 Schematic Diagrams 12-3 Mega TTX IC TP09 TP09 TP10 TP10 TP11 TP14 TP11 TP12 TP13 TP12 TP13 TP15 TP14 TP15 Samsung Electronics 12-3...
  • Page 170 Schematic Diagrams 12-4 Y/Pb/Pr Buffer & Switching 12-4 Samsung Electronics...
  • Page 171 Schematic Diagrams 12-5 Main/Sub Video Decoder TP16 TP17 TP18 TP19 TP23 TP22 TP22 TP20 TP17 TP16 TP21 TP23 TP21 TP18 TP19 TP20 Samsung Electronics 12-5...
  • Page 172 Schematic Diagrams 12-6 Deinterlace(Progressive) Converter TP24 TP25 TP26 TP24 TP25 TP26 12-6 Samsung Electronics...
  • Page 173 Schematic Diagrams 12-7 Analog to Digital Converter Samsung Electronics 12-7...
  • Page 174 Schematic Diagrams 12-8 DVI Input Block 12-8 Samsung Electronics...
  • Page 175 Schematic Diagrams 12-9 Main µ µ -Com Block & EEPROM TP33 TP27 TP32 TP33 TP28 TP31 TP29 TP27 TP30 TP31 TP28 TP29 TP32 TP30 Samsung Electronics 12-9...
  • Page 176 Schematic Diagrams / Sub µ µ -Com(For I/O Expowder) & Power Regulator(11page) 12-10 Flash Memory & Clock IC(9page) 12-10 Samsung Electronics...
  • Page 177 Schematic Diagrams 12-11 R/G/B processor & TMDS Transmitter(Display signal out Generator) TP34 TP35 TP36 TP37 TP36 TP35 TP34 TP37 TP39 TP38 TP39 TP40 TP40 TP38 Samsung Electronics 12-11...
  • Page 178 Schematic Diagrams 12-12 Digital Signal Receiver & LVDS Transmitter, I/O expander 12-12 Samsung Electronics...
  • Page 179 Schematic Diagrams 12-13 Analog DOC & Digital-Analog Conver Block(Only for Developer) 12-14 STB key control & IR Receiver Samsung Electronics 12-13...
  • Page 180 Schematic Diagrams 12-15 Sound AMP Module 12-14 Samsung Electronics...
  • Page 181 Schematic Diagrams 12-16 Component(Y/Pb/Pr) Jack Block & Sound, In/Out Block Samsung Electronics 12-15...
  • Page 182 Schematic Diagrams 12-17 Speaker-Out Terminal Block 12-18 Front A/V & Headphone 12-19 Speaker-Out Terminal Block 12-16 Samsung Electronics...

  • Page 183: Troubleshooting

    Replace SMPS Abnormal LED Light-on Replace Logic B d (Power, Sink) Normal X-B d Connect Power Abnormal X-B d Output Replace X-B d Normal Y-B d Connect Power Abnormal Replace Y-B d Y-B d Output Normal Replace Panel Samsung Electronics...
  • Page 184 Replace Upper Scan Buffer B d Upper part no screen Lower part no scree Replace Lower Scan Buffer B d Replace Corresponding 1//14 Screen part Address Buffer B d Abnormal Replace Panel 1/28 no screen 1/7 no screen Replace Panel Samsung Electronics...
  • Page 185 - After separating Y Main and Y buffer board, - Check the Diode between OUTL and OUTH, and make sure that the forward voltage drop is between 0.4 and 0.5V. - Check that the resistance between the two terminals is more than several kW. Samsung Electronics...
  • Page 186 6-3-2 Y Main - After connecting Y main and Y buffer board, check that one of the output waveforms from OUT 1, 2, 3 or 4 is the same as that of the appendix 1 when power is supplied. Samsung Electronics...
  • Page 187 Troubleshooting 6-3-3 X Board - Check that one of the output waveforms from X-OUT 1 or 2 is the same as that of the appendix 2 when power is supplied. X- OUT1 X- OUT1 Samsung Electronics...

  • Page 188: Check Output Voltage

    (4) In case of VA, check that D303 is short (5) In case of VS, check that pin 2 and 3 of Q303 are short (6) In case of Q6S, check that pin 2 and 3 are short (7) Check that BRD101S is short Samsung Electronics...
  • Page 189 Ref. : IC601(De-Interlace IC) Name : TEA6425D Name : FLI2200 Ref. : ICE401(I/O Expender) Ref. : IC651(A/D Converter) Name : PDF8574T Name : AD9888KS Ref. : IC001(RGB Processor) Ref. : IC401(Component S/W) Name : MN82860 Name : CXA2151Q Samsung Electronics...
  • Page 190 IC651(AD9888), IC654(74LVX74), IC653(74LCX374), IC701(SIL151B), IC001(MN82860), ICT051(SIL160) ICS621(QS34XR245Q3), ICS671(QS34XR245Q3) 2.5V-STB 2.5V Regulator 5V-STB IC801(PW166) (LF25C, IQ039) 3.3V-STB 3.3 Regulator IC801(PW166), IC802(24C64), (78RH33, IQ038) IC921(29LV160), IC971(PCF8563) 5V-STB IC803(MAX232), IC805(74LCX14), IC804(7042), ICE051(S3P9428), ICE052(7042) 14V Regulator S-15V To. Sound Module(M201) KA278RA05, IQ037) Samsung Electronics...
  • Page 191 BUFFER CN5404 CN5007 (12P) Speaker LA03 CN503 CN601 (31P) (31P) (4P) (13P) CN5008 CN4004 CN5406 CN5001 (13P) (13P) (12P) CN5405 CN5006 (12P) LOGIC SMPS SCALER CN5504 CN5005 (12P) CN301 (6P) Control CN302 (3P) CN5506 CN5003 (13P) Power S/ W CN5002 LY1 (30P) CN4005 (13P) CN606 (5P)
  • Page 192 F r ont Cont r ol As s ' y VF D As s ' y F r ont A/V As s ' y CN806 CN805 CN101 (7 Pi n) (7 Pi n) (12 Pi n) CNP031 (14 Pi n) SMPS As s 'y Of Mai n A s s ' y O f M edi a St at i on Medi a S t at i on...

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