Procedure Required For Replacement; Unleaded Solder - Sony UP-897MD Service Manual

1-5. Procedure Required for Replacement
When replacing the following parts, perform each required process according to the table below. For the
procedure before and after performing the required process, refer to Section 2-1.
Parts Required process Reference
MA-132 board Firmware Version Upgrade Section 2-6
1C103 (MA-132 board)
KY-572 board Calibration and Electrical Conductivity Check Section 2-2
Switching regulator Head Voltage Adjustment Section 2-4
Thermal head
1-6. Unleaded Solder
Boards requiring use of unleaded solder are printed with a lead free mark (LF) indicating the solder
contains no lead.
(Caution: Some printed circuit boards may not come printed with the lead free mark due to their
particular size.)
[Mp] . LEAD FREE MARK
* Be sure to use the unleaded solder for the printed circuit board printed with the lead free mark.
* The unleaded solder melts at a temperature about 40 °C higher than the ordinary solder, therefore, it is
recommended to use the soldering iron having a temperature regulator.
* The ordinary soldering iron can be used but the iron tip has to be applied to the solder joint for a
slightly longer time. The printed pattern (copper foil) may peel away if the heated tip is applied for too
jong, so be careful.
UP-897MD