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XM-2540/2540S
6 F E ADDITIONAL
INFORMATION
2-2. PRINTED
WIRING
BOARDS - See page 11 for Semiconductor
Lead Layouts.
B-6
A-4
Q562
Q561
B-5
B-4
B-6
=
R216
55
ie
[MAIN BOARD)
|
ees
"4
B-4
Bie AAR
B-4
E-7
;
ous
wee
:
E-5
E-5
E-4
E-4
E-4
E-5
CHASSIS
E-6
E-4
E-5
E-4
E-6
E-4
F-3
F-4
F-2
F-4
B-2
F-4
C-5
F-5
D-5
F-4
C-2
F-4
C-4
E-7
B-3
E-6
D-2
E-5
C-4
E-6
E-2
E-5
E-2
E-6
E-6
B-7
F-6
F-7
F-6
B-2
F-6
F-6
A
o2
eS
a
6-5
D-4
]
C-6
C-5
C
C-5
D-4
B-6
B-2
B-6
C-1
A-6
C-4
B-6
E-1
B-6
E-2
A-6
E-2
A-5
A-2
ae
RG
-7
~4
AY
cs
A
[RemoTe]}
CE
-4
-3
C-5
A-2
C-4
B-2
8-4
B-
@
ene
-4
-2
A-4
C-4
GND
+)
Note:
®
o——:
parts extracted from the compone
side.
e
Hs:
parts mounted
on the conductor
side.
oe
D557
®
: Pattern on the side which is seen.
a
=
(3)
>
.
Se!
(GRN)
POWER /
PROTECTOR
CHASSIS
[W]
647 -703-
CHASSIS
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