Samsung LE40F86BD Service Manual page 215

Level Location No.
.....5 IC520 0903-001485
....4 IC113 1105-001813
....4 D1110 0403-000766
....4 D1111 0403-000766
...3 JA1803_OP 3701-001294
...3 CN330 3711-004349
...3 JA3601_EU 3709-001477
..2 T0268 BN94-01449B
...3 T0245 0202-001492
...3 T0313 3404-000176
...3 CN330 3711-000906
...3 CN330 3711-000906
...3 CN330 3711-003272
...3 CN330 3711-004379
...3 CN330 3711-004484
...3 CN330 3711-005607
...3 CN330 3711-005607
...3 CN330 3711-005841
...3 CN330 3711-005841
...3 T0174 BN97-01753B
....4 SUB05 0202-001477
....4 D502 0402-001098
....4 D503 0402-001098
....4 D504 0402-001098
....4 D505 0403-000746
....4 Q409 0505-000110
....4 Q409 0505-002169
....4 IC104 0801-002171
....4 IC104 0801-002393
....4 IC104 0801-002393
....4 IC104 0801-002393
....4 IC104 0801-002393
....4 IC104 0801-002393
....4 IC304 1203-001559
....4 T0087 1203-002898
....4 T0170 1203-003059
....4 T0170 1203-003059
....4 T0170 1203-003059
....4 IC100 1301-001800
....4 R110 2007-000040
....4 R110 2007-000040
....4 R110 2007-000040
....4 R110 2007-000040
....4 R110 2007-000040
....4 R110 2007-000040
....4 R110 2007-000040
....4 R110 2007-000040
....4 R110 2007-000040
....4 R110 2007-000040
....4 R110 2007-000040
....4 R110 2007-000040
Code No.
IC-MICROCONTROLLER;44P,12x12mm,24MHz,TR,
IC-DRAM;K4D263238K-VC40,DDR,128Mbit,4x1M
DIODE-ZENER;VLZ3V3A,3.16-3.38V,500mW,SOD
DIODE-ZENER;VLZ3V3A,3.16-3.38V,500mW,SOD
CONNECTOR-DSUB;15P,3R,FEMALE,STRAIGHT,AU
HEADER-BOARD TO CABLE;BOX,3P,1R,2mm,STRA
CONNECTOR-CARD SLOT;68P,1.27mm,ANGLE,AU,
ASSY PCB MISC-DIMMING;LE70F96BDX/*
SOLDER-WIRE FLUX;HSE-02 LFM48 SR-34 S,-,
SWITCH-TACT;12V,50mA,120gf,6x6mm,DPST
HEADER-BOARD TO CABLE;BOX,3P,1R,2MM,ANGL
HEADER-BOARD TO CABLE;BOX,3P,1R,2MM,ANGL
HEADER-BOARD TO CABLE;BOX,10P,2R,2.54mm,
HEADER-BOARD TO CABLE;BOX,4P,1R,2mm,STRA
HEADER-BOARD TO CABLE;BOX,5P,1R,2mm,STRA
HEADER-BOARD TO CABLE;BOX,32P,2R,2mm,STR
HEADER-BOARD TO CABLE;BOX,32P,2R,2mm,STR
HEADER-BOARD TO CABLE;BOX,20P,2R,2MM,STR
HEADER-BOARD TO CABLE;BOX,20P,2R,2MM,STR
SOLDER-CREAM;LST309-M,-,D20~45##,96.5Sn/
DIODE-RECTIFIER;SK34,40V,3A,SMC,TP
DIODE-RECTIFIER;SK34,40V,3A,SMC,TP
DIODE-RECTIFIER;SK34,40V,3A,SMC,TP
DIODE-ZENER;RLZ3.9B,3.89-4.16V,500mW,LL-
FET-SILICON;2N7002,N,60V,115mA,7.5ohm,0.
FET-SILICON;Si4435BDY-T1-E3,P,-30V,-9.1A
IC-CMOS LOGIC;74LCX125,BUS BUFFER,SOP,14
IC-CMOS LOGIC;74VHC244,BUS BUFFER,TSSOP,
IC-CMOS LOGIC;74VHC244,BUS BUFFER,TSSOP,
IC-CMOS LOGIC;74VHC244,BUS BUFFER,TSSOP,
IC-CMOS LOGIC;74VHC244,BUS BUFFER,TSSOP,
IC-CMOS LOGIC;74VHC244,BUS BUFFER,TSSOP,
IC-RESET;DS1834A,SOIC,8P,150MIL,PLASTIC,
IC-POSI.FIXED REG.;G950T45R,T0-252,3P,6.
IC-SWITCH VOL. REG.;MP1583,SOIC,8P,4.9x3
IC-SWITCH VOL. REG.;MP1583,SOIC,8P,4.9x3
IC-SWITCH VOL. REG.;MP1583,SOIC,8P,4.9x3
IC-FPGA;EP2C50,BGA,484P,17x17mm,3.3V,30%
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
Description & Specifi cation
ASSY SMD;LE70F96BDX/*
5. Exploded View & Part List
Q'ty SA/SNA Remark
1 S.N.A
1 S.A
1 S.N.A
1 S.N.A
1 S.A
1 S.A
1 S.A
1 S.A
0.003 S.N.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.N.A
1.309 S.N.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.N.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
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