Samsung LE40F86BD Service Manual page 170

5. Exploded View & Part List
Level Location No.
...3 CN330
...3 CN330
...3 CN330
...3 CN330
...3 CN330
...3 CN330
...3 CN330
...3 CN330
...3 CN330
...3 T0174
....4 SUB05
....4 D502
....4 D503
....4 D504
....4 D505
....4 D500
....4 D501
....4 Q409
....4 Q409
....4 IC104
....4 IC104
....4 IC104
....4 IC104
....4 IC104
....4 IC104
....4 IC112
....4 IC304
....4 T0087
....4 T0170
....4 T0170
....4 T0170
....4 IC100
....4 R455
....4 R456
....4 R459
....4 R465
....4 R466
....4 R467
....4 R468
....4 R471
....4 R472
....4 R473
....4 R474
....4 R477
....4 R478
....4 R479
....4 R480
....4 R483
....4 R484
....4 R485
....4 R486
5-146
Code No.
3711-000906 HEADER-BOARD TO CABLE;BOX,3P,1R,2MM,ANGL
3711-000906 HEADER-BOARD TO CABLE;BOX,3P,1R,2MM,ANGL
3711-003272 HEADER-BOARD TO CABLE;BOX,10P,2R,2.54mm,
3711-004379 HEADER-BOARD TO CABLE;BOX,4P,1R,2mm,STRA
3711-004484 HEADER-BOARD TO CABLE;BOX,5P,1R,2mm,STRA
3711-005607 HEADER-BOARD TO CABLE;BOX,32P,2R,2mm,STR
3711-005607 HEADER-BOARD TO CABLE;BOX,32P,2R,2mm,STR
3711-005841 HEADER-BOARD TO CABLE;BOX,20P,2R,2MM,STR
3711-005841 HEADER-BOARD TO CABLE;BOX,20P,2R,2MM,STR
BN97-01753A
0202-001477 SOLDER-CREAM;LST309-M,-,D20~45##,96.5Sn/
0402-001098 DIODE-RECTIFIER;SK34,40V,3A,SMC,TP
0402-001098 DIODE-RECTIFIER;SK34,40V,3A,SMC,TP
0402-001098 DIODE-RECTIFIER;SK34,40V,3A,SMC,TP
0403-000746 DIODE-ZENER;RLZ3.9B,3.89-4.16V,500mW,LL-
0403-001284 DIODE-ZENER;RLZ3.3A,3.16-3.38V,500mW,LL-
0403-001284 DIODE-ZENER;RLZ3.3A,3.16-3.38V,500mW,LL-
0505-000110 FET-SILICON;2N7002,N,60V,115mA,7.5ohm,0.
0505-002169 FET-SILICON;Si4435BDY-T1-E3,P,-30V,-9.1A
0801-002171 IC-CMOS LOGIC;74LCX125,BUS BUFFER,SOP,14
0801-002393 IC-CMOS LOGIC;74VHC244,BUS BUFFER,TSSOP,
0801-002393 IC-CMOS LOGIC;74VHC244,BUS BUFFER,TSSOP,
0801-002393 IC-CMOS LOGIC;74VHC244,BUS BUFFER,TSSOP,
0801-002393 IC-CMOS LOGIC;74VHC244,BUS BUFFER,TSSOP,
0801-002393 IC-CMOS LOGIC;74VHC244,BUS BUFFER,TSSOP,
1103-001385 IC-EEPROM;24C256,256Kbit,32Kx8,SOP,8P,5x
1203-001559 IC-RESET;DS1834A,SOIC,8P,150MIL,PLASTIC,
1203-002898 IC-POSI.FIXED REG.;G950T45R,T0-252,3P,6.
1203-003059 IC-SWITCH VOL. REG.;MP1583,SOIC,8P,4.9x3
1203-003059 IC-SWITCH VOL. REG.;MP1583,SOIC,8P,4.9x3
1203-003059 IC-SWITCH VOL. REG.;MP1583,SOIC,8P,4.9x3
1301-001800 IC-FPGA;EP2C50,BGA,484P,17x17mm,3.3V,30%
2007-000040
2007-000040
2007-000040
2007-000040
2007-000040
2007-000040
2007-000040
2007-000040
2007-000040
2007-000040
2007-000040
2007-000040
2007-000040
2007-000040
2007-000040
2007-000040
2007-000040
2007-000040
2007-000040
Description & Specifi cation
ASSY SMD;LE52F96BDX/*
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;150ohm,1%,1/10W,TP,1608
Q'ty SA/SNA Remark
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.N.A
1.309 S.N.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.N.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A