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Table A
Char.
-55℃
Max.
1C
0.54
2C
0.82
3C
1.37
4C
2.56
5C
0.58
6C
0.87
Substrate Bending test
・Test substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness :0.8mm
: Solder resist
(Coat with heat resistant resin for solder)
for GJM02
Copper foil thickness : 0.018mm
・Test substrate
Kind of Solder : Sn-3.0Ag-0.5Cu
・Test substrate
Pressurization method
Support
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・Test substrate
Kind of Solder : Sn-3.0Ag-0.5Cu
・Test substrate
Land Dimensions
b
JEMCGS-0004M
Capacitance Change from Value at Reference temp. (%)
-30
Min.
Max.
Min.
-0.23
-
-
-0.45
-
-
-0.90
-
-
-1.88
-
-
-0.24
0.40
-0.17
-0.48
0.59
-0.33
Fig.1
Pressurization
50
min.
speed
20
1.0mm/s
Pressurize
R5
Flexure
Capacitance meter
45
45
Fig.2
Chip Capacitor
Land
a
Solder Resist
Fig.3
-25℃
-10℃
Max.
Min.
Max.
0.33
-0.14
0.22
0.49
-0.27
0.33
0.82
-0.54
0.55
1.54
-1.13
1.02
-
-
0.25
-
-
0.38
for GJM03/15
b
Land
f4.5
a
100
Copper foil thickness : 0.035mm
(in mm)
Dimension (mm)
Type
a
b
GJM02
0.2
0.56
GJM03
0.3
0.9
GJM15
0.4
1.5
4
Min.
-0.09
-0.18
-0.36
-0.75
-0.11
-0.21
Type
GJM02
GJM03
GJM15
(in mm)
c
0.23
0.3
0.5
*1,2：2.0±0.05
+0.1
φ1.5
-0
Dimension (mm)
a
b
c
0.2
0.56
0.23
Ａ
0.3
0.9
0.3
0.4
1.5
0.5
4.0±0.1
＊2
＊1
0.05以下
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