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No
Item
13 Resistance to
Appearance
Soldering Heat
Capacitance
Change
Q
I.R.
Voltage proof No defects.
14 Temperature
Appearance
Sudden Change
Capacitance
Change
Q
I.R.
Voltage proof No defects.
15 High
Appearance
Temperature
Capacitance
High Humidity
Change
(Steady)
Q
I.R.
16 Durability
Appearance
Capacitance
Change
Q
I.R.
17 ESR
(GJM02)
ESR
(GJM03/GJM15)
JEMCGS-0004M
Specification
No defects or abnormalities.
Within +/-2.5% or +/- 0.25pF
(Whichever is larger)
Within the specified initial value.
Within the specified initial value.
No defects or abnormalities.
Within +/-2.5% or +/- 0.25pF
(Whichever is larger)
Within the specified initial value.
Within the specified initial value.
No defects or abnormalities.
Within +/-7.5% or +/-0.75pF
(Whichever is larger)
30pF and over
: Q≧200
30pF and below : Q≧100+10C/3
C:Nominal Capacitance(pF)
More than 500MΩ or 25Ω·F (Whichever is smaller)
No defects or abnormalities.
Within +/-3% or +/-0.3pF
(Whichever is larger)
30pF and over : Q≧350
10pF and over , 30pF and below : Q≧275+5C/2
10pF and below : Q≧200+10C
C:Nominal Capacitance (pF)
More than 1,000MΩ or 50Ω·F (Whichever is smaller)
0.2pF ≦ C ≦ 1pF : 700mΩ/C below
1pF < C ≦ 2pF : 600mΩ below
2pF < C ≦ 5pF : 500mΩ below
5pF < C ≦ 10pF : 300mΩ below
10pF < C ≦ 22pF : 350mΩ below
C:Nominal Capacitance (pF)
0.1pF ≦ C ≦ 1pF : 350mΩ/C below
< C ≦ 5pF : 300mΩ below
1pF
< C ≦10pF : 250mΩ below
5pF
C:Nominal Capacitance (pF)
10pF < C ≦ 47pF : 400mΩ below
<GJM02 size only>
Test Method
Solder
Solder Temp.
Reflow Time
Test Substrate
Exposure Time
Preheat
<GJM03/GJM15 size>
Test Method
Solder
Solder Temp.
Immersion time
Exposure Time
Preheat
Solder the capacitor on the test substrate shown in Fig.3.
Perform the five cycles according to the four heat treatments
shown in the following table.
Step
1
Min.Operating Temp.+0/-3
2
3
Max.Operating Temp.+3/-0
4
Exposure Time
Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature
Test Humidity
Test Time
Applied Voltage
Charge/discharge current : 50mA max.
Exposure Time
Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature
Test Time
Applied Voltage
Charge/discharge current : 50mA max.
Exposure Time
Measurement Frequency : 1.0+/-0.1GHz
Measurement Temperature : Room Temp.
Measurement Instrument
Measurement Frequency : 1.0+/-0.2GHz
Measurement Temperature : Room Temp.
Measurement Instrument
Measurement Frequency : 500+/-50MHz
Measurement Temperature : Room Temp.
Measurement Instrument
3
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
: Reflow soldering (hot plate)
: Sn-3.0Ag-0.5Cu
: 270+/-5℃
: 10+/-0.5s
: Glass epoxy PCB
: 24+/-2h
: 120℃ to 150℃ for 1 min
: Solder bath method
: Sn-3.0Ag-0.5Cu
: 270+/-5℃
: 10+/-0.5s
: 24+/-2h
: 120℃ to 150℃ for 1 min
Temp.(C)
Time (min)
30+/-3
Room Temp.
2 to 3
30+/-3
Room Temp
2 to 3
: 24+/-2h
: 40+/-2℃
: 90%RH to 95%RH
: 500+/-12h
: DC Rated Voltage
: 24+/-2h
: Max. Operating Temp. +/-3℃
: 1000+/-12h
: 200% of the rated voltage
: 24+/-2h
: Equivalent to E4991A
: Equivalent to BOONTON Model 34A
: Equivalent to HP8753B
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