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Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Screw driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Unscrew the screws on mounting angle 1, and then remove mounting angle 1.
2.
Unscrew the screws on cover 3, and then remove cover 3.
3.
Unplug all of the inner cable connectors, and then remove AC cable 5 and LED cable 6 from the chassis. .
4.
Unscrew the screws on power module 4, and then remove 4 from the prt 2.
5.
Unscrew the screws on MAIN PCB 7, and then remove 7 from the prt 2.
6.
Unscrew the screws on the fan 8, and then remove 8.
7.
Unscrew the screws on LED PCB 9, and then remove 9 from the prt 2.
8.
Unscrew the screws on daughter PCB 11, and then remove 11 from MAIN PCB 7.
9. Remove front film 10 from the prt 2.
10. Remove all the labels from the chassis.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
0
0
Tool Size (if
applicable)
2＃
Page 2
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