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RF1 FRONT PANEL PCB Rev A
RevChange Document
Suggested
DATE
Performed by:
SCH PCB CAM
by:
2/27/2006
2/27/2006
2/27/2006
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6/27/2006
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6/27/2006
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6/27/2006
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6/27/2006
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6/27/2006
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6/27/2006
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6/27/2006
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3/1/2006
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3/1/2006
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3/8/2006
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5/2/2006
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5/6/2006
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5/23/2006
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6/2/2006
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6/27/2006
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6/27/2006
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7/11/2006
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7/11/2006
Last Revised:
7/11/2006
DATE
Description of change:
TOP LEVEL CHANGES
JK
7/11/2006
Change all text from Rev 2 to A
JK
7/11/2006
Update all Part Types
Review/Integrate all outstanding ECNs
Note: ***A new solderpaste stencil IS required***
Change +48V bypass caps from one 47uF,50V cap to two
JK
6/27/2006
47uF,50V caps in series to increase WV.
JK
6/27/2006
Change LEDS from Kingbright to Strongbase.
JK
6/27/2006
Remove end terminations.
JK
6/27/2006
Change column transistors from 2SC5592 to 2SD2114K.
SCHEMATIC CHANGES
Increase termination resistors for all three clock branches
JK
6/27/2006
from 75 Ohms to 100 Ohms.
Change LED holder part type to ECO-registered part so that it
JK
7/11/2006
shows up in the BOM and update part number.
For any header that will actual be installed with a staked
cable, change the part number attribute to the staked cable's
JK
6/27/2006
part number.
See if mounting pin holes for gain pots can be increased to
JK
7/11/2006
63mil.
Uncheck "plane thermal" on SMD pads that cannot make
thermal connection to the top side ground plane. All thru-hole
pads that also cannot make a thermal connection to the top
JK
7/11/2006
side ground plane should have a copper cutout around it.
JK
7/11/2006
Add revision information to the bottom layer copper.
Add ref des for bottom mounted headers on the top layer
JK
7/11/2006
silkscreen.
Add note on silkscreen to saying that the bottom mounted
JK
7/11/2006
headers need to be mounted on the bottom.
JK
7/11/2006
Move Q9 away from holder.
Move headphone cable header to top side and change
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7/11/2006
silkscreen/footprint to match the other 6-pin staked headers.
Reduce pad sizes of 2mm headers or change to round from
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7/11/2006
oval shape.
Remove soldermask clearance used for pot/encoder
JK
7/11/2006
mounting pin grounding experiments.
JK
7/11/2006
Change soldermask color to green on drilldrawing notes.
Add 3-digit text on all layers indicating the ECO and personal
JK
7/11/2006
iteration level of the PCB file.
Standard procedure
Standard procedure
Standard procedure
SMD components were added.
50V WV is too close to 48V phantom voltage.
Better availability overseas.
not required
Better availability overseas. Although 2SD2114K has
inferior VceSAT, difference is barely noticeable.
Reduce EMI.
Facilitate BOM creation.
Facilitate BOM creation.
PCB CHANGES
Consolidate drill holes.
Eliminate plane connection errors.
Allow for board rev identification without having to
remove PCB from chassis.
Staked header is small enough to fit on the top side,
plus the silkscreen denoting pin one will also be
present on the top side.
The adjacent rows are very prone to shorting.
no longer needed
Green is for production PCBs.
Reason for change:
Not done -- current fit is just about right.
Increasing the hole size may make the
pots fit too loosely.
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