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MAIN CIRCUIT BOARD
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
<01>MAIN
LYB10071-001B
CN104
L131
Q131
6
IC121
12
13
C121
R4037
3
L4005
R4036
1
IC4003
C4004
C4018
1
C4015
4
C4014
L4003
C4002
24
C4022
C4001
D4002
C4010
C4024
D4003
C141
L141
R147
R4007
C4016
10
8
7
6
5
4
3
CN111
11
12
13
FOIL SIDE(B)
C4029
1
5
L4301
C4007
TL111
C4006
R145
R148
2
1
9
C161
R163
R162
R164
R170
Q162
L111
R3222
C7801
R7817
R3216
R7814
C7805
R7812
R3214
C3215
R7809
14
C7804
R7807
R3215
R7804
C3209
R7801
R3213
R7802
C3210
R3212
C7803
(No.YF137)2-41
2-42(No.YF137)
L3001
L3002
C3002
C3001
R3033
IC4301
TL3001
R3045
R3042
C4302
R3014
R3041
C3017
C3018
R3039
C3009
C3024
TL3003
C3022
C3006
C3014
C3004
C3021
TL3004
C3023
TL3002
L3006
C3019
C3003
L3007
11
10
R423
Q422
R422
R421
R3202
IC3202
RA3201 RA3202
1
20
C3219
R3208
R3209
R3223
D421
R3207
R3205
L3203
R3224
R3206
IC3201
C3224
C3202
R3203
C3220
C3201
L3201
R3201
C3225
C3216 C3217 C3218
C3230
C171
C3015
R3034
R3036
Q171
R3035
C3008
C3012
C3007
R172
R171
IC171
C3013
C172
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