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HP Workstation Z210 SFF Specification page 18

Sff workstation
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QuickSpecs
System Technical Specifications
System Configuration
System Configuration
System Configuration
System Configuration
(High-end)
(High-end)
(High-end)
(High-end)
Declared Noise Emissions
Declared Noise Emissions
Declared Noise Emissions
Declared Noise Emissions
(in accordance with ISO
7779 and ISO 9296)
Environmental
Environmental
Environmental
Environmental
Requirements
Requirements
Requirements
Requirements
Physical Security and Serviceability
Physical Security and Serviceability
Physical Security and Serviceability
Physical Security and Serviceability
Access Panel
Access Panel
Access Panel
Access Panel
Expansion Cards
Expansion Cards
Expansion Cards
Expansion Cards
Processor Socket
Processor Socket
Processor Socket
Processor Socket
Green User Touch Points Yes, on tool-free internal chassis mechanisms
Green User Touch Points
Green User Touch Points
Green User Touch Points
Color-coordinated Cables
Color-coordinated Cables
Color-coordinated Cables
Color-coordinated Cables
and Connectors
and Connectors
and Connectors
and Connectors
Memory
Memory
Memory
Memory
System Board
System Board
System Board
System Board
Processor Info
Processor Info
Processor Info
Processor Info
Memory Info
Memory Info
Memory Info
Memory Info
Graphics Info
Graphics Info
Graphics Info
Graphics Info
Disks/Optical/Floppy
Disks/Optical/Floppy
Disks/Optical/Floppy
Disks/Optical/Floppy
Idle
Idle
Idle
Idle
Hard drive Operating
Hard drive Operating
Hard drive Operating
Hard drive Operating
(random reads)
DVD-ROM Operating
DVD-ROM Operating
DVD-ROM Operating
DVD-ROM Operating
(sequential reads)
Temperature
Temperature
Temperature
Temperature
Humidity
Humidity
Humidity
Humidity
Maximum Altitude
Maximum Altitude
Maximum Altitude
Maximum Altitude
Dynamic
Dynamic
Dynamic (new)
Dynamic
Cooling
Cooling
Cooling
Cooling
Tool-less
Includes system board and memory information
Tool-less
Tool-less, except for the processor heatsink.
Yes
Tool-less
Screw-In
DA - 13873
North America — Version 7 — July 1, 2011
Intel Xeon E3-1280 3.5 GHz
4 x 4GB DDR3 1333 MHz
NVIDIA Quadro 600
2 x 300GB 10K rpm SATA/ DVD-ROM
Sound Power
Sound Power
Sound Power
Sound Power (LWAd, bels)
3.6 Bels
4.0 Bels
5.0 Bels
Operating: 40° to 95° F (5° to 35° C)
Non-operating: -40° to 140° F (-40° to 60° C)
Operating: 8% to 85% RH, non-condensing
Non-operating: 8% to 90% RH, non-condensing
Operating: 10,000 feet (3,000 m)
Non-operating: 30,000 feet (9,100 m)
Shock
Operating: ½-sine: 40g, 2-3ms
Non-operating:
½-sine: 160 cm/s, 2-3ms (~100g)
square: 422 cm/s, 20g
Vibration
Operating random: 0.5g (rms), 5-300 Hz
Non-operating random: 2.0g (rms), 10-500 Hz
NOTE:
NOTE:
NOTE: Values represent individual shock events and do not indicate
NOTE:
repetitive shock events.Values do not indicate continuous vibration.
Above 5,000 ft (1524 m) altitude, maximum operating temperature is de-
rated by 1.8° F (1° C) per 1,000 ft (305 m) elevation increase
HP Z210 SFF Workstation
HP Z210 SFF Workstation
HP Z210 SFF Workstation
HP Z210 SFF Workstation
Desktop operator Sound Pressure
Desktop operator Sound Pressure
Desktop operator Sound Pressure
Desktop operator Sound Pressure
(LpAm, decibels)
27 dB
30 dB
40 db
Page 18

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