Sony HCD-M40D Service Manual page 7

NOTE OF REPLACING THE IC3501 (M80D), IC3502,
IC3503 (M60D, M80D) AND IC2002 ON THE MOTH-
ERBOARD BOARD AND THE COMPLETE MOTHER-
BOARD BOARD
When IC3501 (M80D), IC3502, IC3503 (M60D, M80D) and
IC2002 on the MOTHERBOARD board and the complete MOTH-
ERBOARD board are replaced, it is necessary to spread the com-
pound between parts and heat sink. After that, execute "IC and
MOTHERBOARD Board after replace checking guide" in page
31.
Part No. Description
7-300-009-67 THERMAL COMPOUND (TIG2000)
Spread the compound referring to the fi gure below.
– MOTHERBOARD Board (M80D) (Component Side) –
thermal compound (TIG2000)
IC3501 IC3502 IC3503
– MOTHERBOARD Board (M60D) (Component Side) –
thermal compound (TIG2000)
IC3502 IC3503 IC2002
IC2002
HCD-M40D/M60D/M80D
– MOTHERBOARD Board (M40D) (Component Side) –
thermal compound (TIG2000)
IC2002
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