LG -D325 Service Manual page 299

Level Location No.
6 ZD6604 Diode,TVS
Capacitor
6 C2362
Ceramic,Chip
6 ZD7000 Varistor
Connector
6 CN70001
Terminal Block
6 J10000 Card Socket
6 SW2 Connector,RF
6 CN10000 Socket,Card
PCB Assembly
5 EBR071700
Main,SMT Top
Capacitor
6 C2052
Ceramic,Chip
6 EAX010000 PCB,Main
C1008 Inductor
6
L2005 Multilayer,Chip
C13
Capacitor
6 C14
Ceramic,Chip
C30
C12000
Capacitor
6 C12001
Ceramic,Chip
C12005
6 R2111 Resistor,Chip
Inductor
6 C1001
Multilayer,Chip
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Description PartNumber
EDTY0012501
EAE62726601
SEVY0005402
EAG63530401
EAG63211701
ENWY0005501
EAG62830201
EBR78766401
ECCH0009504
EAX65604301
EAP62226601
ECCH0009103
EAE62962301
ERHY0009554
ELCH0003826
Spec
UCLAMP3311T.TCT 3.3V 3.5V min. 6.5V 5A -
SLP1006P2T R/TP 2P 1 SEMTECH
CORPORATION
CL03A225MQ3CRNC 2.2uF -20TO20% 6.3V X5R -
55TO+85C 0603 R/TP 0.3T - SAMSUNG
ELECTRO-MECHANICS CO., LTD.
ICVS0505500FR 5.6V 0% 50F 1.0*0.5*0.55 - SMD
R/TP INNOCHIPS TECHNOLOGY
KQ03L3-4R 4P 2.50MM STRAIGHT DIP T/REEL -
HIROSE KOREA CO.,LTD
5000-12P-2.95D-A1-R0 SIM 12P STRAIGHT SMD
T/REEL - HYUPJIN I&C CO.,LTD.
20279-001E-01 NONE STRAIGHT SOCKET SMD
R/TP AU 50OHM 400mDB I-PEX CO., LTD
104031-0811 SD 8P ANGLE SMD R/TP
11.95x11.40x1.42t, Push-pull type MOLEX
LGD325.ACISWH 1.0 Main
MCH032A180JK 18pF 5% 25V NP0 -55TO+125C
0603 R/TP - ROHM.
LGD325.ACISWH 1.1 FR-4 - 10 0.8 Main
LQP03TG15NJ02D 15NH 5% - 170mA - - 1.9OHM
3.1GHZ 11 SHIELD - 0.6X0.3X0.3MM R/TP
MURATA MANUFACTURING CO.,LTD.
C0603C0G1H101JT00NN 100pF 5% 50V C0G -
55TO+125C 0603 R/TP - - TDK CORPORATION
GRM155R61A225KE95 2.2uF -10TO+10% 10V
X5R -55TO+85C 1005 R/TP 0.5 L:1.0+-0.05
W:0.5+-0.05 T:0.5+-0.05 MURATA
MANUFACTURING CO.,LTD.
MCR006YZPF2002 20KOHM 1% 1/20W 0603 R/TP
- ROHM.
LQG15HS3N3S02D 3.3NH 0.3NH - 300mA - -
0.17OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
R/TP MURATA MANUFACTURING CO.,LTD.
- 299 - Copyright © 2014 LG Electronics. Inc. All right reserved.
Remark
Only for training and service purposes