Hardware Specifications and Configurations
Processor
Item
CPU type
CPU package
Features
CPU core voltage
North Bridge
Item
Type
Package
Features
CPU core voltage
South Bridge
Item
Type
Package
18
Intel® Penryn (dual core)
Intel® 479 pin Micro-FCPGA
Supports Intel architecture with Dynamic execution.
On-die, primary 32-kB instruction cache and 32-kB write-back data
cache.
On-die, up to 6MB second level shared cache with advanced
transfer cache architecture.
Streaming SIMD Extensions 2 (SSE2),Streaming SIMD Extensions
3 (SSE3) Supplemental streaming SIMD extensions 3 (SSSE3)
and SSE4.1 instruction sets.
1066MHz source-synchronous front side bus (FSB)
Advanced power management features including Enhanced Intel
SpeedStep® Technology and dynamic FSB frequency switching.
Digital thermal sensor (DTS).
Execute disable bit support for enhanced security.
Intel® Dynamic Acceleration Technology and Enhanced Multi
Threaded Thermal Management (EmTTM).
Support enhanced Intel Virtualization Technology.
VCC-CORE: Voltage for the future processor will depend on VID0-
6 for battery mode and setting via software for adapter mode for
the future processor
Intel Crestline PM965 (North Bridge)
FCBGA 1329 balls
Processor host bus supports, 667/800/1066MHz FSB support.
Supports Dual Channel DDR2 SDRAM at 667/800 MHz.
Supports Dual Channel DDR3 SDRAM at 800/1066 MHz.
Integrated SDRAM controller up to 8GB (2 SODIMM support)
External Graphics interface for PCI Express Architecture support
DMI x2 and DMI x 4 for connection between GMCH and ICH9M
Supports ACPI 3.0
1.05V core, 1.5V,VCCSM(DDR2 = 1.8V/DDR3=1.5V),2.5V,3.3V
ICH9M (South Bridge)
BGA 676 balls
Specification
Specification
Specification
Chapter 1