ASROCK H170M-ITX/DL User Manual page 49

Super alloy motherboard
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Write Recovery Time (tWR)
he amount of delay that must elapse ater the completion of a valid write operation,
before an active bank can be precharged.
Refresh Cycle Time (tRFC)
he number of clocks from a Refresh command until the irst Activate command to
the same rank.
RAS to RAS Delay (tRRD_L)
he number of clocks between two rows activated in diferent banks of the same
rank.
RAS to RAS Delay (tRRD_S)
he number of clocks between two rows activated in diferent banks of the same
rank.
Write to Read Delay (tWTR_L)
he number of clocks between the last valid write operation and the next read command to
the same internal bank.
Write to Read Delay (tWTR_S)
he number of clocks between the last valid write operation and the next read command to
the same internal bank.
Read to Precharge (tRTP)
he number of clocks that are inserted between a read command to a row pre-
charge command to the same rank.
Four Activate Window (tFAW)
he time window in which four activates are allowed the same rank.
CAS Write Latency (tCWL)
Conigure CAS Write Latency.
Third Timing
tREFI
Conigure refresh cycles at an average periodic interval.
tCKE
Conigure the period of time the DDR4 initiates a minimum of one refresh
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