User's Notice; Manual Revision Information; Cooling Solutions - Intel P55 User Manual

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Manual Revision Information

Reversion Revision History
1.0 First Edition
Item Checklist
Intel P55 Express chipset based Motherboard
User's Manual
DVD for motherboard utilities
Cable package
I/O Back Panel Shield
Intel Core Processor Family

Cooling Solutions

As processor technology pushes to faster speeds and higher performance, thermal
management becomes increasingly crucial while building computer systems. Maintaining the
proper thermal environment is the key to reliable, long-term system operation. The overall
goal in providing the proper thermal environment is keeping the processor below its specified
maximum case temperature. Heat sinks induce improved processor heat dissipation through
increased surface area and concentrated airflow from attached fans. In addition, interface
materials allow effective transfers of heat from the processor to the heat sink. For optimum
heat transfer, Intel recommends the use of thermal grease and mounting clips to attach the
heat sink to the processor.
When selecting a thermal solution for your system, please refer to the website below for
collection of heat sinks evaluated and recommended by Intel for use with Intel processors.
Note, those heat sinks are recommended for maintaining the specified Maximum T case
requirement. In addition, this collection is not intended to be a comprehensive listing of all
heat sinks that support Intel processors.
Date
Aug., 2009
iv
NO PART OF THIS
BUT IT WILL CHANGE,