Electrical Parts List - Sony MEX-GS810BH Service Manual

MEX-GS810BH/N6000BH
KEY MAIN
Note:
• Due to standardization, replacements in
the parts list may be different from the
parts specifi ed in the diagrams or the com-
ponents used on the set.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• Items marked "*" are not stocked since
they are seldom required for routine ser-
vice. Some delay should be anticipated
when ordering these items.
• RESISTORS
All resistors are in ohms.
METAL: Metal-fi lm resistor.
METAL OXIDE: Metal oxide-fi lm resistor.
F: nonfl ammable
Ref. No. Part No. Description
KEY BOARD
**********
When the KEY board is defective, replace the FRONT PANEL (SV) (ASSY) (Ref.
No. FP1).
*************************************************************
A-2045-586-A MAIN BOARD, COMPLETE (N6000BH) (See Note)
A-2045-587-A MAIN BOARD, COMPLETE (GS810BH) (See Note)
********************
7-685-134-19 SCREW +P 2.6X8 TYPE2 NON-SLIT
7-685-794-01 SCREW +PTT 2.6X10 (S)
< CAPACITOR >
* C03 1-116-738-11 CERAMIC CHIP 1uF
C05 1-118-386-11 CERAMIC CHIP 0.1uF
C09 1-116-707-11 CERAMIC CHIP 47uF
* C010 1-116-735-11 CERAMIC CHIP 1uF
C013 1-125-891-11 CERAMIC CHIP 0.47uF
C016 1-118-386-11 CERAMIC CHIP 0.1uF
C017 1-118-386-11 CERAMIC CHIP 0.1uF
C018 1-116-724-11 CERAMIC CHIP 4.7uF
C019 1-116-722-11 CERAMIC CHIP 4.7uF
C020 1-118-480-11 CERAMIC CHIP 4.7uF
C021 1-165-908-11 CERAMIC CHIP 1uF
C022 1-164-874-11 CERAMIC CHIP 100PF
C023 1-164-874-11 CERAMIC CHIP 100PF
C102 1-116-733-11 CERAMIC CHIP 1uF
* C103 1-116-738-11 CERAMIC CHIP 1uF
C104 1-118-290-11 CERAMIC CHIP 0.001uF
C105 1-118-477-11 CERAMIC CHIP 2.2uF
C106 1-118-290-11 CERAMIC CHIP 0.001uF
* C107 1-116-738-11 CERAMIC CHIP 1uF
C109 1-118-347-11 CERAMIC CHIP 0.1uF
C301 1-164-866-11 CERAMIC CHIP 47PF
C302 1-164-866-11 CERAMIC CHIP 47PF
C303 1-112-839-11 ELECT
C304 1-164-866-11 CERAMIC CHIP 47PF
C305 1-164-866-11 CERAMIC CHIP 47PF
C306 1-118-361-11 CERAMIC CHIP 0.1uF
* C307 1-116-735-11 CERAMIC CHIP 1uF
C308 1-164-866-11 CERAMIC CHIP 47PF
C309 1-164-866-11 CERAMIC CHIP 47PF
C310 1-118-347-11 CERAMIC CHIP 0.1uF
C311 1-164-866-11 CERAMIC CHIP 47PF
C312 1-118-347-11 CERAMIC CHIP 0.1uF
Note: When the complete MAIN board is replaced, it is necessary to replace knob (VOL) (SV) assy simultaneously.
46
SECTION 7

ELECTRICAL PARTS LIST

• CAPACITORS
uF: μF
• COILS
uH: μH
• SEMICONDUCTORS
In each case, u: μ, for example:
: μA. . , uPA. . , μPA. . ,
uA. .
uPB. . : μPB. . , uPC. . , μPC. . ,
uPD. . : μPD. .
Remark
10% 6.3V
10% 16V
20% 10V
10% 16V
10% 10V
10% 16V
10% 16V
20% 6.3V
10% 16V
10% 6.3V
10% 10V
5% 50V
5% 50V
10% 25V
10% 6.3V
10% 50V
10% 6.3V
10% 50V
10% 6.3V
10% 25V
5% 50V
5% 50V
4700uF 20% 16V
5% 50V
5% 50V
10% 50V
10% 16V
5% 50V
5% 50V
10% 25V
5% 50V
10% 25V
Also, the destination setting, Bluetooth operation check and Bluetooth information writing are necessary. Refer to
"DESTINATION SETTING METHOD" on page 4, "BLUETOOTH FUNCTION CHECKING METHOD USING
A CELLULAR PHONE" on page 7 and "BLUETOOTH INFORMATION WRITING METHOD" on page 8.
When indicating parts by reference num-
ber, please include the board name.
Ref. No. Part No. Description
C313 1-164-866-11 CERAMIC CHIP 47PF
C314 1-118-930-11 CERAMIC CHIP 10uF
C315 1-164-866-11 CERAMIC CHIP 47PF
* C316 1-116-735-11 CERAMIC CHIP 1uF
* C317 1-116-735-11 CERAMIC CHIP 1uF
* C318 1-116-735-11 CERAMIC CHIP 1uF
* C319 1-116-735-11 CERAMIC CHIP 1uF
* C320 1-116-735-11 CERAMIC CHIP 1uF
* C321 1-116-735-11 CERAMIC CHIP 1uF
* C322 1-116-735-11 CERAMIC CHIP 1uF
* C323 1-116-735-11 CERAMIC CHIP 1uF
C324 1-164-866-11 CERAMIC CHIP 47PF
* C325 1-116-735-11 CERAMIC CHIP 1uF
* C326 1-116-735-11 CERAMIC CHIP 1uF
C328 1-164-866-11 CERAMIC CHIP 47PF
C329 1-118-347-11 CERAMIC CHIP 0.1uF
C330 1-164-866-11 CERAMIC CHIP 47PF
C331 1-164-866-11 CERAMIC CHIP 47PF
C332 1-118-361-11 CERAMIC CHIP 0.1uF
C333 1-164-866-11 CERAMIC CHIP 47PF
C334 1-128-996-11 ELECT CHIP
C335 1-128-996-11 ELECT CHIP
C336 1-128-996-11 ELECT CHIP
C337 1-128-996-11 ELECT CHIP
C338 1-162-923-11 CERAMIC CHIP 47PF
C339 1-162-923-11 CERAMIC CHIP 47PF
C340 1-162-923-11 CERAMIC CHIP 47PF
C341 1-162-923-11 CERAMIC CHIP 47PF
C342 1-162-923-11 CERAMIC CHIP 47PF
C343 1-162-923-11 CERAMIC CHIP 47PF
C400 1-118-047-11 CERAMIC CHIP 10uF
C401 1-128-992-21 ELECT CHIP
* C402 1-116-735-11 CERAMIC CHIP 1uF
C404 1-118-386-11 CERAMIC CHIP 0.1uF
C405 1-162-923-11 CERAMIC CHIP 47PF
C406 1-124-779-00 ELECT CHIP
* C407 1-118-035-11 CERAMIC CHIP 0.1uF
C408 1-162-923-11 CERAMIC CHIP 47PF
C409 1-124-779-00 ELECT CHIP
Remark
5% 50V
10% 10V
5% 50V
10% 16V
10% 16V
10% 16V
10% 16V
10% 16V
10% 16V
10% 16V
10% 16V
5% 50V
10% 16V
10% 16V
5% 50V
10% 25V
5% 50V
5% 50V
10% 50V
5% 50V
4.7uF 20% 50V
(GS810BH)
4.7uF 20% 50V
(GS810BH)
4.7uF 20% 50V
(GS810BH)
4.7uF 20% 50V
(GS810BH)
5% 50V
5% 50V
5% 50V
5% 50V
5% 50V
5% 50V
10% 16V
(GS810BH)
47uF 20% 25V
10% 16V
(GS810BH)
10% 16V
5% 50V
10uF 20% 16V
10% 25V
(GS810BH)
5% 50V
10uF 20% 16V