Sony Ericsson K530i Working Instruction, Electrical

Sony Ericsson K530i Working Instruction, Electrical

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Working Instruction, Electrical
Applicable for K530i
CONTENTS
1
2
3
4
3/000 21-2/FEA 209 544/136 A
©
Company Internal
Sony Ericsson Mobile Communications AB
Moisture Sensitivity and Component Baking ...................................... 2
Lead-free Rework ................................................................................... 3
2.1
Lead-free Symbol .................................................................................. 3
2.2
Bottom Heat .......................................................................................... 3
2.3
Reflow Profile for BGA Rework Station ................................................. 4
2.4
Inspection .............................................................................................. 5
Replacement of components ................................................................ 6
3.1
A1200: Ray/UMTS Module.................................................................... 7
3.2
A1300: Marlin/GSM Module .................................................................. 7
3.3
B2100: Crystal 32768Hz ....................................................................... 8
3.4
B4101: Microphone ............................................................................... 8
3.5
C2217: 0.07F 3.3V Capacitor................................................................ 9
3.6
D2001: Wanda ASIC ............................................................................. 9
3.7
D2304: USB Transceiver..................................................................... 10
3.8
N1400: Combo BT/FM Module............................................................ 10
3.9
N2000: Vincenne ASIC ....................................................................... 11
3.10
N2300: USB Filter Network ................................................................. 11
3.11
N2402: 1-Bit Level Translator.............................................................. 12
3.12
N4202: ASIC Tjatte 3 .......................................................................... 12
3.13
S2500, S2511, S2512, S2513: Side Push Switches ........................... 13
3.14
V2202, V2203: P-Channel Mosfet....................................................... 13
3.15
V3102: Schotty Diode.......................................................................... 14
3.16
X1000: External Antenna Connector................................................... 14
3.17
X1001: Antenna Connector 3-pol ........................................................ 15
3.18
X2200: Battery Connector ................................................................... 15
3.19
X2301: M2 SMK Memory Card Reader............................................... 16
3.20
X2302: SIM Connector ........................................................................ 16
3.21
X2505: Main Camera Socket .............................................................. 17
3.22
X2510: VGA Camera Socket............................................................... 17
3.23
Z3100, Z3101, Z3102: LC Filter Array................................................. 18
Revision history ................................................................................... 19
Working Instruction, Electrical

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Summary of Contents for Sony Ericsson K530i

  • Page 1: Table Of Contents

    X2302: SIM Connector ................ 16 3.21 X2505: Main Camera Socket .............. 17 3.22 X2510: VGA Camera Socket............... 17 3.23 Z3100, Z3101, Z3102: LC Filter Array..........18 Revision history ................... 19 3/000 21-2/FEA 209 544/136 A © Company Internal Sony Ericsson Mobile Communications AB...
  • Page 2: Moisture Sensitivity And Component Baking

    </=30° C; 60% rh; shipped in dry pack; must be re-baked after being opened if floor life is exceeded. Parts shipped from the Sony Ericsson Parts Warehouse are most likely NOT shipped in dry pack. This means the time elapsed between placing the order and receiving the parts must be considered as time exposed to the environment.
  • Page 3: Lead-Free Rework

    ASICs. This does not include small transistors or chips, but it does include fine pitch components and BGA type components. 3/000 21-2/FEA 209 544/136 A 3(19) © Company Internal Sony Ericsson Mobile Communications AB...
  • Page 4: Reflow Profile For Bga Rework Station

    The profile for specific parts and specific equipment will vary, but the maximum temperature must not be exceeded. Table 2.3.2 Reflow zone 260°C 245°C 230°C 150°C 125°C Time [Seconds] 3/000 21-2/FEA 209 544/136 A 4(19) © Company Internal Sony Ericsson Mobile Communications AB...
  • Page 5: Inspection

    Also, lead-free solder does not flow as well as leaded solder, so some of the solder pad area may remain exposed. Good Leaded Solder Joints Good Lead-free Solder Joints 3/000 21-2/FEA 209 544/136 A 5(19) © Company Internal Sony Ericsson Mobile Communications AB...
  • Page 6: Replacement Of Components

    • Remove the Main Camera and the VGA Camera before starting repairing the board using hot air! MECHANICAL INSTRUCTIONS For all the following part replacements, disassemble and assemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/132 3/000 21-2/FEA 209 544/136 A 6(19) © Company Internal Sony Ericsson Mobile Communications AB...
  • Page 7: A1200: Ray/Umts Module

    Working Instruction, Electrical A1200: Ray/UMTS Module Use BGA Station to replace the UMTS Module. A1300: Marlin/GSM Module Use BGA Station to replace the GSM Module. 3/000 21-2/FEA 209 544/136 A 7(19) © Company Internal Sony Ericsson Mobile Communications AB...
  • Page 8: B2100: Crystal 32768Hz

    Apply a small piece of heat resistant tape to the top of the new part. NOTE: Use as little flux as possible to place the new part. Make sure flux does not get into the sound hole. 3/000 21-2/FEA 209 544/136 A 8(19) © Company Internal Sony Ericsson Mobile Communications AB...
  • Page 9: C2217: 0.07F 3.3V Capacitor

    PROTECT THE BTB CONNECTOR WITH HEAT RESISTANT TAPE Use BGA Station to replace the Capacitor. D2001: Wanda ASIC Cut the shield frames pickup area. Use BGA Station to replace the Wanda ASIC. 3/000 21-2/FEA 209 544/136 A 9(19) © Company Internal Sony Ericsson Mobile Communications AB...
  • Page 10: D2304: Usb Transceiver

    PROTECT THE SIM CONNECTOR WITH HEAT RESISTANT TAPE Use BGA Station to replace the USB Transceiver. N1400: Combo BT/FM Module Use BGA Station to replace the BT/FM Module. 3/000 21-2/FEA 209 544/136 A 10(19) © Company Internal Sony Ericsson Mobile Communications AB...
  • Page 11: N2000: Vincenne Asic

    Use BGA Station to replace the Vincenne ASIC. 3.10 N2300: USB Filter Network PROTECT THE SIM CONNECTOR WITH HEAT RESISTANT TAPE Use Hot Air Station to replace the USB Filter Network. 3/000 21-2/FEA 209 544/136 A 11(19) © Company Internal Sony Ericsson Mobile Communications AB...
  • Page 12: N2402: 1-Bit Level Translator

    Use Hot Air Station to replace the 1-Bit Level Translator. 3.12 N4202: ASIC Tjatte 3 PROTECT THE SIM CONNECTOR WITH HEAT RESISTANT TAPE Use Hot Air Station to replace the ASIC Tjatte 3. 3/000 21-2/FEA 209 544/136 A 12(19) © Company Internal Sony Ericsson Mobile Communications AB...
  • Page 13: S2500, S2511, S2512, S2513: Side Push Switches

    Cut the pickup area first and then cut the edge of the fence to gain access to the part. Use Hot Air Station to replace the P-Chanel Mosfet 3/000 21-2/FEA 209 544/136 A 13(19) © Company Internal Sony Ericsson Mobile Communications AB...
  • Page 14: V3102: Schotty Diode

    PROTECT THE CAMERA SOCKET WITH HEAT RESISTANT TAPE Use Hot Air Station to remove the External Antenna Connector Use Soldering Iron or BGA Rework Station to place a new component. 3/000 21-2/FEA 209 544/136 A 14(19) © Company Internal Sony Ericsson Mobile Communications AB...
  • Page 15: X1001: Antenna Connector 3-Pol

    Remove the label from the part in front of X2200. Use BGA Station to replace the Battery Connector. Position the nozzle in front of the part instead of over it. Place back the label. 3/000 21-2/FEA 209 544/136 A 15(19) © Company Internal Sony Ericsson Mobile Communications AB...
  • Page 16: X2301: M2 Smk Memory Card Reader

    Use BGA Station to replace the M2 Reader. 3.20 X2302: SIM Connector PROTECT THE MICROPHONE WITH HEAT RESISTANT TAPE Use BGA Station to replace the SIM Connector. 3/000 21-2/FEA 209 544/136 A 16(19) © Company Internal Sony Ericsson Mobile Communications AB...
  • Page 17: X2505: Main Camera Socket

    BATTERY CONNECTOR WITH HEAT RESISTANT TAPE Use BGA Station to replace the Main Camera Socket. 3.22 X2510: VGA Camera Socket Use BGA Station to replace the VGA Camera Socket. 3/000 21-2/FEA 209 544/136 A 17(19) © Company Internal Sony Ericsson Mobile Communications AB...
  • Page 18: Z3100, Z3101, Z3102: Lc Filter Array

    PROTECT THE BTB CONNECTOR WITH HEAT RESISTANT TAPE Use Hot Air Station to remove the LC Filter. Use Soldering Iron or Hot Air Station to place a new component. 3/000 21-2/FEA 209 544/136 A 18(19) © Company Internal Sony Ericsson Mobile Communications AB...
  • Page 19: Revision History

    Working Instruction, Electrical 4 Revision history Rev. Date Changes / Comments 2007-07-10 First release 3/000 21-2/FEA 209 544/136 A 19(19) © Company Internal Sony Ericsson Mobile Communications AB...

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