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(TG-243 BOARD (SUFFIX 23-))
Ref. No.
or Q'ty Part No.
SP Description
R365
1-208-863-81 s RES, CHIP 100 (1005)
R367
1-208-863-81 s RES, CHIP 100 (1005)
R369
1-208-863-81 s RES, CHIP 100 (1005)
R371
1-208-863-81 s RES, CHIP 100 (1005)
R373
1-208-863-81 s RES, CHIP 100 (1005)
R375
1-208-911-81 s RES, CHIP 10K (1005)
R376
1-208-863-81 s RES, CHIP 100 (1005)
R377
1-208-895-81 s RES, CHIP 2.2K (1005)
R379
1-208-895-81 s RES, CHIP 2.2K (1005)
R381
1-208-895-81 s RES, CHIP 2.2K (1005)
R383 *A 1-218-990-81 s CONDUCTOR, CHIP (1005)
R385
1-208-863-81 s RES, CHIP 100 (1005)
R387 *A 1-218-990-81 s CONDUCTOR, CHIP (1005)
R389
1-208-863-81 s RES, CHIP 100 (1005)
R391 *A 1-218-990-81 s CONDUCTOR, CHIP (1005)
R393
1-208-863-81 s RES, CHIP 100 (1005)
RB1
1-234-370-21 s RES, NETWORK 22 (1005X4)
S1
1-771-709-41 s SWITCH, SLIDE
X1
1-813-529-11 s OSCILLATOR, CRYSTAL (VCXO) 3.3
X2
1-813-530-11 s OSCILLATOR, CRYSTAL (VCXO) 3.3
1-194
-----------------------------------------
TG-243BG BOARD (SUFFIX -22) [HDC1400(UC)]
-----------------------------------------
Ref. No.
or Q'ty Part No.
SP Description
1pc
!
A-1271-237-A s MOUNTED CIRCUIT BOARD, TG-243BG
C1
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
C2
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C3
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C4
1-165-884-91 s CAP, CERAMIC 2.2MF (1608)
C5
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C6
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C7
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C8
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C9
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C10
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C11
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C12
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C13
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C14
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C15
1-165-872-21 s CAP, ELECT 47MF (5.0X6.5)
C16
1-165-872-21 s CAP, ELECT 47MF (5.0X6.5)
C17
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C18
1-165-872-21 s CAP, ELECT 47MF (5.0X6.5)
C19
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C20
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C21
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C22
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C23
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C24
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C25
1-126-395-21 s CAP, CHIP ELECT 22MF (5X5.7)
C26
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C27
1-165-884-91 s CAP, CERAMIC 2.2MF (1608)
C28
1-165-884-91 s CAP, CERAMIC 2.2MF (1608)
C29
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C30
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C31
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C34
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C35
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
C36
1-165-884-91 s CAP, CERAMIC 2.2MF (1608)
C37
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C39
1-165-872-21 s CAP, ELECT 47MF (5.0X6.5)
C40
1-165-872-21 s CAP, ELECT 47MF (5.0X6.5)
C41
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C43
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C44
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C45
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C46
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C49
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C51
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C54
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C55
1-165-884-91 s CAP, CERAMIC 2.2MF (1608)
C56
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C57
1-165-872-21 s CAP, ELECT 47MF (5.0X6.5)
C58
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C59
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C60
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C61
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C62
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C63
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C64
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C65
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C66
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
HDC1000/V2 (J, E)
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