Sony XBR-55X850D Service Manual page 195

How to disassemble HEAT SINK (BM1 board)
HOLDER, HS WS (MUF)
4-548-743-01
75": HEAT SINK (MUFF2_C)
HOLDER, (HS MUF)
4-549-188-01
XBR-55X850D/857D, 65X850D/855D/857D, 75X850D
<NOTE>
HEAT SINK are already attached to the B board for service.
If you need to disassemble HEAT SINK from B board for repair,
Please cut HOLDER,HS WS(MUF)
However, please do it carefully because some damage may be given
to the neighborhood parts or the B board itself.
When you re-assemble HEAT SINK,
Do not reuse HOLDER,HS WS. Should be replaced to new parts.
And Potting operation is necessary
Please refer SBR "New Potting TIM Operation for board repair" for details.
Ceramic FIN HEAT SINK has 2 types such as right photos.
The difference b/w FY16 New and FY15 Carry is
Size and Hole position is same.
You can use both Ceramic FIN HEAT SINK for an assembly of
BM1 board.
Push
Unhook HOLDER,(HS MUF)
Do not reuse HOLDER.
Should be replaced to new parts.
with tool (nippers) from B side of B board.
at the same time for re-assembly of HEAT SINK.
Fin Qty.
HEAT SINK(MUFF2_C)
APPENDIX-2
nipper
FY16 New FY15 Carry
HEAT SINK(MUFF_C)
4-584-547-01 4-549-395-01
Fin Qty: 9
Fin Qty: 13
195