Sony XBR-55X850D Service Manual page 194

APPENDIX-2
How to disassemble HEAT SINK (BMFW2 board)
HOLDER, HS WS (MUF)
4-548-743-01
HEAT SINK (MUFF) HEAT SINK (MUFF CP)
HOLDER, (HS MUF)
4-549-188-01
XBR-55X850D/857D, 65X850D/855D/857D, 75X850D
<NOTE>
HEAT SINK are already attached to the B board for service.
If you need to disassemble HEAT SINK from B board for repair,
Please cut HOLDER,HS WS(MUF)
However, please do it carefully because some damage may be given
to the neighborhood parts or the B board itself.
When you re-assemble HEAT SINK,
Do not reuse HOLDER,HS WS. Should be replaced to new parts.
And Potting operation is necessary
Please refer SBR "New Potting TIM Operation for board repair" for details.
Push
Push
Unhook HOLDER,(HS MUF)
Do not reuse HOLDER. Should be replaced to new parts.
with tool (nippers) from B side of B board.
at the same time for re-assembly of HEAT SINK.
nipper
194