LG -D722V Service Manual page 243

Level Location no
C10000 Capacitor,Ceramic,
6
C5130 Chip
L7500 Inductor,Wire
6
L7501 Wound,Chip
R3208
6 R5305 Resistor,Chip
R5306
Capacitor,Ceramic,
6 C4168
Chip
Connector,Termina
6 CN9100
l Block
L9910 Inductor,Multilayer,
6
L9911 Chip
R4110
6 Resistor,Chip
R5107
6 U6100 IC,Audio Codec
C6613
R2213
6 Resistor,Chip
R2214
R6613
IC,RF
6 U1500
Transceiver,4G
R5300
R5301
R5302
R6615
R6920
6 Wire Pad,Short
R6921
R7600
R9100
R9101
R9511
C1103 Inductor,Multilayer,
6
C1305 Chip
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Description P/N
EAE62685301
EAP62588001
ERHY0009505
ECCH0042302
EAG63749801
ELCH0001430
EBC61856101
EAN62691301
ERHY0009516
EAN62697301
SAFP0000401
EAP62526401
Specification
CL05A105KA5NQNC 1uF 10% 25V X5R -
55TO+85C 1005 R/TP 0.6T max. Samsung(1.0+-0.1
0.5+-0.1 0.5+-0.1) Murata (1.0+-0.05 0.5+-0.05 0.5+-
0.05) SAMSUNG ELECTRO-MECHANICS CO.,
LTD.
MAKK2016T4R7M 4.7UH 20% - 1A 1 1.05 0.38OHM
- - SHIELD 2.0X1.25X1.0 MM - R/TP TAIYO
YUDEN CO.,LTD
MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP -
ROHM.
CL21A475KACLRNC 4.7uF -10TO+10% 25V X5R -
55TO+85C 2012 R/TP 0.85+-0.1 - SAMSUNG
ELECTRO-MECHANICS CO., LTD.
HSBC-4P25-39F1 4P 2.50MM STRAIGHT DIP
T/REEL - HAN SHIN TERMINAL CO., LTD.
LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM
1.03GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.
RC0201JR-0722RL 22OHM 5% 1/20W 0603 R/TP -
YAGEO CORPORATION
WCD9302 999 999W WLCSP R/TP 55P MSM8226
Reference QCT CODEC QUALCOMM
INCORPORATED.
MCR006YZPJ222 2.2KOHM 5% 1/20W 0603 R/TP -
ROHM.
WTR1625L WTR1625L 2G/3G/4G
GSM/GPRS/EDGE,1X, 1xEV-DO ,WCDMA , TD-
SCDMA , HSPA+/DC-HSPA+ , LTE (FDD) ,TD-LTE,
164pin CSP R/TP 164P QUALCOMM
INCORPORATED.
AX3100 ATL SV_SHIPBACK,MAIN,A
LQP03TN3N3B02D 3.3NH 0.1NH - 450mA - -
0.25OHM 8GHZ 14 SHIELD - 0.6X0.3X0.3MM R/TP
MURATA MANUFACTURING CO.,LTD.
- 243 - Copyright © 2014 LG Electronics. Inc. All right reserved.
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Only for training and service purposes