TABLE OF CONTENTS
1. OPERATING INSTRUCTIONS
2-1.
2-2.
2-3.
Hood Assy Removal ..................................................................................... 2-2
2-4.
C Board Removal ......................................................................................... 2-3
2-5.
2-6.
2-7.
Optics Assy Removal ................................................................................... 2-4
2-8.
2-9.
2-10. Service Position ............................................................................................ 2-6
3-1.
Preparations .................................................................................................. 3-1
3-1-1.
3-1-2.
Equipment Used ......................................................................... 3-1
3-2.
VCOM Adjustment ...................................................................................... 3-1
3-3.
3-3-1.
3-3-2.
3-3-3.
γ W/B Adjustment ........................................................................................ 3-2
3-4.
γ Adjustment............................................................................... 3-2
3-4-1.
3-4-2.
3-4-3.
3-4-3-1. High Mode ................................................................................. 3-4
3-4-3-2. Low Mode .................................................................................. 3-4
3-5.
Adjust Item Initialize Data ........................................................................... 3-5
4. SEMICONDUCTORS
1