Stacking Modules; Module Modifications For Stacking - Texas Instruments bq77915EVM-014 User Manual

Additional Evaluation Setups
3.4

Stacking Modules

While the bq77915 EVM modules do not stack as delivered, they can be modified for a basic
demonstration of stacking by adding additional components. The resulting circuit is not ideal because the
ESD capacitors will remain across each module rather than across the pack terminals. The charge and
discharge FETs installed are 60-V rated and will normally accommodate connection of two EVMs.
Connection of more than two EVMs is not supported by the patterns on the board and is not
recommended. Before connecting the modules, the bottom and top modules must have component
additions and changes shown in
recovery detection for the upper device. Next, connect the upper board J7 to the lower board J1. Also
connect the upper board J5 pins 1 and 3 to the lower board J4 pins 1 and 3, respectively. The top board
must also have a wire connecting the BATT- pin on J2 to the PACK- pin on J9. A connection example of
the two modules is shown in
Module Reference Designator
Bottom
Top
8
bq77915 3-5S Low Power Protector Evaluation Module
Table 2 to enable the stacking inputs and support the UV load removal
Figure 5.
Table 2. Module Modifications for Stacking
R2 Install 10-MΩ resistor
R3 Install 10-MΩ resistor
R7
R8
R12 Install 10-kΩ resistor
J4
R32 Install 470-kΩ resistor
D3 Install BAS16J switching diode
R18 Install 10-kΩ resistor
J5
J6 Move shunt to pins 15 and 16
Copyright © 2018, Texas Instruments Incorporated
Action
Remove
Remove
Remove shunt
Remove shunt
SLUUBU2B – March 2018 – Revised August 2018
www.ti.com
Function
Stacking interface
UV load detect recovery
Stacking interface
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