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Chipscale-Packaged bq24165, 24166, 24167 Evaluation
The bq24165, 24166, 24167 evaluation module is a complete charger module for evaluating a compact,
flexible, high-efficiency, USB-friendly, switch-mode charge management solution for single-cell, Li-ion and
Li-polymer batteries used in a wide range of portable applications.
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SLUU497B - December 2011 - Revised June 2012
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Copyright © 2011-2012, Texas Instruments Incorporated
SLUU497B - December 2011 - Revised June 2012
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List of Tables
Chipscale-Packaged bq24165, 24166, 24167 Evaluation Modules
User's Guide
Modules
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Table of Contents
Related Manuals for Texas Instruments bq24165
Summary of Contents for Texas Instruments bq24165
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Page 1: Table Of Contents
Chipscale-Packaged bq24165, 24166, 24167 Evaluation Modules The bq24165, 24166, 24167 evaluation module is a complete charger module for evaluating a compact, flexible, high-efficiency, USB-friendly, switch-mode charge management solution for single-cell, Li-ion and Li-polymer batteries used in a wide range of portable applications. -
Page 2: Introduction
For details, see the bq24165, 24166, 24167 data sheet (SLUSAP4). bq24165, 24166, 24167 EVM Features The bq24165, 24166, 24167 evaluation module (EVM) is a complete charger module for evaluating compact, flexible, high-efficiency, USB-friendly, switch-mode battery charge and power path management solution for single-cell, Li-ion and Li-polymer battery-powered systems used in a wide range of portable applications. -
Page 3: Schematic
ICs. Regardless of the IC’s marking, the EVM was assembled with the correct part number as specified in the EVM bill of material. SLUU497B – December 2011 – Revised June 2012 Chipscale-Packaged bq24165, 24166, 24167 Evaluation Modules Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated... -
Page 4: I/O Description
IUSB2 TP11 ISET TP12 ILIM TP13 CE2 for bq24165 or TS for bq24166/167 TP14 CE1 for'bq24165 or CE for bq24166/167 Chipscale-Packaged bq24165, 24166, 24167 Evaluation Modules SLUU497B – December 2011 – Revised June 2012 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated... -
Page 5: Control And Key Parameters Setting
Max fast charge current, Battery charge current 0.550 CHRG(MAX) Operating junction temperature range, T °C SLUU497B – December 2011 – Revised June 2012 Chipscale-Packaged bq24165, 24166, 24167 Evaluation Modules Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated... -
Page 6: Test Summary
2 can simulate a battery when connected to a second power supply. Chipscale-Packaged bq24165, 24166, 24167 Evaluation Modules SLUU497B – December 2011 – Revised June 2012 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated... -
Page 7: Recommended Test Equipment Setup
8. After the preceding steps are accomplished, the test setup for HPA741 is as shown in Figure 3 SLUU497B – December 2011 – Revised June 2012 Chipscale-Packaged bq24165, 24166, 24167 Evaluation Modules Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated... -
Page 8: Recommended Test Procedure
CM#2 VM#4 VM#3 Figure 3. Original Test Setup for bq24165/166/167 EVM (HPA741) Recommended Test Procedure The following test procedure may be useful for evaluating the charger IC outside of a real system, if no battery is available to connect to the output and a simulated battery is needed. - Page 9 3. To observe battery supplement mode, apply a resistive load across SYS and GND that is higher than the maximum charge current. SLUU497B – December 2011 – Revised June 2012 Chipscale-Packaged bq24165, 24166, 24167 Evaluation Modules Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated...
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Page 10: Printed-Circuit Board Layout Guideline
7. For high-current applications, the balls for the power paths must be connected to as much copper in the board as possible. This allows better thermal performance because the board conducts heat away from the IC. Chipscale-Packaged bq24165, 24166, 24167 Evaluation Modules SLUU497B – December 2011 – Revised June 2012 Submit Documentation Feedback... -
Page 11: Bill Of Materials And Board Layout
TP16 TP5, TP6 5001 Test Point, Black, Thru Hole Color Keyed 0.100 x 0.100 inch 5001 Keystone SLUU497B – December 2011 – Revised June 2012 Chipscale-Packaged bq24165, 24166, 24167 Evaluation Modules Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated... - Page 12 BQ24167YFF IC, 2.5A, Dual-Input, Single Cell Switch-mode Li-Ion BQ24167YFF BATTERY CHARGER with Shunt, 100-mil, Black 0.100 929950-00 Chipscale-Packaged bq24165, 24166, 24167 Evaluation Modules SLUU497B – December 2011 – Revised June 2012 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated...
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Page 13: Board Layout
Bill of Materials and Board Layout www.ti.com Board Layout EXAS NSTRUMENTS Figure 4. Top Assembly Layer Figure 5. Top Layer SLUU497B – December 2011 – Revised June 2012 Chipscale-Packaged bq24165, 24166, 24167 Evaluation Modules Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated... -
Page 14: Bottom Layer
Bill of Materials and Board Layout www.ti.com Figure 6. Bottom Layer Figure 7. First Internal Layer Chipscale-Packaged bq24165, 24166, 24167 Evaluation Modules SLUU497B – December 2011 – Revised June 2012 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated... -
Page 15: Second Internal Layer
Bill of Materials and Board Layout www.ti.com Figure 8. Second Internal Layer SLUU497B – December 2011 – Revised June 2012 Chipscale-Packaged bq24165, 24166, 24167 Evaluation Modules Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated... - Page 16 Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization.
- Page 17 FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
- Page 18 Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan. Texas Instruments Japan Limited (address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan http://www.tij.co.jp...
- Page 19 FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated...
- Page 20 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
- Page 21 Компания «ЭлектроПласт» предлагает заключение долгосрочных отношений при поставках импортных электронных компонентов на взаимовыгодных условиях! Наши преимущества: Оперативные поставки широкого спектра электронных компонентов отечественного и импортного производства напрямую от производителей и с крупнейших мировых складов; Поставка более 17-ти миллионов наименований электронных компонентов; ...