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Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Screw driver
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws on mounting angle 1, and then remove mounting angle 1.
2. Remove the cover 2
3. Remove all of the inner cables.
4. Unscrew the screws on PCB 6, and then remove PCB 6..
5.
Unscrew the screws on PCB 11, and then remove PCB 11.
6.
Unscrew the screws on PCB 5, and then remove PCB 5 and lamp guide 13.
7. Remove panel 3, insulate plate 9 and outlet 12.
8.
Remove film 4 from panel 3..
9. Remove all of the labels.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations)
EL-MF877-00
Template Revision B
0
Tool Size (if
applicable)
1#
Page 2
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