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HP EliteDesk 800 G3 Disassembly Instructions Manual
HP EliteDesk 800 G3 Disassembly Instructions Manual

HP EliteDesk 800 G3 Disassembly Instructions Manual

Tower business pc
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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP EliteDesk 800 G3 Tower Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium coin
or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Acbel STD
Include the cartridges, print heads, tubes, vent
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
2
1
3
1
Page 1

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Summary of Contents for HP EliteDesk 800 G3

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 including liquids, semi-liquids (gel/paste) and toner chambers, and service stations. Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
  • Page 3 Figure 1 Press access panel latch remove access panel Figure 2 Remove the cable from the hook Figure 3 Press the latch on ODD cage Figure 4 Disconnect HDD Power cable from HDD Figure 5 Disconnect SATA cable from HDD Figure 6 Remove HDD cage EL-MF877-00 Page 3...
  • Page 4 Figure 7 Disconnect FIO USB2.0 cable from the MB Figure 8 Disconnect FIO Type A cable from the MB Figure 9 Disconnect FIO Type C cable from the MB Figure 10 Disconnect HDD SATA cable from the MB Figure 11 Disconnect PSU P2 cable from the MB Figure 12 Disconnect ODD power cable from ODD EL-MF877-00 Page 4...
  • Page 5 Figure 13 Disconnect SATA cable from ODD Figure 14 Remove the Memory card from the board Figure 15 Press the ODD’s latch on ODD cage Figure 16 Remove the ODD from ODD cage Figure 17 Disconnect SATA power cable from the MB Figure 18 Disconnect MB PSU cable from the MB EL-MF877-00 Page 5...
  • Page 6 Figure 19 Disconnect FIO LEDs/Switch cable from the MB Figure 20 Disconnect Speaker cable from the MB Figure 21 Disconnect FIO audio cable from the MB Figure 22 Disconnect CPU Power cable from the MB Figure 23 Disconnect ODD SATA cable from the MB Figure 24 Disconnect system fan cable from the MB EL-MF877-00 Page 6...
  • Page 7 Figure 25 Use PH1 screwdriver to remove system fan Figure 26 Disconnect heatsink fan cable from MB from chassis Figure 27 Use T-15 screwdriver to loose the screws and Figure 28 Use PH1 screwdriver to loose the screws and remove heatsink remove the fan Figure 29 Separate the fan from CPU heat sink Figure 30 Rotate the handle and open it up...
  • Page 8 Figure 31 Remove the CPU from the board Figure 32 Remove the battery from the system board Figure 33 Use T-15 screwdriver to loose the screws of MB Figure 34 Remove MB from chassis from board Figure 35 Remove front panel from chassis Figure 36 Use T-15 screwdriver loose the screws of FIO EL-MF877-00 Page 8...
  • Page 9 Figure 37 Remove FIO Figure 38 Use T-15 screwdriver loose the screws of speaker and remove it Figure 39 Remove the HDD from HDD cage Figure 40 Use T-15 screwdriver remove the screws on the PSU chassis Figure 41 Press the PSU’s latch on chassis Figure 42 Remove the Power supply from chassis EL-MF877-00 Page 9...
  • Page 10 Figure 43 Use Micro shear 170II to cut the cable tie Figure 44 Use PH1 screwdriver to remove screw for bottom Figure 45 Use PH1 screwdriver to remove screw for top Figure 46 Remove cover Figure 47 Use PH1 screwdriver to remove FG screw Figure 48 Use Micro shear 170II to cut the cable tie of fan EL-MF877-00 Page 10...
  • Page 11 Figure 49 Disconnect fan connector and inlet connector Figure 50 Use PH1 screwdriver to remove PCB1 screw Figure51 Use PH1 screwdriver to remove AC inlet & Fan Figure 52 Heat the solder of Electrolytic Capacitors greater screw than 2.5cm in diameter or height and remove it EL-MF877-00 Page 11 Template Revision B...